Kingsemi KS-CF300/200-8SR Fully Automated Wet Scrubber System

Overview

The Kingsemi KS-CF300/200-8SR Fully Automated Wet Scrubber System is an engineered solution for post-process wafer cleaning in advanced semiconductor fabrication facilities. It operates on a dual-stage wet scrubbing principle—combining precision fluid dynamics, controlled mechanical contact, and targeted chemical delivery—to remove particulate contamination (≥0.1 µm), residual photoresist, metal ions, and organic residues from the frontside, backside, and bevel edge of silicon, SOI, compound semiconductor (e.g., GaN, SiC), and advanced packaging wafers up to 300 mm diameter. The system employs a proprietary two-fluid nozzle architecture that atomizes deionized water (DIW) and process chemicals (e.g., SC1, SC2, HF-diluted solutions) under precisely regulated pressure and flow rate, generating high-shear micro-jets without inducing electrostatic discharge (ESD) or surface shear stress beyond safe thresholds (<5 mN/mm²). This enables sub-micron particle removal while preserving critical pattern fidelity—particularly for sub-28 nm node devices with high-aspect-ratio features.

Key Features

• Modular dual-chamber design supporting independent frontside/backside or sequential edge-bevel cleaning protocols
• ESD-safe fluid path architecture with grounded anti-static PFA and PVDF piping; all wetted components certified to SEMI F57 standards
• Low-contact flip unit featuring three-point ceramic bearing support—reducing wafer contact area by >65% versus conventional chuck-based handlers
• High-precision rotational scrub modules with programmable speed (10–300 rpm), torque control (0.05–2.5 N·m), and real-time load monitoring
• Custom-engineered polymeric brush assemblies with graded bristle stiffness (Shore A 30–70) for selective mechanical action on topography-sensitive layers
• Integrated high-pressure DIW spray nozzles (up to 12 bar) with pulse-width modulation for localized residue dislodgement without film delamination
• Full digital parameter display (flow rate, temperature, RPM, chemical concentration, dwell time) with timestamped logging to industrial PC
• SECS/GEM-compliant communication stack enabling seamless integration into factory-wide MES and AMHS environments

Sample Compatibility & Compliance

The KS-CF300/200-8SR accommodates standard 200 mm and 300 mm wafers—including thin wafers (≤775 µm), warped wafers (TTV ≤ 40 µm), and temporary bonded substrates. It supports both bare silicon and patterned wafers with dielectric stacks (SiO₂, SiNₓ, low-k), metal films (Cu, Al, Co, Ru), and hard masks (TaCN, TiN). All process recipes are configurable per lot and traceable via unique wafer ID mapping. The system conforms to SEMI S2/S8 safety guidelines, meets CE machinery directive requirements (2006/42/EC), and provides audit-ready electronic records aligned with GLP and GMP principles. Optional 21 CFR Part 11-compliant software package available for regulated R&D and pilot-line applications.

Software & Data Management

The embedded control software runs on a real-time Linux OS with deterministic I/O response (<10 ms cycle time). Users define multi-step cleaning sequences—including pre-rinse, chemical dispense, scrub duration, megasonic assist (optional add-on), post-rinse, and spin-dry—via an intuitive touchscreen HMI. Every parameter change triggers automatic version-controlled recipe archiving. Process data—including flow sensor outputs, motor current signatures, temperature gradients, and chemical conductivity readings—is streamed to the host industrial PC with millisecond-level timestamping. Export formats include CSV, XML, and OPC UA—enabling direct ingestion into statistical process control (SPC) platforms such as JMP, InfinityQS, or custom Python-based analytics pipelines.

Applications

• Post-furnace cleaning after thermal oxidation or diffusion processes
• Residue removal following CVD/PVD deposition—especially for conformal metal nitride barrier layers
• Post-CMP slurry and silica particle clearance with minimal dishing or erosion
• Post-dry etch polymer and sidewall passivation removal prior to metrology or inspection
• Backside contamination control for wafer-level packaging (WLP) and through-silicon via (TSV) processes
• Bevel edge cleaning to prevent edge exclusion defects and improve lithographic overlay accuracy

FAQ

Does the system support both batch and single-wafer processing modes?

Yes—the KS-CF300/200-8SR operates exclusively in single-wafer mode to ensure process uniformity and minimize cross-contamination risk across high-value lots.
Can it integrate with existing fab automation infrastructure?

Standard configuration includes SECS/GEM interface; optional EAP and OHT dispatch modules are available for full AMHS interoperability.
What level of particle removal efficiency is validated for 0.1 µm particles?

Independent third-party testing (per SEMI F39) demonstrates ≥99.98% removal efficiency for monodisperse latex spheres (MLS) at 0.1 µm on bare Si wafers under optimized SC1+scrub protocol.
Is remote diagnostics and predictive maintenance supported?

Yes—embedded telemetry enables secure cloud-based health monitoring, fault signature analysis, and scheduled component life-cycle alerts via optional Kingsemi Remote Support Portal.