UniTemp 2Z-HVS-200 High-Vacuum Hermetic Sealing System
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-200 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
| Programmable Steps | 100 per Recipe, 20 Recipes Stored |
| Optical Process Monitoring | 360° Quartz Viewing Cylinder |
| Cooling | Active Water-Cooled Lower Platen + External Closed-Loop Chiller Recommended (Optional Accessory WC-I) |
| Controller | Siemens SIMATIC® S7-1200 PLC with HMI Interface |
| Data Logging | Real-Time Temperature, Pressure, Gas Flow, and Time Stamping |
Overview
The UniTemp 2Z-HVS-200 is a precision-engineered high-vacuum hermetic sealing system designed specifically for semiconductor and MEMS packaging applications requiring controlled thermal processing under ultra-low pressure environments. It operates on the principle of vacuum-assisted thermocompression bonding—where two mating surfaces are brought into intimate contact under precisely regulated temperature gradients and mechanical force, while residual gases and volatile contaminants are removed to sub-10⁻⁶ hPa levels. This enables true hermeticity critical for inert-atmosphere encapsulation of sensitive microstructures, such as resonators, accelerometers, gyroscopes, and vacuum-cavity optical devices. The dual-zone independent heating architecture allows differential thermal management: one zone can preheat or activate getter materials while the other maintains bonding temperature, eliminating thermal stress-induced warpage or interfacial delamination. Its modular gas delivery architecture supports reactive and inert ambient control—essential for oxide-free metal bonding, passivation layer formation, or in-situ getter activation.
Key Features
- Dual independent heating zones with ±0.5 °C temperature uniformity across 200 mm × 200 mm platens, rated to 450 °C continuous operation
- Ultimate vacuum capability of ≤1×10⁻⁶ hPa achieved via turbomolecular pumping backed by dry scroll vacuum pump
- 360° optically transparent quartz cylinder surrounding process chamber enabling real-time visual monitoring without breaking vacuum
- Siemens SIMATIC® S7-1200 PLC-based controller with 7-inch color HMI; supports local recipe editing, USB export/import, and audit-trail-enabled parameter logging
- Configurable gas manifold with up to four independent mass flow-controlled lines (N₂, O₂, forming gas, Ar, or custom mixtures); standard configuration includes one MFC, with optional upgrades for full quadruple-MFC integration
- Active water-cooled lower platen and integrated thermal isolation design ensure rapid, repeatable cooldown profiles—critical for minimizing thermal soak time and preserving metallurgical integrity
- Automated component alignment and force-controlled sealing head with programmable dwell time and ramp rate (0.1–20 °C/min)
Sample Compatibility & Compliance
The 2Z-HVS-200 accommodates substrates and packages up to 200 mm × 200 mm footprint and 30 mm maximum height, supporting ceramic, silicon, glass, and Kovar-based MEMS carriers. It is compatible with Au–Si, Au–Sn, Cu–Cu, and glass-frit bonding schemes. All vacuum and thermal protocols adhere to ASTM F2492-22 (Standard Guide for Hermetic Seal Integrity Testing of Microelectromechanical Systems) and ISO 11607-1:2019 (Packaging for terminally sterilized medical devices). Data logging meets FDA 21 CFR Part 11 requirements when used with validated software configuration and electronic signature workflows. System design complies with CE Machinery Directive 2006/42/EC and RoHS 2011/65/EU.
Software & Data Management
The embedded SIMATIC® controller records timestamped process data—including platen temperatures (upper/lower), chamber pressure, gas flow rates, seal force, and elapsed time—at user-defined intervals (100 ms to 10 s resolution). Raw logs export in CSV format via USB or Ethernet. Optional UniTemp ProcessLink™ software provides remote monitoring, statistical process control (SPC) charting, and comparative recipe analysis across multiple tool installations. Audit trails include operator ID, modification timestamps, and version-controlled recipe archives—fully traceable for GLP/GMP audits.
Applications
- Hermetic wafer-level packaging of RF-MEMS switches and BAW/FBAR filters
- Getter activation and outgassing stabilization in vacuum-sealed photonics modules (e.g., atomic clocks, quantum sensors)
- Thermal cycling and annealing of piezoelectric thin films prior to capping
- Low-temperature glass-frit bonding for IR detector arrays
- Controlled atmosphere reflow of Au–Sn solder joints in high-reliability aerospace IC packages
- Process development for chip-scale vacuum cavities requiring <1×10⁻⁵ Pa residual pressure
FAQ
What vacuum level is achievable, and how is it verified?
The system achieves ≤1×10⁻⁶ hPa using calibrated Bayard–Alpert gauge and residual gas analyzer (RGA) compatibility—verified during factory acceptance testing per ISO 20484:2017.
Can the system support nitrogen purge before vacuum pump-down?
Yes—integrated gas manifold supports pre-purge sequences with programmable flow duration and pressure ramping prior to turbopump engagement.
Is the controller compliant with industry-standard communication protocols?
The SIMATIC® S7-1200 supports Modbus TCP, PROFINET, and OPC UA for integration into MES/SCADA environments.
What cooling infrastructure is required for continuous operation?
A closed-loop chiller (recommended model WC-I, 18–22 °C outlet, ≥3 L/min flow) must be externally supplied; internal plumbing interfaces via DIN 2353 quick-connect fittings.
How is thermal uniformity validated across the platen surface?
Each unit undergoes thermal mapping per ASTM E220-21 using 9-point thermocouple array; uniformity report included in delivery documentation.
