Thermal Shock Test Chamber Manufacturer – OK-TS Series Industrial Thermal Cycling Test System
| Brand | Other Brands |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Temperature Range | −70 °C to +150 °C |
| Temperature Uniformity | ≤ ±2 °C |
| Temperature Fluctuation | ±0.5 °C |
| Humidity Range | 30–98% RH |
| Humidity Deviation | +2 / −3% RH |
| Avg. Ramp Rate | 0.7–1.0 °C/min |
| Time Setting Range | 0–9999 h |
| Power Supply | AC 380 V |
| Internal Dimensions (W×D×H, mm) | 400×500×400 (OK-TS-100) to 1000×1000×1000 (OK-TS-1000) |
| External Dimensions (W×D×H, mm) | 1200×1650×1100 (OK-TS-100) to 1900×2100×1850 (OK-TS-1000) |
| Observation Window | Ø50 mm test port & illuminated tempered glass viewport |
Overview
The OK-TS Series Thermal Shock Test Chambers are engineered for precise, repeatable evaluation of material and component reliability under rapid, extreme temperature transitions. Based on the two-chamber (hot/cold) or single-chamber (air-shutter) thermal shock principle, these systems subject test specimens to abrupt shifts between predefined high- and low-temperature zones—enabling accelerated stress testing of solder joints, encapsulants, PCB assemblies, aerospace composites, automotive electronics, and polymer-based packaging. Designed in compliance with international environmental testing standards—including IEC 60068-2-14 (Test N: Change of Temperature), MIL-STD-810H Method 503.5, and JESD22-A104—each chamber delivers controlled thermal cycling profiles essential for qualification testing, failure mode analysis, and design validation in R&D and production QA environments.
Key Features
- Modular chamber architecture with independent hot and cold zones (−70 °C to +150 °C), enabling programmable dwell times, transfer times (<15 s typical), and cycle counts up to 9999
- High-strength SUS304 stainless steel interior lining and A3 steel exterior with electrostatic powder coating for corrosion resistance and long-term dimensional stability
- Illuminated, double-layered tempered glass observation window with embedded heating element to prevent condensation and ensure unobstructed visual monitoring
- Standard Ø50 mm cable/port access with silicone gasket sealing, compatible with external power supplies, thermocouple feeds, and real-time sensor telemetry
- CNC-machined structural frame ensuring mechanical rigidity, thermal isolation integrity, and minimal vibration transmission during chamber door operation
- Dual PID-controlled refrigeration system with cascade cooling (for sub-zero capability down to −70 °C) and electric heating elements with over-temperature cut-off protection
Sample Compatibility & Compliance
The OK-TS series accommodates samples ranging from small IC packages (e.g., QFN, BGA) to full-size automotive control units (ECUs) and industrial battery modules. Internal chamber volumes span 100 L to 1000 L, supporting standardized test fixtures per IPC-J-STD-020, JEDEC JESD22-A106, and ASTM D5229. All models meet CE marking requirements and are configured for optional IQ/OQ documentation packages aligned with ISO/IEC 17025 and GLP-compliant laboratory workflows. Optional humidity control (30–98% RH, ±2/−3% RH deviation) extends applicability to combined thermal-hygrothermal stress protocols per IEC 60068-2-30.
Software & Data Management
Equipped with a 7-inch color touchscreen HMI running embedded Linux firmware, the system supports multi-segment ramp-soak profiles, real-time graphing of chamber setpoints and chamber/sensor feedback, and automatic logging of temperature/humidity data at user-defined intervals (1 s to 60 min). Export formats include CSV and PDF reports with time-stamped metadata. For enterprise integration, optional Ethernet/Wi-Fi connectivity enables remote monitoring via Modbus TCP or OPC UA, while audit trail functionality complies with FDA 21 CFR Part 11 requirements when paired with validated user access controls and electronic signature modules.
Applications
- Qualification of printed circuit board assemblies (PCBAs) per IPC-A-610 and IPC-J-STD-001
- Validation of thermal interface materials (TIMs), conformal coatings, and underfill adhesives under cyclic thermal strain
- Reliability screening of MEMS devices, optoelectronic sensors, and LED modules prior to field deployment
- Accelerated aging studies for lithium-ion battery cells and pack-level thermal management systems
- Material coefficient of thermal expansion (CTE) mismatch analysis in multi-layer ceramic capacitors (MLCCs) and wafer-level packaging
- Environmental stress screening (ESS) in military and avionics supply chain quality gates
FAQ
What is the minimum transfer time between hot and cold chambers?
Typical transfer time is ≤15 seconds for standard configurations; optional high-speed pneumatic transfer mechanisms reduce this to <8 seconds upon request.
Can the OK-TS series be integrated into an automated test cell?
Yes—standard digital I/O (8-in/8-out), RS-485 Modbus RTU, and optional Ethernet/IP or PROFINET interfaces support PLC-level integration and MES synchronization.
Is calibration certification included with shipment?
Each unit ships with a factory calibration report traceable to NIST standards; on-site UKAS-accredited calibration services are available as an add-on.
Does the system support humidity-controlled thermal shock testing?
Humidity control is available as a configurable option across all OK-TS-408 and larger models, meeting IEC 60068-2-30 requirements for damp heat cycling.
What safety protections are built into the chamber?
Dual independent over-temperature cutoffs, refrigerant pressure monitoring, door interlock switches, ground fault circuit interruption (GFCI), and emergency stop circuitry compliant with EN 61000-6-2 and EN 61000-6-4.
