XG50 Non-Destructive X-ray Inspection System for Battery Cells and Semiconductor Die

Overview

The XG50 Non-Destructive X-ray Inspection System is an industrial-grade, real-time radiographic imaging platform engineered for high-precision internal structural analysis of lithium-ion battery cells, pouch modules, prismatic and cylindrical cells, as well as semiconductor die and PCB subassemblies. Utilizing microfocus X-ray transmission physics—based on differential attenuation of X-ray photons through varying material densities—the system generates high-contrast 2D projection images and supports geometrically calibrated 2.5D metrology. Designed specifically for quality control laboratories and inline process validation in battery manufacturing facilities, the XG50 enables detection of critical internal anomalies including electrode misalignment, tab weld voids, separator wrinkles, foreign metallic particles, anode/cathode delamination, and solder joint integrity issues—without physical sectioning or sample destruction.

Key Features

• Microfocus X-ray Source & Digital Imaging Chain: Integrated sealed-tube X-ray generator with adjustable kV (40–90 kV) and µA output; paired with a high-resolution flat-panel detector (≥12-bit dynamic range, 100 µm effective pixel pitch) for low-noise, high-fidelity image acquisition.
• Triaxial Precision Motion System: Motorized X-Y-Z stage for X-ray tube and image intensifier/detector assembly; driven by precision ground ball screws and synchronous stepper motors—ensuring repeatability within ±2 µm and smooth motion control across full travel range (X: 200 mm, Y: 150 mm, Z: 100 mm).
• 2.5D Metrology Engine: Supports calibrated dimensional measurements including linear distance, circle diameter, concentricity of nested circles, point-to-center offset, and angular deviation—all traceable to NIST-certified reference standards via on-system calibration routines.
• CNC Path Programming: Enables teach-and-repeat operation: users record inspection trajectories via manual jog or graphical path definition; stored programs support batch-mode automated scanning of identical parts with positional reproducibility < ±5 µm.
• Intelligent Navigation Interface: Real-time magnified overview map with click-to-move functionality—select any region-of-interest in the navigation window to auto-position the focal spot with sub-pixel accuracy and minimal settling time.
• Robust Mechanical Architecture: Fixed sample stage design minimizes vibration coupling; all motion axes feature anti-backlash mechanisms and thermal drift compensation algorithms for long-duration stability.

Sample Compatibility & Compliance

The XG50 accommodates battery formats up to 300 mm × 200 mm × 80 mm (L×W×H), including bare electrodes, jelly rolls, assembled cells (before electrolyte filling), and finished pouch/prismatic modules. It complies with IEC 62471 (photobiological safety), GB/T 18871-2002 (Chinese radiation protection standard), and meets electromagnetic compatibility requirements per EN 61326-1. While not certified for Class 100 cleanroom operation, its sealed optical path and filtered air intake enable deployment in ISO Class 8 environments typical of battery R&D labs and pilot production lines. All software measurement outputs are compatible with GLP/GMP documentation workflows and support audit-trail generation per FDA 21 CFR Part 11 when deployed with validated networked configurations.

Software & Data Management

The proprietary Aisida VisionInspect™ software suite provides intuitive GUI-based control, real-time image enhancement (contrast stretching, noise suppression, edge sharpening), and multi-format export (TIFF, PNG, DICOM, CSV). Measurement data—including pass/fail flags, tolerance bands, and annotated screenshots—is timestamped, user-ID stamped, and stored in SQLite-backed local databases. Batch reports can be exported in PDF or Excel format with embedded thumbnails and statistical summaries (Cp/Cpk, defect rate per lot). Software architecture supports integration with MES systems via OPC UA or RESTful API endpoints for automated data handoff to SPC platforms.

Applications

• Root cause analysis of field-return battery failures via internal morphology correlation
• In-process verification of electrode stacking accuracy during cell assembly
• Qualification of ultrasonic weld integrity in busbar interconnections
• Verification of separator placement and thermal shutdown layer continuity
• Pre-formation QA screening for metallic contamination in anode foil
• Failure mode mapping for DOE studies in solid-state battery prototype evaluation

FAQ

Does the XG50 meet international radiation safety standards for lab use?

Yes—it conforms to national radiation safety regulations in China (GB/T 18871-2002) and incorporates dual-interlock shielding, dose-rate monitoring, and automatic beam cutoff upon door opening.
Can measurement data be exported for statistical process control (SPC)?

Yes—CSV and Excel exports include raw coordinates, tolerance status, operator ID, timestamp, and image hash for traceability; compatible with Minitab, JMP, and custom SPC dashboards.
Is remote system diagnostics supported?

Standard Ethernet connectivity enables secure remote login via SSH or VNC for firmware updates, log review, and basic troubleshooting—subject to customer network policy approval.
What is the typical lead time for installation and operational qualification?

From order confirmation: 6–8 weeks for factory acceptance testing, shipping, site preparation verification, and IQ/OQ protocol execution with Aisida-certified field engineers.