Midas SPIN150X High-Performance Desktop Spin Coater (Germany-Made)
| Brand | Midas |
|---|---|
| Origin | Germany |
| Model | SPIN150X |
| Max. Rotation Speed | 12000 rpm |
| Speed Accuracy | ±1 rpm |
| Max. Acceleration | 30000 rpm/s |
| Substrate Diameter | up to 160 mm (6") |
| Chamber Diameter | 202 mm |
| Controller Memory | 50 programs × 99 steps each |
| Programmable Outputs | 2 dry-contact relays |
| Dimensions (W×D×H) | 275 × 240 × 450 mm |
| Housing Material | Natural Polypropylene (NPP) or PTFE options |
| Sample Compatibility | 5 mm to 160 mm round wafers or 4" × 4" square substrates |
Overview
The Midas SPIN150X is a precision-engineered, Germany-manufactured desktop spin coater designed for high-fidelity thin-film deposition in semiconductor fabrication, MEMS development, photovoltaics R&D, and advanced materials laboratories. Operating on the principle of centrifugal force-driven fluid dispersion, the system uniformly distributes photoresists, polymers, sol-gel precursors, and functional coatings onto flat substrates via controlled rotational acceleration and deceleration profiles. Its servo-motor-driven architecture ensures mechanical stability at speeds up to 12,000 rpm with minimal vibration—critical for achieving sub-micron thickness uniformity (±1.5% across 150 mm wafers under optimized conditions). The instrument complies with IEC 61000-6-2 (EMC immunity) and IEC 61000-6-4 (EMC emission) standards, and its sealed NPP or PTFE chamber construction meets ISO Class 5 cleanroom compatibility requirements when integrated into laminar flow hoods.
Key Features
- High-speed servo motor with closed-loop feedback control, delivering ±1 rpm speed accuracy and programmable acceleration/deceleration rates up to 30,000 rpm/s
- Modular chamber design featuring chemically inert Natural Polypropylene (NPP) as standard; optional PTFE-lined variant for aggressive solvents (e.g., HF-based etchants, concentrated HNO₃, piranha solutions)
- Dual-vacuum chuck configuration supporting both 5–160 mm round wafers and 4″ × 4″ square substrates; vacuum ports independently controllable for mixed-size batch processing
- Digital PID controller with non-volatile memory storing 50 user-defined protocols, each containing up to 99 sequential steps (speed, time, ramp rate, valve timing)
- Front-panel touchscreen interface with glove-compatible operation, tactile feedback, and real-time parameter visualization (actual vs. setpoint RPM, elapsed time, step progress)
- Two programmable dry-contact relay outputs for synchronized interfacing with external dispensing systems, exhaust scrubbers, or inline metrology tools
- Seamless chamber geometry with zero crevices—eliminates residue accumulation and enables rapid solvent recovery and cross-contamination prevention
Sample Compatibility & Compliance
The SPIN150X accommodates substrates ranging from microfluidic chips (5 mm) to 6-inch (160 mm) silicon wafers, glass slides, quartz masks, and flexible polymer foils. Its chamber diameter of 202 mm provides ample radial clearance for edge-bead removal nozzles and dynamic dispense arms. All wetted surfaces conform to USP Class VI biocompatibility testing for NPP variants and ASTM D4894-18 for PTFE chemical resistance classification. The system supports GLP/GMP-aligned process documentation through optional RS-232/RS-485 serial logging and timestamped audit trails compatible with FDA 21 CFR Part 11-compliant data management platforms.
Software & Data Management
While the SPIN150X operates autonomously via its embedded controller, it supports ASCII-based command protocol (SCPI-like syntax) for integration into factory automation environments (SECS/GEM, CIM). Optional PC software (MidasSpinControl v3.x) enables remote parameter upload/download, real-time monitoring via USB-C or Ethernet, and CSV export of full run logs—including instantaneous RPM, vacuum pressure, and relay state transitions. All firmware updates are digitally signed and validated prior to installation, ensuring traceability per ISO/IEC 17025 clause 5.9.4.
Applications
- Photoresist spin-coating for UV lithography (g-line, i-line, KrF, ArF) with thickness control from 50 nm to 5 µm
- Spin-casting of perovskite precursor layers in solar cell R&D
- Uniform deposition of PEDOT:PSS, graphene oxide, and metal-organic frameworks (MOFs) for sensor development
- Post-lithography rinse-and-spin drying to minimize watermark formation
- Chemical mechanical planarization (CMP) slurry conditioning and particle dispersion studies
- MEMS packaging adhesive patterning using thermosetting epoxies and benzocyclobutene (BCB)
FAQ
Does the SPIN150X support automated dispense synchronization?
Yes—via two user-configurable dry-contact relay outputs that can trigger syringe pumps, solenoid valves, or piezoelectric dispensers with microsecond-level timing resolution.
Is PTFE chamber conversion available post-purchase?
Yes—field-upgrade kits include PTFE chamber liner, vacuum seal gaskets, and recalibration certificate; installation requires certified Midas service technician.
Can the controller store process parameters for audit purposes?
Yes—the internal flash memory retains all executed program IDs, timestamps, operator IDs (if configured), and final speed/torque diagnostics for ≥10,000 cycles without external storage.
What maintenance intervals are recommended for long-term reliability?
Vacuum pump oil change every 6 months; chuck cleaning with IPA after each resist type change; annual calibration verification against NIST-traceable tachometer and vacuum gauge standards.
Is the SPIN150X compatible with Class 100 cleanroom environments?
When operated inside ISO 5 laminar flow cabinets and equipped with HEPA-filtered exhaust ducting, the unit meets SEMI S2-0215 safety and particle emission requirements for front-end semiconductor tools.
