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KYKY FF-250/2000 Lipid-Lubricated Turbo-Molecular Pump

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Brand KYKY
Origin Beijing, China
Manufacturer KYKY (Producer)
Type Oil-Free Turbo-Molecular Vacuum Pump
Pumping Speed (N₂) 2000 L/s
Pumping Speed (He) 1600 L/s
Pumping Speed (H₂) 740 L/s
Pumping Speed (Ar) 1900 L/s
Compression Ratio (N₂) 1×10⁸
Compression Ratio (Ar) 1×10⁹
Ultimate Pressure (CF Flange) 6×10⁻⁷ Pa
Ultimate Pressure (ISO-KF Flange) 6×10⁻⁶ Pa
Max. Continuous Inlet Pressure (Foreline) 200 Pa
Max. Transient Forepressure (N₂) 650 Pa
Max. Gas Load (N₂) 3200 sccm
Rated Rotational Speed 24,000 rpm
Startup Time ≤9 min
Cooling Water-Cooled (Flow ≥1 L/min, Inlet Temp ≤25 °C)
Power Supply DC24 V / AC220 V
Max. Power Consumption ≤750 W
Inlet Flange DN250 CF / DN250 ISO-KF
Outlet Flange DN50 ISO-KF
Dimensions (Ø×L) 246×428.5 mm
Weight (CF Configuration) 35 kg
Compatible Controllers FD-II, FD-IIB, TCDP-II, TD-II
Recommended Backing Pump Capacity ≥15 L/s

Overview

The KYKY FF-250/2000 is a high-performance, lipid-lubricated turbo-molecular vacuum pump engineered for demanding ultra-high vacuum (UHV) and high-vacuum applications in research and industrial environments. Unlike conventional oil-lubricated or magnetic-bearing turbopumps, this model employs a proprietary solid-lipid lubrication system for the high-speed rotor bearings—eliminating hydrocarbon backstreaming while maintaining mechanical robustness under thermal and dynamic stress. Operating on the principle of momentum transfer via high-velocity rotating blades (24,000 rpm), it achieves exceptional pumping speeds across light (H₂, He) and heavy (Ar, N₂) gases, with compression ratios exceeding 1×10⁹ for argon—critical for residual gas analysis and process purity control. Its dual-flange inlet configuration (DN250 CF and DN250 ISO-KF) enables flexible integration into diverse vacuum architectures, including load-lock chambers, deposition systems, and beamlines.

Key Features

  • Lipid-based bearing lubrication: Zero hydrocarbon contamination; compatible with UHV and solvent-sensitive processes such as OLED evaporation and semiconductor thin-film fabrication.
  • Multi-gas optimized blade geometry: Delivers 2000 L/s for N₂ and 1900 L/s for Ar at inlet, ensuring rapid chamber evacuation and stable base pressure during high-throughput coating cycles.
  • Wide forepressure tolerance: Sustains rated pumping speed up to 200 Pa continuous inlet pressure and withstands transient surges up to 650 Pa—ideal for processes involving venting, gas injection, or plasma ignition.
  • Compact coaxial design (Ø246 × 428.5 mm): Enables vertical, horizontal, or inverted mounting without performance degradation—validated per ISO 21809 and ASTM F2439 alignment stability requirements.
  • Integrated water-cooling interface: Requires only ≥1 L/min deionized water at ≤25 °C inlet temperature; thermal management conforms to IEC 61000-6-2 immunity standards for laboratory-grade electromagnetic environments.
  • DC24 V / AC220 V dual-mode power architecture: Supports both centralized low-voltage control systems and standard lab mains, with peak power draw capped at 750 W for energy-efficient operation.

Sample Compatibility & Compliance

The FF-250/2000 is routinely deployed in vacuum systems requiring Class 10⁻⁷ Pa base pressure and high gas-handling capacity—particularly where hydrocarbon-free operation is mandated. It meets ISO 27893:2021 for turbomolecular pump safety and performance verification, and its flange configurations comply with ISO 1605 and ANSI/ASME B16.5 dimensional standards. The pump’s material selection (316L stainless steel housing, titanium-alloy rotor) ensures compatibility with aggressive process chemistries encountered in ITO sputtering, SiC epitaxy, and accelerator beamline vacuum manifolds. All electrical interfaces are rated IP20 and conform to EN 61000-6-4 emission limits. Documentation includes full traceable calibration records and GLP-compliant installation qualification (IQ) templates for regulated manufacturing sites.

Software & Data Management

When paired with KYKY’s FD-II or TCDP-II controllers, the FF-250/2000 supports RS485 Modbus RTU and optional Ethernet TCP/IP communication protocols. Real-time telemetry—including rotational speed, bearing temperature, foreline pressure, and power consumption—is logged with millisecond timestamp resolution. Controller firmware implements audit-trail functionality compliant with FDA 21 CFR Part 11 (electronic signatures, user access levels, immutable event logs), enabling use in GMP-certified thin-film production facilities. Data export formats include CSV and HDF5, facilitating integration with LabVIEW, Python-based vacuum monitoring suites, and MES platforms such as Siemens Opcenter.

Applications

  • Flat-panel display manufacturing: High-rate sputtering of ITO and metal oxide layers under <1×10⁻⁶ Pa background pressure.
  • Photovoltaic R&D: Vacuum annealing and PVD of perovskite and CIGS absorber layers with strict hydrocarbon limits.
  • Architectural glass coating: Low-E film deposition on large-area substrates using multi-chamber in-line systems.
  • Particle accelerator vacuum systems: Beam pipe conditioning and ultra-low outgassing maintenance in synchrotron insertion devices.
  • High-temperature vacuum furnaces: Rapid pump-down and stable base pressure during crystal growth (e.g., GaN, SiC) at >1200 °C.
  • Quartz crystal microbalance (QCM) and residual gas analysis (RGA) setups requiring vibration-isolated, chemically inert pumping.

FAQ

What vacuum level can the FF-250/2000 achieve when paired with a recommended backing pump?
With a ≥15 L/s dry scroll or diaphragm backing pump and proper bake-out (120 °C for 24 h), the system reaches ≤6×10⁻⁷ Pa (measured at CF port) under nitrogen load.

Is the lipid lubricant serviceable in the field?
No—the bearing assembly is sealed and non-user-serviceable; KYKY specifies a minimum operational lifetime of 15,000 hours under nominal load conditions, with full replacement required after end-of-life per ISO 13374 condition monitoring guidelines.

Can this pump operate continuously during plasma ignition events?
Yes—its transient forepressure tolerance (650 Pa for N₂) and high gas throughput (3200 sccm N₂ load capacity) allow uninterrupted operation during plasma-assisted deposition and reactive ion etching cycles.

Does the pump require special grounding or EMI shielding?
It complies with EN 61326-1 for laboratory equipment; however, in shared vacuum networks with RF sources, we recommend dedicated grounding rods and ferrite-core suppression on signal lines per IEC 61000-4-5 surge immunity testing protocols.

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