JIACO MIP Microwave-Induced Plasma Delidding System
| Brand | JIACO |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | JIACO MIP |
| Pricing | Available Upon Request |
Overview
The JIACO MIP Microwave-Induced Plasma Delidding System is a precision-engineered platform for non-destructive, atmospheric-pressure delidding of advanced semiconductor packages. Unlike conventional plasma or wet chemical methods, the MIP system employs a proprietary microwave-coupled oxygen–hydrogen plasma chemistry—operating at ambient pressure without vacuum chamber requirements—to selectively etch encapsulant and mold compounds while preserving underlying metallization, die surfaces, passivation layers, and critical failure signatures. Its core principle leverages controlled microwave energy to generate a low-temperature, high-density reactive plasma plume, enabling atomic-level material removal with minimal thermal load and zero mechanical stress. This makes it uniquely suited for failure analysis (FA) and reliability qualification workflows where integrity of silver wires (Ag), copper pillars (Cu Pillar), solder bumps, RDL structures, and sensitive compound semiconductors (e.g., GaAs, GaN) must be maintained throughout delidding.
Key Features
- Atmospheric-pressure operation—eliminates vacuum pump maintenance, chamber cycling delays, and associated downtime
- Patented O₂/H₂ plasma chemistry—avoids fluorinated gases (e.g., CF₄) that cause passivation layer degradation or metal corrosion
- Non-damaging delidding of Ag wire bonds, Au/Al/Cu interconnects, and fragile structures including WLCSP, SiP, BOAC, and fan-out WLP
- Integrated ultrasonic cleaning module—automatically removes inorganic residues post-etch without manual intervention
- Full process automation—from sample loading to final rinse and drying—with programmable recipe storage and repeatability tracking
- Preservation of native contamination, corrosion sites, EOS-induced defects, and migration pathways—critical for root-cause FA
- 70% reduction in average delidding cycle time compared to legacy RF or DC plasma systems
Sample Compatibility & Compliance
The JIACO MIP supports a broad spectrum of modern packaging architectures, including 2.5D/3D IC stacks, CoWoS, Chip-on-Board (COB), and heterogeneous integration platforms. It accommodates substrates with high-Tg laminates, glob top, underfill (DAF, FOW), clear mold compounds, and die coat materials. The system maintains structural fidelity across Cu, PCC, Ag, Au, and Al bond wires; RDL layers; solder and copper pillar bumps; SAW/BAW devices; and III-V compound dies (GaAs, GaN). All operational protocols align with industry-standard FA laboratory practices and support GLP-compliant documentation workflows. While not certified to ISO/IEC 17025 out-of-the-box, the system’s deterministic process control, audit-trail-capable software, and traceable parameter logging facilitate integration into ISO 9001- and AEC-Q200-aligned QA environments.
Software & Data Management
The embedded control interface provides intuitive recipe-based operation with adjustable plasma power, gas flow ratios, exposure duration, and ultrasonic cleaning parameters. Each run logs timestamped metadata—including operator ID, sample ID, gas composition, microwave duty cycle, and real-time chamber temperature—exportable via CSV or XML for LIMS integration. Optional software modules support FDA 21 CFR Part 11 compliance, including electronic signatures, role-based access control, and immutable audit trails. Data retention policies are configurable per organizational SOP, ensuring alignment with internal FA documentation standards and external regulatory audits.
Applications
- Electrical Overstress (EOS) and Electrostatic Discharge (ESD) failure localization
- Corrosion and ionic contamination analysis in humidified or biased-HAST-conditioned samples
- Metal migration studies in high-voltage or high-temperature operating lifetime tests
- Validation of underfill adhesion integrity and void distribution in flip-chip assemblies
- Post-reliability testing delidding for cross-sectional SEM/EDS correlation
- Qualification of new mold compound formulations and die attach materials
- Reverse engineering of advanced heterogeneous packages (e.g., SiP, chiplet-based designs)
FAQ
Does the JIACO MIP require vacuum pumping during operation?
No—it operates exclusively at ambient atmospheric pressure, eliminating vacuum pumps, seals, and related maintenance.
Can the system delid packages containing silver wire bonds without thinning or embrittlement?
Yes—its low-thermal, non-oxidizing plasma chemistry preserves Ag wire geometry, ball shear strength, and interfacial adhesion.
How does MIP compare to traditional CF₄-based plasma delidding in terms of surface damage?
CF₄ generates aggressive fluorine radicals that attack SiO₂ passivation and corrode Al pads; MIP’s O₂/H₂ chemistry avoids halogen species entirely, yielding chemically inert residue-free surfaces.
Is operator training required to achieve consistent results?
Minimal—pre-validated recipes cover >95% of common package types; advanced users may fine-tune parameters via the engineering mode with full calibration traceability.
What documentation support is available for ISO or IATF audit readiness?
Comprehensive validation documentation (IQ/OQ/PQ templates), calibration certificates, and software verification reports are provided upon request to support quality system compliance.
