UniTemp 2Z-HVS-100 High-Vacuum Hermetic Sealing System
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-100 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
Overview
The UniTemp 2Z-HVS-100 is a high-precision, dual-zone high-vacuum hermetic sealing system engineered specifically for semiconductor packaging and MEMS device fabrication. It operates on the principle of controlled thermal compression bonding under ultra-high vacuum (UHV), enabling reliable, void-free hermetic encapsulation of sensitive microelectromechanical systems. Unlike conventional hot-press or reflow-based sealers, the 2Z-HVS-100 employs independent, synchronized temperature control across two heated platens—top and bottom—to ensure identical thermal profiles at the interface of mating components during bond formation. This eliminates interfacial thermal gradients that cause warpage, delamination, or inconsistent seal integrity. The system achieves ultimate vacuum levels down to 1×10⁻⁶ hPa, critical for eliminating outgassing contaminants and preventing oxidation during high-temperature sealing cycles up to 450 °C. Its architecture conforms to cleanroom-compatible mechanical design standards, with all internal wetted surfaces constructed from low-outgassing stainless steel (316L) and ceramic-insulated heating elements.
Key Features
- Dual independent heating zones with real-time PID-controlled temperature regulation (±0.5 °C stability over 450 °C range)
- Optical 360° quartz viewing cylinder surrounding the process chamber for non-intrusive, full-perimeter visual monitoring of seal formation and gas flow dynamics
- Integrated Siemens SIMATIC® S7-1200 PLC controller with HMI touchscreen interface; supports local program editing and USB-host PC connectivity for offline recipe development
- Configurable gas delivery system: one standard mass flow controller (MFC)-equipped line for N₂, O₂, or forming gas (5% H₂/95% N₂); three additional gas inlets available with optional MFCs for multi-atmosphere process sequencing
- Active water-cooled lower platen with closed-loop temperature feedback; external chiller interface (recommended: WC-I closed-loop cooling unit) for chamber wall thermal management
- Automated component alignment stage with repeatable positioning accuracy ≤±5 µm, ensuring consistent bond line geometry across wafer-level or discrete package substrates
- Data logging compliant with GLP/GMP requirements: timestamped temperature, pressure, gas flow, and actuator status recorded at user-defined intervals (default: 1 Hz)
Sample Compatibility & Compliance
The 2Z-HVS-100 accommodates a wide range of MEMS and semiconductor packaging formats, including but not limited to: ceramic LCC/QFN packages, silicon-on-glass (SOG) wafers, glass-frit bonded cavities, and metal-can encapsulations. It supports both eutectic (e.g., Au-Sn, Au-Ge) and diffusion-based sealing processes requiring precise dwell time–temperature–pressure coordination. The system meets ISO 14644-1 Class 5 cleanroom compatibility requirements when operated with filtered inert gas purging. Vacuum performance complies with ASTM E595-22 for total mass loss (TML) and collected volatile condensable materials (CVCM) specifications. All electrical and safety functions adhere to UL 61010-1 and IEC 61000-6-4 electromagnetic compatibility standards.
Software & Data Management
The embedded SIMATIC® runtime environment enables full-cycle process definition—including ramp rates, hold durations, vacuum pump-down sequences, gas purge timing, and cooldown profiles—with up to 20 stored recipes (100 steps per recipe). Data export is supported via USB 2.0 in CSV format, preserving raw sensor values with ISO 8601 timestamps. Audit trail functionality logs operator ID, program selection, parameter modifications, and emergency stop events—fully traceable for FDA 21 CFR Part 11 compliance when paired with validated user authentication protocols. Optional OPC UA server integration allows seamless connection to MES platforms such as Siemens Opcenter Execution or Rockwell FactoryTalk.
Applications
- Hermetic sealing of resonant MEMS sensors (gyroscopes, accelerometers) requiring long-term stability under harsh environmental conditions
- Activation of non-evaporable getter (NEG) films inside vacuum-packaged RF MEMS switches and atomic frequency references
- Thermal stress mitigation during wafer-level capping of optical MEMS (e.g., tunable VCSELs, MOEMS mirrors)
- Controlled atmosphere annealing of thin-film piezoelectric layers prior to cavity sealing
- Multi-step thermal processing of heterogeneous 3D-integrated packages involving dissimilar CTE materials
FAQ
What vacuum level can the 2Z-HVS-100 achieve, and how is it measured?
The system reaches ≤1×10⁻⁶ hPa using a combination of turbomolecular pumping and cryogenic trapping; vacuum is monitored continuously via a calibrated Bayard-Alpert cold cathode gauge.
Can the system handle wafer-level encapsulation?
Yes—it accepts standard 100 mm and 150 mm wafers with custom alignment fixtures; maximum substrate thickness: 2.0 mm.
Is remote diagnostics supported?
Standard Ethernet port enables secure remote access for firmware updates and diagnostic log retrieval via SSH or VNC, subject to network security policy configuration.
What cooling infrastructure is required for continuous operation?
A minimum 10 L/min deionized water supply at 18–22 °C is required for the lower platen; external chamber cooling via WC-I chiller is strongly recommended for >4-hour duty cycles.
Does the system support qualification under ISO/IEC 17025?
Yes—the controller’s calibration certificate (NIST-traceable thermocouples and pressure transducers) and documented IQ/OQ protocols are provided as part of the validation package.
