TSD TMP-200S / TMP-300S Semi-Automatic Chemical Mechanical Polishing System
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-200S / TMP-300S |
| Wafer Size | 6–8 inch (TMP-200S), 8–12 inch (TMP-300S) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Wafer Backside Pneumatic Pressure | 0–700 g/cm² |
| Zone-Based Pressure Control | 3-zone (TMP-200S), 3/6-zone (TMP-300S) |
| Retainer Ring Pressure | 0–700 g/cm² |
| Loading/Unloading | Semi-automatic dual-tray (load/unload trays) |
| Conditioning | Swing-arm diamond dresser |
Overview
The TSD TMP-200S and TMP-300S are semi-automatic chemical mechanical polishing (CMP) systems engineered for precision surface planarization in semiconductor front-end and advanced packaging processes. These platforms implement the fundamental CMP principle—synergistic material removal via controlled chemical reaction (from slurry chemistry) and mechanical abrasion (via relative motion between wafer, pad, and slurry)—to achieve nanometer-level global and local uniformity across dielectric, metal (Cu, W, Co), and barrier layers. Designed for R&D labs, pilot lines, and low-to-medium volume production environments, the TMP series delivers reproducible removal rates, within-wafer non-uniformity (WIWNU) < 5%, and high process stability without requiring full cleanroom-integrated automation. The system supports both blanket and patterned wafer processing, with particular suitability for shallow trench isolation (STI), copper interconnect planarization, and through-silicon via (TSV) top-surface leveling in 2.5D/3D integration workflows.
Key Features
- Modular carrier head architecture with independent pneumatic pressure control per zone—3-zone on TMP-200S; configurable 3- or 6-zone on TMP-300S—to enable localized downforce tuning for improved edge uniformity and defect mitigation.
- Dual-speed independent drive system: programmable platen rotation (30–200 rpm) and carrier head rotation (30–200 rpm), supporting standard counter-rotational, co-rotational, and oscillatory motion profiles per process recipe.
- Integrated swing-arm diamond conditioner with programmable dwell time, traverse speed, and load—ensuring consistent pad topography renewal and long-term slurry delivery stability.
- Semi-automatic wafer handling with dedicated load and unload trays; compatible with standard FOUP/SMIF interface adapters (optional); eliminates manual wafer transfer while retaining operator oversight for process qualification runs.
- Robust stainless-steel frame with vibration-damped base and sealed bearing housings—designed for long-term operation in Class 1000–10,000 cleanroom environments.
- Real-time analog monitoring of key parameters (pressure, RPM, slurry flow rate via external metering pump interface) with RS485/Modbus RTU output for external SCADA or MES integration.
Sample Compatibility & Compliance
The TMP-200S accommodates 150 mm (6″) and 200 mm (8″) wafers; the TMP-300S extends support to 200 mm and 300 mm (12″) substrates—including silicon, SiC, GaN, glass, and compound semiconductor wafers. Compatible with standard polyurethane and fixed-abrasive polishing pads (e.g., IC1000, Suba IV, CVP series), as well as aqueous and colloidal slurries (SiO₂, CeO₂, alumina-based). All wetted components meet SEMI F57 standards for semiconductor-grade chemical resistance. System design adheres to ISO 14644-1 (cleanroom classification), IEC 60204-1 (electrical safety), and CE Machinery Directive 2006/42/EC. Optional documentation packages support GLP/GMP-aligned validation (IQ/OQ/PQ protocols) and traceability per ISO 9001:2015 requirements.
Software & Data Management
Equipped with a Windows-based HMI running TSD PoliControl™ v3.x, the system provides recipe-driven operation with up to 99 user-defined process steps per program. Each recipe stores setpoints for rotational speeds, pressure zones, conditioning cycles, and timing logic. All operational events—including start/stop timestamps, parameter deviations > ±2%, and alarm logs—are timestamped and stored locally with CSV export capability. Audit trail functionality complies with FDA 21 CFR Part 11 requirements when deployed with optional electronic signature module and networked domain authentication. Data can be exported directly to Excel or ingested into third-party SPC platforms (e.g., InfinityQS, Minitab) via OPC UA or FTP.
Applications
- Front-end-of-line (FEOL) STI oxide planarization on 28 nm–130 nm node wafers.
- Back-end-of-line (BEOL) Cu/low-k interlayer dielectric (ILD) polishing for logic and memory devices.
- Wafer-level packaging (WLP) applications including redistribution layer (RDL) planarization and bump height uniformity control.
- TSV reveal and capping layer thinning in 3D stacked DRAM and image sensor fabrication.
- R&D-scale development of novel slurry formulations and pad architectures under controlled DOE conditions.
- Failure analysis sample preparation requiring ultra-low subsurface damage and minimal dishing/erosion.
FAQ
What wafer sizes does the TMP-200S support?
The TMP-200S is configured for 150 mm (6″) and 200 mm (8″) wafers.
Can the TMP-300S be upgraded from 3-zone to 6-zone pressure control post-purchase?
Yes—hardware retrofit kits and firmware updates are available through TSD Field Service for qualified installations.
Is slurry delivery integrated, or must it be supplied externally?
Slurry metering is not built-in; the system includes standardized fluid ports and mounting brackets for third-party peristaltic or diaphragm pumps (e.g., Cole-Parmer, Watson-Marlow).
Does the system support remote diagnostics or predictive maintenance?
Remote access via secure VPN is supported; vibration and motor current trending data can be exported for baseline comparison but do not include AI-driven fault prediction without add-on analytics software.
What certifications are provided with shipment?
Standard delivery includes CE Declaration of Conformity, Factory Acceptance Test (FAT) report, and electrical safety test certificate. ISO 17025 calibration certificates for pressure transducers and tachometers are available upon request.
