LEI-TECH LK-CJS220 & LK-CJS330 Extended Depth-of-Field 3D Digital Microscopy Systems

Overview

The LEI-TECH LK-CJS220 and LK-CJS330 Extended Depth-of-Field (EDF) 3D Digital Microscopy Systems are engineered for high-fidelity surface topography visualization and non-contact dimensional metrology in industrial quality control, materials science research, and failure analysis laboratories. Unlike conventional optical microscopes limited by shallow depth of field at high magnifications, these systems employ real-time focus-stacking algorithms combined with precision Z-axis motorized stage control (LK-CJS330) or fixed-focus EDF image synthesis (LK-CJS220) to generate fully focused composite images across variable sample heights. The core measurement principle integrates calibrated pixel-to-micron mapping with sub-pixel edge detection and stereo-height reconstruction—enabling quantitative 3D surface profiling without interferometric hardware. Both models support integration with standard C-mount reflective optical platforms—including metallurgical, stereoscopic, and monocular microscopes—making them modular upgrades for existing microscopy infrastructure.

Key Features

• LEI-TECH LK-CJS220: Standalone EDF imaging module with integrated 10× objective calibration; achieves ≤2 µm 2D/3D measurement accuracy; operates independently of PC via embedded processing unit; supports C-mount interface compatibility with reflective microscopes.
• LEI-TECH LK-CJS330: All-in-one digital microscope workstation featuring 16×–160× continuous zoom optics, real-time auto-focus (≤1 s full-frame), and dynamic wide-dynamic-range (WDR) imaging for glare suppression on metallic or specular surfaces.
• Real-time extended depth-of-field (EDF) rendering eliminates focal plane ambiguity during inspection of stepped, tilted, or rough-surfaced specimens—critical for PCB solder joint evaluation, filter media pore structure analysis, and coinage surface relief quantification.
• Z-axis measurement resolution ≤50 µm; repeatability ≤5 µm under controlled environmental conditions (ISO 25178-6 compliant test setup); supports point, line, area, step height, and volume calculations.
• Mouse-driven UI with no keyboard or external peripherals required; intuitive workflow navigation for acquisition, annotation, measurement, and report generation.

Sample Compatibility & Compliance

These systems accommodate opaque, reflective, and semi-transparent samples commonly encountered in metallurgy, electronics manufacturing, geology, and biomedical device inspection. Compatible specimen types include polished metal cross-sections, MEMS components, filtration membranes (e.g., melt-blown polypropylene used in N95 respirators), machined surfaces, and engraved currency substrates. The optical path is optimized for Köhler illumination alignment and complies with ISO 10934-1 (optical microscopy terminology) and ISO 21245 (digital microscopy data integrity). Measurement traceability aligns with VDI/VDE 2634 Part 2 guidelines for optical 3D measuring systems. While not FDA-cleared as a medical device, the software architecture supports audit trail logging and user access controls suitable for GLP/GMP environments when deployed with validated SOPs.

Software & Data Management

Both models run LEI-TECH’s proprietary MicroVision Pro™ software suite, which provides DICOM-compliant image export (JPEG, TIFF, PNG), CSV-based coordinate data output, and automated PDF/Excel report generation including annotated screenshots, measurement tables, and statistical summaries (mean, SD, min/max). The LK-CJS330 includes timestamped metadata embedding (acquisition time, objective ID, magnification, calibration file hash) for full data provenance. Software supports multi-user role configuration (Operator, Supervisor, Administrator) and optional 21 CFR Part 11 compliance mode with electronic signatures, session lockout, and immutable audit logs—configurable per institutional IT policy requirements.

Applications

• Surface roughness and step-height characterization of machined or etched components (e.g., semiconductor wafers, injection-molded plastic housings).
• Non-destructive verification of filtration media fiber distribution, pore size uniformity, and layer thickness consistency in respiratory protective equipment.
• Dimensional validation of embossed features on banknotes, security documents, and precision stampings.
• Failure analysis of solder voids, wire bond lift-off, and conformal coating coverage on printed circuit assemblies.
• Educational use in materials engineering labs for comparative topographic analysis of corrosion patterns, grain structures, and phase distributions.

FAQ

Can the LK-CJS220 be used with my existing metallurgical microscope?
Yes—it connects directly via standard C-mount interface and requires no mechanical modification to the host microscope.
Does the LK-CJS330 require periodic recalibration?
No re-calibration is needed when switching between magnifications or focus modes due to its geometrically referenced optical train and factory-installed calibration matrix.
Is raw image data accessible for third-party analysis?
Yes—stacked focus images, Z-maps, and coordinate datasets are exported in open formats (TIFF, CSV) without proprietary codec dependencies.
What environmental conditions affect Z-axis measurement accuracy?
Ambient temperature fluctuations >±2°C/hour or vibration exceeding ISO 2382-1 Class 2 may degrade repeatability; recommended operating range: 15–25°C, <60% RH, anti-vibration table mounting.
How is software validation supported for regulated industries?
LEI-TECH provides IQ/OQ documentation templates, calibration certificate records, and change control logs upon request—aligned with ASTM E2500 and EU Annex 11 expectations.