Signal Testing Systems and Semiconductor Automatic Test Equipment
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| Brand | Hprobe |
|---|---|
| Origin | France |
| Model | IBEX-300 |
| Wafer Compatibility | 100–300 mm |
| Magnetic Field Orientation | Full 3D vector control (in-plane & out-of-plane) |
| Field Scan Speed | Sub-second field reorientation |
| Integrated Calibration | On-board Hall sensors with traceable calibration |
| Software Suite | MRAM characterization, sensor parameter extraction, and automated test sequencing |
| Probe Interface | Compatible with standard RF/microwave and DC probe cards |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments and GLP-compliant magnetic device qualification |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | MCT 500 |
| Pricing | Available Upon Request |
| Brand | Tianwei (Shandong Tianwei Environmental Technology Co., Ltd.) |
|---|---|
| Model | TW-6481B5+ |
| Origin | Shandong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Application Scope | Length measurement, attenuation profiling, splice/connector loss evaluation, and fault localization in single-mode and multimode optical fiber cables |
| Dynamic Range | 28 dB |
| Maximum Test Distance | 100 km |
| Event Dead Zone | 3 m |
| Sampling Resolution | 2.5 cm |
| Display | 7-inch capacitive touchscreen (800 × 480 TFT LCD) |
| Battery | 3.7 V / 4600 mAh Li-polymer with smart power management |
| Operating Wavelengths | 1310 / 1550 / 1625 / 1650 ±20 nm |
| Compliant File Formats | Bellcore GR-196, SR-4731 |
| Integrated Functions | OTDR, Optical Power Meter (OPM), Visual Fault Locator (VFL, 650 nm), Stable Light Source (LS), Live-fiber detection with automatic optical input warning |
| Interface | USB Type-C, microSD slot |
| Weight | ≤700 g (with battery) |
| Dimensions | ≤200 × 150 × 38 mm |
| Environmental Rating | Operating temperature 0–40 °C |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | Wafer-MOKE |
| Pricing | Available Upon Request |
| Sample Size | Up to 300 mm (12-inch) wafers, downward compatible with fragments |
| Vertical Field Range | ±2.4 T |
| In-Plane Field Range | ±1.3 T |
| Field Resolution | 0.01 mT |
| Field Uniformity | Better than ±1% over Ø1 mm |
| Kerr Rotation Resolution | 0.3 mdeg (RMS) |
| Throughput | 12 WPH (9 sites, 200 mm wafer, ±1.3 T) |
| Sample Repositioning Accuracy | <10 µm |
| Uptime | ≥90% |
| EFEM Integration | Optional |
| Brand | TRY |
|---|---|
| Model | Customized |
| Application Scope | High-power IC packaging (e.g., IGBT modules), semiconductor manufacturing, materials R&D, automotive electronics |
| XY Stage | 150 × 150 mm |
| Max Shear Force Capacity | 1000 kg |
| Compliance | ASTM F468, ISO 13473-2, JEDEC JESD22-B116 (Bond Strength), MIL-STD-883 Method 2011 |
| Sensor Technology | Digital load cell with thermal drift compensation |
| Control Interface | Touchscreen HMI + Ethernet/RS232 for integration into factory MES/LIMS |
| Software | TRY-BondTest Suite v3.2 with audit trail, user role management, and 21 CFR Part 11–compliant electronic signatures |