OK-TS Series Thermal Shock Test Chamber

Overview

The OK-TS Series Thermal Shock Test Chambers are engineered for accelerated reliability assessment of electronic components, aerospace materials, automotive ECUs, PCB assemblies, and packaging systems under rapid, repetitive thermal transitions. These two-zone air-to-air thermal shock systems operate on the principle of sequential exposure—transferring test specimens between independently controlled high-temperature and low-temperature chambers via a horizontal or vertical shuttle mechanism (model-dependent). Unlike single-chamber ramp-based thermal cycling, this design enables true step-change temperature transitions with minimal dwell time, replicating field-induced stress conditions such as solder joint fatigue, intermetallic growth, and coefficient-of-thermal-expansion (CTE) mismatch failure modes. Each chamber employs a balanced temperature and humidity control (BTSC) architecture, ensuring stable setpoint maintenance during dwell phases while minimizing thermal lag and overshoot. The system is calibrated per ISO/IEC 17025-accredited procedures and supports traceable temperature uniformity verification per IEC 60068-3-5.

Key Features

• Two independent temperature zones (hot/cold) with programmable dwell times (1 min to 999 h) and up to 999 cycles per test sequence
• High-speed transfer mechanism achieving ≤15-second transition time between chambers (e.g., +150°C ↔ −40°C), compliant with MIL-STD-810G Method 503.5
• Dual-circuit cascade refrigeration system using environmentally compliant R404A/R23 refrigerants; compressors sourced from Tecumseh or Copeland for extended service life and reduced failure rate
• TEMI880 color touchscreen controller with real-time data logging, multi-language UI (English/Chinese), and built-in USB export for CSV-formatted test reports
• Robust chamber construction: SUS304 stainless steel interior, 100 mm polyurethane insulation, dual-stage silicone door gaskets rated for −70°C to +200°C operation
• Forced convection airflow system with multi-blade centrifugal fan and top-outlet/bottom-inlet ducting ensures ±1.5°C temperature uniformity (per IEC 60068-3-5) across full working volume
• Comprehensive safety architecture including compressor overheat/overcurrent/overpressure protection, dry-run prevention for heaters and humidifiers, low-water cutoff, and chamber over-temperature cutout

Sample Compatibility & Compliance

The OK-TS series accommodates standard test specimens up to 30 kg per load, with adjustable stainless steel sample racks supporting vertical or horizontal orientation. Optional fixtures include DUT mounting plates with M4/M6 threaded inserts and thermocouple feedthroughs (φ3 mm, mineral-insulated). All models comply with international environmental testing standards including IEC 60068-2-14 (Test N: Change of Temperature), JIS Z 8702, and GB/T 2423.22. For regulated industries, the TEMI880 controller supports audit trail functionality and user-level access control (admin/operator/guest), aligning with FDA 21 CFR Part 11 requirements when deployed in GLP/GMP environments. Calibration certificates (NIST-traceable) and IQ/OQ documentation packages are available upon request.

Software & Data Management

Each chamber ships with PC-based test management software compatible with Windows 10/11. The application enables remote monitoring via Ethernet (TCP/IP), real-time graphing of chamber temperatures, automatic generation of PDF test reports with timestamped event logs (door open/close, alarm triggers, cycle completion), and export of raw data to Excel or MATLAB-compatible formats. Data integrity safeguards include cyclic redundancy check (CRC) validation, encrypted local database storage, and configurable auto-backup intervals. The RS-485 interface supports integration into centralized MES or LIMS platforms using Modbus RTU protocol.

Applications

• Qualification testing of avionics modules per DO-160 Section 4 (Temperature Variation)
• Solder joint reliability screening for lead-free assemblies (IPC-9701)
• Validation of conformal coating adhesion under thermal cycling stress
• Accelerated aging of polymer-based seals and gaskets in automotive powertrain applications
• Material compatibility testing for battery pack enclosures subjected to extreme ambient gradients
• Process validation of wafer-level packaging (WLP) and fan-out wafer-level packaging (FOWLP) structures

FAQ

What is the difference between air-to-air and liquid-to-air thermal shock testing?
Air-to-air systems like the OK-TS series use separate hot/cold air chambers and mechanical transfer—ideal for non-hermetic samples and higher temperature ranges (−70°C to +200°C). Liquid-to-air systems immerse samples in thermal baths, offering faster transitions but limiting maximum temperature and requiring sealed DUTs.
Can the chamber perform humidity-controlled thermal shock?
Standard OK-TS models are dry thermal shock chambers. Optional surface-evaporation humidifiers (max. 95% RH at +85°C) can be integrated on select variants—however, combined temp/humidity shock is not recommended per IEC 60068-2-14 due to condensation risks.
Is third-party calibration included with delivery?
Factory calibration is performed pre-shipment using NIST-traceable reference probes. A certificate of conformance is provided. ISO/IEC 17025-accredited on-site calibration and IQ/OQ services are available as optional add-ons.
What maintenance intervals are recommended?
Compressor oil and refrigerant levels should be verified annually; air filters cleaned every 3 months; door gaskets inspected quarterly for compression set; and temperature sensors recalibrated every 12 months or after 500 operational cycles.
Does the system support custom test profiles beyond standard MIL or IEC methods?
Yes—the TEMI880 controller allows creation of multi-segment profiles with variable ramp rates, dwell times, and conditional branching (e.g., “if T > 120°C, hold for 10 min, then initiate transfer”). Profiles can be imported/exported via USB drive.