OK-TS-80 Thermal Shock Test Chamber

Overview

The OK-TS-80 Thermal Shock Test Chamber is a three-zone (hot chamber / cold chamber / test chamber) mechanical thermal shock system engineered for high-reproducibility, rapid-transition environmental stress testing in accordance with international standards including IEC 60068-2-14, MIL-STD-810H Method 503.5, and GJB 150.5A. It operates on the principle of physical thermal shock—defined as the abrupt transfer of test specimens between two thermally stabilized zones via pneumatic air-lock doors—thereby inducing transient thermal gradients that accelerate failure mechanisms such as solder joint fracture, delamination, seal leakage, and interfacial cracking in electronic assemblies, automotive components, and aerospace materials. Unlike single-chamber rapid temperature cycling systems, the OK-TS-80 delivers true step-change exposure with verified transition times ≤15 seconds between extreme setpoints, enabling compliance with stringent “dwell-to-dwell” shock protocols where dwell stability and transfer repeatability are critical to test validity.

Key Features

• Three-compartment architecture: independently controlled hot zone (+150 °C), cold zone (−40 °C), and insulated test chamber—eliminating thermal cross-contamination during transfer cycles
• High-speed pneumatic door actuation with position feedback and fail-safe interlocks to ensure precise timing and operator safety
• Dual independent refrigeration circuits (cascade R404A/R23 system) and high-power resistive heating elements optimized for simultaneous zone stabilization
• Temperature uniformity maintained at ±2 °C across the working volume (W×D×H: 400×400×500 mm) under steady-state conditions per IEC 60068-3-5
• Programmable shock profiles supporting up to 999 cycles, variable dwell times (1 min–999 min), and automatic data logging of chamber temperatures and door status
• Industrial-grade stainless-steel interior with non-corrosive insulation, IP54-rated control cabinet, and CE-compliant electrical architecture

Sample Compatibility & Compliance

The OK-TS-80 accommodates non-powered or externally powered samples up to 20 kg, with standard mounting rails and optional load-cell integration for real-time weight monitoring during thermal stress. It supports both static and dynamic test configurations—including DUTs with active biasing—when used with external power supplies and signal feedthroughs (customizable per customer requirements). The chamber meets electromagnetic compatibility (EMC) per EN 61326-1 and is designed for operation in GLP- and ISO/IEC 17025-accredited laboratories. While not pre-certified for FDA 21 CFR Part 11, its embedded controller provides audit-trail-capable event logging (door actuations, temperature deviations, alarm triggers), and optional software modules enable full electronic record retention aligned with GxP documentation practices.

Software & Data Management

Control and monitoring are executed via the OK-TS Control Suite—a Windows-based application running on an integrated industrial PC. The interface supports multi-step program definition, real-time graphing of all three zone temperatures, and synchronized timestamped export of CSV-formatted datasets. All operational events—including door open/close timestamps, temperature excursions exceeding ±2 °C tolerance, and emergency stops—are recorded with millisecond resolution. Optional Ethernet/IP and Modbus TCP interfaces allow integration into centralized MES or SCADA environments. Data integrity safeguards include password-protected user roles (Operator, Engineer, Administrator), encrypted local database storage, and configurable auto-backup to network drives—ensuring traceability required for internal quality audits and third-party certification reviews.

Applications

• Qualification testing of PCBAs, BGAs, and wafer-level packages per JESD22-A104E (Temperature Cycling) and JESD22-A106B (Thermal Shock)
• Reliability screening of EV battery modules, power electronics, and ADAS sensors under accelerated thermal stress
• Material validation of polymer encapsulants, conformal coatings, and adhesive bonds used in harsh-environment applications
• Failure analysis root-cause investigation in conjunction with post-test X-ray CT, SAM, or cross-sectioning
• Process capability assessment of reflow soldering and underfill cure processes in contract manufacturing

FAQ

Is the OK-TS-80 capable of performing true thermal shock per IEC 60068-2-14?
Yes. Its three-zone design and pneumatic transfer mechanism achieve ≤15-second transition times between −40 °C and +150 °C, satisfying the “rapid transfer” requirement of Clause 6.2 in IEC 60068-2-14.

Can it also perform temperature cycling (thermal cycling)?
No—it is not configured for continuous linear ramping. For standardized temperature cycling (e.g., JESD22-A104), a dedicated rapid temperature change chamber (RTCC) with ≥20 °C/min ramp rate is recommended.

What is the maximum sample weight and dimensional envelope supported?
The standard test chamber accommodates loads up to 20 kg and dimensions up to 400 mm (W) × 400 mm (D) × 500 mm (H). Custom chambers with larger volumes or higher payload capacity are available upon engineering review.

Does the system support remote monitoring and alarm notification?
Yes. Optional SNMP and email alert modules provide real-time notifications for temperature deviation, door fault, or power interruption. Remote desktop access to the control PC is enabled via secure VPN configuration.

Are calibration certificates and IQ/OQ documentation provided?
Factory calibration reports (traceable to NIM, China) are included. Full Installation Qualification (IQ) and Operational Qualification (OQ) protocols—aligned with ISO/IEC 17025 Annex A—can be supplied as a value-added service upon request.