QiaoBang XAD Multi-Channel Capillary X-Ray Fluorescence Thickness Analyzer
| Brand | QiaoBang Instrument |
|---|---|
| Origin | Jiangsu, China |
| Model | XAD |
| Price Range | USD 125,000 – 210,000 |
| Measurement Principle | Total External Reflection X-Ray Fluorescence (TXRF) with Multi-Channel Capillary Optics |
| Minimum Spot Size | 10 µm |
| Excitation Intensity Gain | 10²–10³× vs. conventional collimators |
| Compliance | ASTM F1689, ISO 3497, IPC-4552A, USP <232>/<233>, GLP/GMP-ready data audit trail |
Overview
The QiaoBang XAD Multi-Channel Capillary X-Ray Fluorescence Thickness Analyzer is an advanced benchtop TXRF-based metrology system engineered for non-destructive, quantitative analysis of ultra-thin metallic and alloy coatings—down to sub-nanometer thicknesses—on microscale features. Unlike conventional energy-dispersive XRF (EDXRF) systems relying on pinhole collimation or polycapillary focusing with single-channel optics, the XAD integrates a proprietary multi-channel glass capillary optic that guides primary X-rays via total external reflection along curved internal surfaces. This architecture enables efficient beam transport, spatial confinement, and intensity amplification—delivering up to three orders of magnitude higher photon flux at the sample surface compared to standard collimated sources. The result is exceptional signal-to-noise ratio for trace-layer quantification in high-aspect-ratio structures, such as electroplated Cu/Ni/Au stacks on redistribution layers (RDLs), under-bump metallization (UBM), and wafer-level packaging substrates.
Key Features
- Multi-channel capillary optic with <10 µm focal spot diameter—enabling precise interrogation of microvias, solder bumps, and fine-pitch interconnects.
- High-intensity TXRF excitation mode optimized for low-Z to mid-Z elements (Na–Pd), supporting simultaneous thickness and composition analysis of multi-layer stacks (e.g., NiV/Cu/SnAg, TiW/Cu/Au).
- Motorized XYZ stage with 0.1 µm resolution and programmable trajectory control—compatible with automated batch measurement of PCB panels up to 600 × 600 mm.
- Integrated high-magnification optical microscope (5–200×) with real-time digital imaging and sub-micron feature recognition—supporting auto-positioning based on fiducial markers or edge detection.
- Robust mechanical design with vibration-damped optical bench and temperature-stabilized X-ray tube housing—ensuring long-term repeatability (<0.8% RSD for 5 nm Au over 8-hour operation).
- Fully compliant firmware architecture supporting 21 CFR Part 11 audit trails, electronic signatures, and configurable user access levels for regulated environments.
Sample Compatibility & Compliance
The XAD accommodates rigid and flexible substrates including silicon wafers (up to 300 mm), ceramic packages, FR-4 and polyimide-based flex PCBs, and bare die with minimal surface preparation. Its low-power X-ray source (50 W, Rh or Mo anode) and grazing-incidence geometry minimize radiation damage to organic layers and photoresists. Analytical validation follows industry standards including ASTM F1689 (standard test method for measuring metal coating thickness by XRF), ISO 3497 (electroplated coatings—measurement of coating thickness by X-ray spectrometry), and IPC-4552A (specification for electrolytic plating of copper for printed wiring boards). Method transfer documentation, uncertainty budgets per GUM (JCGM 100), and IQ/OQ/PQ protocols are provided for GLP and GMP implementation.
Software & Data Management
QiaoBang’s XAD Control Suite v4.2 offers intuitive workflow-driven operation—from automated recipe setup to statistical process control (SPC) charting. Each measurement includes full spectral acquisition (1–20 keV range), background-subtracted net peak integration, matrix correction using fundamental parameters (FP), and layer-by-layer deconvolution for up to five sequential layers. Raw spectra, calibration logs, and operator metadata are stored in encrypted SQLite databases with timestamped revision history. Export formats include CSV, PDF reports (with embedded spectra), and XML for LIMS integration. All software modules undergo annual third-party verification against NIST SRM 2135c (Au/Ni/Cu on Si) and certified reference materials from BAM (Germany).
Applications
- Thickness and composition mapping of electroplated Au, Pd, Ni, Sn, and Cu layers on bump pads and RDLs in advanced IC packaging.
- In-line QA/QC of thin-film seed layers (<50 nm) in semiconductor front-end-of-line (FEOL) processes.
- Quantitative analysis of selective electroless Ni–P deposits on laser-drilled microvias in HDI PCBs.
- Verification of conformal coating uniformity across heterogeneous substrates—such as chip-on-flex assemblies with mixed metal/organic topographies.
- Failure analysis support for delamination, voiding, or compositional drift in UBM stacks during thermal cycling reliability testing.
FAQ
What is the minimum measurable thickness for gold using the XAD system?
For Au on Si or Ni substrates, the practical detection limit is 0.3 nm (3 Å) with 300 s acquisition time and optimized TXRF geometry.
Does the system require vacuum or helium purge for light-element analysis?
No—air-path operation is sufficient for elements Na and heavier; optional He flush module available for enhanced sensitivity to Mg–Al in specialized applications.
Can the XAD perform depth profiling of multi-layer stacks?
Yes—by combining variable take-off angle measurements with FP modeling, it supports non-destructive estimation of layer sequence and interdiffusion in bilayer/multilayer systems.
Is remote diagnostics and software update supported?
Yes—secure TLS-encrypted remote access is enabled via optional maintenance subscription, with version-controlled firmware updates and log-based troubleshooting.
How is measurement uncertainty quantified and reported?
Uncertainty is calculated per ISO/IEC Guide 98-3 (GUM) using Type A (repeatability) and Type B (calibration, model assumptions) components, with expanded uncertainty (k=2) reported in all official certificates.
