Step Height Measurement Instrument
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| Brand | Atometrics |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Producer |
| Country of Origin | China |
| Model | WM300R |
| Pricing | Upon Request |
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | NS200 |
| Price | USD 84,000 (FOB Shenzhen) |
| Measurement Principle | Linear Variable Differential Capacitance (LVDC) |
| Probe Tip Radius | 2 µm |
| Scan Length | 55 mm |
| Step Height Repeatability | 0.5 Å (at 330 µm range) |
| Vertical Resolution | Sub-Ångström |
| Force Range | 1–50 mg (adjustable, closed-loop micro-electromagnetic control) |
| XY Stage | Motorized, 150 mm × 150 mm |
| Rotation Stage | 360° motorized |
| Z-Axis Lift | Motorized |
| Optical Navigation | 5 MP color camera, FOV 2200 × 1700 µm |
| Max Sample Thickness | 50 mm |
| Wafer Compatibility | 150 mm (6″) and 200 mm (8″) |
| Operating Environment | 16–25 °C, ΔT < 2 °C/h, RH 30–40 % (non-condensing), Vibration ≤ 6.35 µm/s (1–100 Hz), Acoustic Noise ≤ 80 dB, Airflow ≤ 0.508 m/s downward |
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | NS200 |
| Price | USD 84,000 (FOB) |
| Measurement Principle | Capacitive (LVDC) |
| XY Stage Travel | 150 mm × 150 mm |
| Maximum Scan Length | 55 mm |
| Step Height Repeatability | ±0.005 nm (5 Å) |
| Max Sample Size | 200 mm (8-inch wafer) |
| Sensor Resolution | 0.01 Å (sub-angstrom) at 13 µm range |
| Force Control | Adjustable from 1 µN to 10 mN |
| Vertical Range | 13 µm (standard), optional up to 1050 µm |
| Optical Navigation | 5 MP color camera (orthogonal or oblique view) |
| SPC Module | Yes |
| Environmental Requirements | 16–25 °C, ≤40% RH (non-condensing), vibration <6.35 µm/s (1–100 Hz) |
| Brand | Chotest |
|---|---|
| Origin | Guangdong, China |
| Model | NS391 |
| Measurement Principle | Capacitive (LVDC Sensor) |
| Measurement Area | 150 mm × 150 mm |
| Scan Length | 55 mm |
| Step Height Repeatability | 5 Å |
| Maximum Sample Size | 200 mm (8-inch wafer) |
| Sensor Resolution | ≤0.01 Å (at 13 µm range) |
| Force Control | Adjustable constant contact force, ultra-low inertia electromagnetic actuation |
| Structural Design | Single-arch龙门 (monolithic龙门) frame with vibration isolation |
| Optical Navigation | 5 MP color camera, coaxial & oblique viewing options |
| Software Modules | SPC analysis, multi-region auto-scan, 3D surface reconstruction, stress calculation, roughness/waviness parameter extraction (Ra, Rq, Rv, Rp, Rz, etc.) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported |
| Model | Tencor® P-170 |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 0.5 nm – 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Probe Tip Radius | < 12 nm (standard diamond tip) |
| Normal Force Range | 0.03–15 mg (closed-loop force control) |
| Maximum Scan Length | 200 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤ 0.15 nm (1σ, over 24 h) |
| Maximum Sample Size | Ø200 mm × 25 mm thick |
| Optical System | 5 MP color camera with motorized zoom and dual-view (top + side) optics |
| Automation | Integrated robotic handler for opaque (e.g., Si) and transparent (e.g., sapphire) wafers (Ø75–200 mm) |
| Compliance | ASTM E1399, ISO 4287, ISO 25178-2, USP <1059>, FDA 21 CFR Part 11 (audit trail & electronic signature enabled) |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kosaka SE-500-59 |
| Price Range | USD 42,000 – 56,000 |
| Measurement Principle | Contact Stylus Profilometry (ISO 3274, ISO 4287, ISO 11562 compliant) |
| Vertical Measurement Range | ±400 µm (800 µm total) |
| Vertical Resolution | 0.08 nm |
| Horizontal Measurement Length | 55 mm (extendable to 81 mm via multi-trace stitching) |
| Straightness Accuracy | ≤0.3 µm over 55 mm |
| Stylus Tip Radius | 2 µm diamond |
| Stylus Force | 0.75 mN |
| Scan Speeds | 0.05–2.0 mm/s (6 discrete speeds + high-speed positioning) |
| Filter Types | Gaussian, 2RC, Special Gaussian |
| Cutoff Wavelengths (Roughness) | λc = 0.08, 0.25, 0.8, 2.5, 8.0 mm |
| Cutoff Wavelengths (Waviness) | λf = 0.8, 2.5, 8.0, 25.0 mm |
| Evaluation Parameters | 120+ standardized parameters per ISO, JIS, ANSI/ASME B46.1, and DIN 4768 |
| Display | 640×480 RGB TFT color LCD with capacitive touchscreen |
| Data Storage | USB flash drive (up to 8 GB) |
| Interface | RS-232 serial output |
| Power Supply | AC 90–240 V, 50/60 Hz, 200 VA |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | JS100C |
| Pricing | Available upon Request |
| Measurement Principle | Inductive (LVDT-based) |
| Vertical Measurement Range | 160 µm |
| Probe Tip Radius | 2 µm / 1 µm (interchangeable) |
| Probe Normal Force | 0.5–50 mg |
| Scan Length | 55 mm |
| Step Height Repeatability | < 0.5 nm |
| Vertical Resolution | 0.05 nm (full-scale) |
| Maximum Sample Size | 150 mm × 150 mm |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Model | JS10C |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 160 µm |
| Probe Tip Radius | 2 µm / 1 µm (interchangeable) |
| Normal Force Range | 0.5–50 mg |
| Scan Length | 55 mm |
| Step Height Repeatability | < 0.5 nm |
| Vertical Resolution | 0.05 nm (full-scale) |
| Maximum Sample Size | 150 mm (Ø) |
| Scan Resolution | 10 nm |
| Scan Speed | 5–1000 µm/s |
| Max Data Points per Scan | 2,000,000 |
| Software Functions | Step Height, Surface Roughness (Ra, Rq, Rz, etc.), Flatness, Warp Measurement |
| Brand | ZEPTOOLS |
|---|---|
| Model | JS2000C |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 10 nm – 80 µm |
| Probe Tip Radius | 1 µm / 2 µm |
| Normal Force Range | 0.5–50 mg |
| Scan Length | ≤50 mm |
| Step Height Repeatability | <0.5 nm |
| Vertical Resolution | 0.05 nm |
| Wafer Compatibility | 150 mm (6″) and 200 mm (8″) |
| Maximum Wafer Thickness | 50 mm |
| Positioning Accuracy (Vision System) | ±10 µm |
| Mechanical Stability | >500 consecutive wafers in marathon testing |
| Throughput | ≥10 WPH (single-side, ≥5 measurement positions) |