OK-TS Series Thermal Shock Test Chamber
| Brand | Other Brands |
|---|---|
| Origin | Imported |
| Manufacturer Type | General Distributor |
| Price | USD 11,200 (FOB) |
| Standards Compliance | GB/T 2423.1–2001, GB/T 2423.2–2001, GB 10589, GB 11158 |
| Chamber Volume Options | 80 L, 150 L, 225 L, 408 L, 800 L, 1000 L |
| Internal Dimensions (W×H×D) | 400×450×400 mm to 1000×1000×1000 mm |
| Interior Material | Mirror-finish 304 stainless steel |
| Exterior Material | A3 steel with epoxy powder coating |
| Control System | Digital PID programmable controller with auto-tuning and real-time tracking |
| Structural Fabrication | CNC-machined frame with ergonomic zero-backlash handles |
Overview
The OK-TS Series Thermal Shock Test Chamber is an engineered environmental simulation system designed for rapid, repeatable transitions between extreme high- and low-temperature zones to evaluate material integrity, solder joint reliability, and packaging robustness under thermal stress. Based on the two-chamber (hot/cold) or three-zone (hot/ambient/cold) forced-air thermal shock principle, the system subjects test specimens to abrupt temperature changes—typically within ≤15 seconds transfer time—enabling accelerated life-cycle assessment per IEC 60068-2-14, MIL-STD-810H Method 503.5, and JESD22-A104. Unlike steady-state temperature chambers, this instrument replicates field-induced thermal fatigue mechanisms such as intermetallic growth, coefficient-of-thermal-expansion (CTE) mismatch strain, and delamination in multilayer electronic assemblies, automotive components, aerospace composites, and medical device housings.
Key Features
- High-precision digital PID controller with adaptive auto-tuning algorithm ensures stable setpoint maintenance (±0.5 °C) and minimizes overshoot during dynamic ramping.
- CNC-machined structural frame guarantees dimensional stability and long-term mechanical repeatability across 10,000+ thermal cycles.
- Double-wall insulated chamber construction with vacuum-sealed polyurethane foam (≥120 mm thickness) delivers low heat leakage and energy-efficient operation.
- Corrosion-resistant mirror-finish 304 stainless steel interior prevents particulate shedding and supports ISO 14644-1 Class 8 cleanroom compatibility.
- Ergonomic zero-backlash door handles and reinforced silicone gaskets ensure leak-tight sealing under thermal cycling without manual torque adjustment.
- Modular chamber volume configuration—from 80 L to 1000 L—allows scalability from component-level qualification to full-system environmental stress screening (ESS).
Sample Compatibility & Compliance
The OK-TS series accommodates rigid and semi-rigid samples up to 50 kg per load, including PCBAs, IC packages (QFP, BGA, CSP), molded plastic enclosures, battery modules, optical sensors, and coated metallic substrates. All models comply with national and international environmental testing standards: GB/T 2423.1–2001 (cold testing), GB/T 2423.2–2001 (dry heat), GB 10589 (low-temperature chamber specifications), and GB 11158 (high-temperature chamber specifications). While not inherently rated for humidity control, optional integrated dehumidification modules enable combined thermal-humidity shock profiles aligned with IEC 60068-2-30. The chamber architecture supports third-party validation for GLP/GMP audit trails when paired with calibrated NIST-traceable thermocouples and external data loggers.
Software & Data Management
The embedded controller provides non-volatile program storage for up to 100 multi-step thermal shock profiles, each configurable with dwell time, ramp rate (programmable from 1 °C/min to 15 °C/min), cycle count, and alarm thresholds. Optional RS485/Modbus RTU or Ethernet TCP/IP interfaces allow integration into centralized lab management systems (LIMS) and automated test execution platforms. When used with compliant data acquisition software, the system supports 21 CFR Part 11–compliant electronic records—including user authentication, audit trail logging, and digital signature capability—for regulated industries including medical device manufacturing and automotive Tier-1 supply chain validation.
Applications
This thermal shock chamber serves critical roles in product development and quality assurance workflows: qualification of solder interconnects per IPC-J-STD-020; validation of conformal coating adhesion under thermal cycling; assessment of seal integrity in hermetically packaged MEMS devices; evaluation of thermal interface material (TIM) performance degradation; and accelerated aging of polymer-based insulation in EV battery modules. It is routinely deployed in R&D labs, contract manufacturing organizations (CMOs), and Tier-1 automotive suppliers for APQP Stage 3 verification and PPAP submission support.
FAQ
What is the typical temperature range for the OK-TS series?
Standard configurations operate from –65 °C to +150 °C; extended-range variants support –70 °C to +180 °C upon request.
Does the chamber include built-in data logging?
Yes—the controller records temperature readings at user-defined intervals (1–60 seconds) and stores up to 30 days of continuous data internally.
Can the system be validated for ISO/IEC 17025 calibration requirements?
Yes—chambers are supplied with as-delivered calibration certificates traceable to national metrology institutes; IQ/OQ documentation templates are available upon order.
Is remote monitoring supported?
Remote status viewing and basic profile initiation are supported via web browser interface when equipped with optional Ethernet module.
What maintenance is required for long-term reliability?
Quarterly inspection of refrigerant pressure, condenser coil cleaning, and annual verification of thermocouple accuracy using reference-grade dry-block calibrators are recommended.
