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ZEPTOOLS PicoFemto In Situ MEMS Heating & Electrical TEM Sample Holder Series

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Brand ZEPTOOLS
Origin Guangdong, China
Manufacturer Type Direct Manufacturer
Origin Category Domestic (China)
Model PicoFemto In Situ MEMS Heating & Electrical Sample Holder Series
Application Field Materials Science
Instrument Classification In Situ Heating Holder
Pricing Upon Request
Compatibility Compatible with Standard TEM Goniometer Stages and Specified Pole Pieces

Overview

The ZEPTOOLS PicoFemto In Situ MEMS Heating & Electrical TEM Sample Holder Series is an engineered solution for real-time, atomic-scale structural and functional characterization of nanomaterials inside transmission electron microscopes (TEMs). Built upon monolithic silicon-based MEMS chip architecture, this holder integrates precision thermal actuation and multi-terminal electrical biasing directly into a standard 3.5 mm OD TEM sample rod form factor. It enables simultaneous in situ heating (up to 1200 °C) and quantitative electrical transport measurement—while preserving high-resolution imaging, electron energy-loss spectroscopy (EELS), and energy-dispersive X-ray spectroscopy (EDS) compatibility. The system operates on the principle of Joule heating within nanofabricated suspended membranes and utilizes low-noise, high-impedance signal routing to minimize thermal crosstalk and electromagnetic interference during concurrent TEM observation.

Key Features

  • MEMS-based dual-function chips: Integrated microheaters and multi-electrode (6- or 8-terminal) measurement structures fabricated via cleanroom-compatible surface micromachining.
  • High-fidelity thermal control: Programmable temperature range from ambient to 1200 °C, with stability better than ±0.1 °C and maximum ramp rate of 100 °C/s under closed-loop feedback.
  • Low-noise electrical measurement: Bipolar voltage output (±200 V), current sourcing/sinking up to ±1.5 A, and femtoampere-level resolution (down to ±100 fA) in both constant-voltage and constant-current modes.
  • Mechanical flexibility: Available in single-tilt (high-tilt option) and double-tilt configurations (β-tilt ±25°, constrained by pole-piece geometry); custom chip layouts and electrode counts supported per application requirements.
  • TEM-system agnostic design: Fully compatible with JEOL, Thermo Fisher (FEI), and Hitachi TEM platforms; supports EELS/EDS acquisition during active heating and biasing without signal degradation.
  • Vacuum-integrated architecture: All electronics are housed externally; only the MEMS chip and low-thermal-mass rod assembly enter the microscope column—ensuring minimal thermal drift (<0.5 nm/min at 1000 °C) and long-term beam stability.

Sample Compatibility & Compliance

The PicoFemto holder accommodates freestanding nanowires, 2D materials (e.g., graphene, TMDs), nanoparticles, thin-film heterostructures, and grain-boundary junctions. Chip substrates include SiNx, SiO2, and customized conductive or insulating membranes. All components meet ISO 9001 manufacturing standards; electrical subsystems comply with IEC 61000-4 electromagnetic immunity specifications. The system supports GLP-compliant data logging when paired with validated software—audit trails, user authentication, and parameter versioning align with FDA 21 CFR Part 11 requirements for regulated materials R&D environments.

Software & Data Management

Two dedicated, modular applications—ZEPTOOLS ThermalControl™ and ElecMeasure™—provide synchronized instrument orchestration. ThermalControl™ implements PID + feedforward algorithms for rapid, overshoot-free ramping and dwell stabilization; ElecMeasure™ supports IV curve sweeps, pulsed biasing, time-resolved conductivity tracking, and real-time resistance/activation-energy derivation. Both tools export timestamped, metadata-embedded datasets in HDF5 format, enabling direct import into Python (NumPy/Pandas), MATLAB, or commercial TEM analysis suites (e.g., DigitalMicrograph plugins). Remote operation via TCP/IP interface allows integration into automated TEM workflows and multi-instrument synchrotron/TEM correlation experiments.

Applications

  • Atomic-scale phase transformation dynamics under thermal stress (e.g., solid-state amorphization, polymorphic transitions).
  • In situ EELS mapping of temperature-dependent electronic structure evolution (e.g., bandgap shifts, plasmon energy changes).
  • Electric-field-driven domain wall motion and ferroelectric switching in complex oxides.
  • Thermally activated defect migration and interfacial reaction kinetics at metal–oxide or semiconductor–electrolyte interfaces.
  • Correlative operando studies combining TEM imaging, diffraction, spectroscopy, and transport metrics—enabling quantitative structure–property–function relationships.

FAQ

What TEM models is the PicoFemto holder compatible with?
It fits standard 3.5 mm diameter goniometer stages across JEOL JEM-ARM series, Thermo Fisher Tecnai/Themis/Probe Cs-corrected systems, and Hitachi HT7800/HT7700 platforms—subject to pole-piece clearance verification.
Can the MEMS chip be reused after an experiment?
Chips are designed for single-use in ultra-high vacuum (UHV) TEM environments to ensure contamination-free performance; however, reusable variants with protective capping layers are available under custom agreement.
Is vacuum transfer capability supported?
Yes—the Vacuum Transfer Chip Measurement System variant features a retractable tip mechanism enabling air-to-vacuum transfer without breaking UHV, ideal for oxygen-sensitive or beam-sensitive samples.
Does the system support cryogenic operation?
A liquid-nitrogen-cooled MEMS variant (operating from 80 K to 450 K) is offered separately, with identical electrical measurement specs and integrated temperature calibration.
How is thermal drift compensated during high-resolution imaging?
Drift compensation leverages real-time cross-correlation tracking of fiducial markers on the chip membrane, combined with hardware-triggered image acquisition synchronized to thermal steady-state windows.

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