Ultrasonic Testing Instrument
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Showing 31–35 of 35 results
| Brand | Olympus |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | Custom-Configurable C-Scan Platform |
| Pricing | Upon Technical Consultation |
| Application Scope | Aerospace Composites, Additive Manufacturing Parts, Ceramic Matrix Composites, and Other High-Integrity Structural Components |
| Brand | Olympus |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | Custom-Configured PAUT System |
| Pricing | Available Upon Request |
| Application Domain | Automotive Component Quality Assurance |
| Brand | Olympus |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | Custom-Configured for Wheel Hub Inspection |
| Pricing | Available Upon Request |
| Application Domain | Automotive Quality Control & Weld Integrity Verification |
| Brand | Olympus |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Detection Method | Pulse-Echo Ultrasonic Testing with Equivalent Flat-Bottom Hole (FBH) Calibration |
| Sensitivity | 0.5 mm × 0.5 mm FBH |
| Channel Capacity | Up to 4 Independent UT Channels |
| Automation Interface | Compatible with Robotic Arms & Overhead Cranes Integrated with Machine Vision |
| Software | Proprietary Real-Time UT Analysis Platform with Offline CAD-Based Path Planning, Zonal Defect Classification (Functional vs. Non-Functional Areas), Auto-Report Generation, Remote Supervisory Control, and MES/ERP Integration Capability |
| Compliance Framework | Designed to Support ISO 10893-3, ASTM E273, EN 13660, and GLP/GMP-aligned audit trails |
| Brand | Sonoscan |
|---|---|
| Origin | USA |
| Model | D9650 |
| Application Domain | Aerospace, Semiconductor Packaging, Advanced Electronics Manufacturing, Power Electronics, MEMS, and Thin-Film Photovoltaics |
| Compliance | ASTM E1781, ISO 17845, IPC-J-STD-035, MIL-STD-883 Method 2030 |
| Detection Principle | Pulsed Ultrasound at Frequencies from 10 MHz to 230 MHz |
| Imaging Modes | C-scan, B-scan, A-scan, Through-Scan, Time-of-Flight (TOF), Phase-Sensitive (Phased Array Optional) |