Wafer Defect Electron Beam Inspection Equipment
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| Brand | ATI |
|---|---|
| Model | WIND |
| Category | Wafer Defect Electron Beam Inspection Equipment |
| Origin | South Korea |
| Frame Material | Hairline Stainless Steel with White Powder Coating |
| Dimensions (W×D×H) | 1900 mm × 1680 mm × 2100 mm |
| Weight | 3.5 tons |
| Wafer Compatibility | 200 mm & 300 mm bare wafers |
| Load Port Support | FOUP, open cassette, ring cassettes (8″, 12″) |
| Alignment | Dual-wafer-size auto-alignment (200/300 mm bare |
| Automation Interface | SECS/GEM compliant, SEMI E84 standard |
| Vision System | Dual-optic 2D/3D module with real-time auto-focus |
| Inspection Modes | Normal/sawing inspection, bump inspection, edge/kerf measurement, 3D bump height/warpage/coplanarity/thickness/BLT metrology |
| Algorithm | Die-to-Die (D2D) registration using optimal die selection from adjacent four dies |
| Optional Module | IR imaging for subsurface crack and silicon bulk defect detection |
| Compliance | Fully aligned with SEMI standards |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |