Wafer Defect Optical Inspector
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| Brand | ATI |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Instrument |
| Model | WIS-1000 |
| Instrument Type | Optical Patterned Wafer Defect Inspection System |
| Target Applications | Semiconductor Front-End Process Monitoring |
| Process Node Support | Sub-28 nm FinFET and FD-SOI Technologies |
| Compatible Wafer Sizes | 200 mm and 300 mm |
| Throughput | Up to 120 wafers per hour (depending on inspection recipe and defect density) |
| Optical Resolution | ≤ 150 nm (at λ = 405 nm, high-NA dark-field imaging) |
| Defect Detection Sensitivity | ≥ 95% for ≥ 80 nm particles and ≥ 120 nm pattern bridging/bridging defects on metal and dielectric layers |
| Compliance | ISO 9001-certified manufacturing |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Optical Patterned Defect Inspection System |
| Model | Candela® 6300 |
| Detection Sensitivity | Sub-0.1 Å surface roughness change |
| Spatial Bandwidth | 0.22–2000 µm |
| Measurement Modes | Radial & tangential topography profiling, roll-off analysis, texture uniformity, particle/scratch detection |
| Compliance | Designed for semiconductor and data storage manufacturing environments |
| Brand | KLA-Filmetrics |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported |
| Model | Candela® 8720 |
| Instrument Type | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Automated wafer inspection with Statistical Process Control (SPC) integration |
| Wafer Diameter | 200 mm |
| Detection Principle | Multi-angle elastic and inelastic scattering imaging |
| Key Capabilities | Simultaneous dual-angle scatterometry, surface topography mapping, reflectance profiling, phase contrast imaging, and photoluminescence (PL) detection |
| Compliance | Designed for semiconductor fab environments compliant with SEMI E30 (SECS/GEM), ISO 9001, and industry-aligned GLP/GMP data integrity expectations |
| Brand | Midas |
|---|---|
| Origin | Switzerland |
| Model | IR-M (Infrared Microscope) |
| Optical Magnification Options | 2.5×, 5×, 10× |
| Wafer Compatibility | 100 mm (4″), 150 mm (6″), 200 mm (8″) |
| Spatial Resolution | ≤3 µm (at 5× objective, transmission mode) |
| Detection Sensitivity | Defects ≥3 µm resolvable in Si wafers under IR transmission |
| Illumination Modes | Top-side visible illumination (reflected mode) + Through-wafer infrared illumination (transmission mode) |
| Imaging Sensor | IR-sensitive CMOS camera with USB 3.0 interface |
| Stage | Manual or motorized XY stage (Ø ≤200 mm wafer support) |
| Application Domain | Silicon IC & MEMS wafer-level defect inspection, SOI layer visualization, buried structure analysis |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Wafer Compatibility | 300 mm (fully backward-compatible with 200 mm and smaller wafers) |
| Instrument Category | Optical Defect Inspection & Hybrid Metrology System |
| Primary Application | In-line semiconductor process monitoring and defect characterization |
| Core Technology Integration | Co-registered AFM + WLI on single platform |
| Measurement Capability | Sub-ångström vertical resolution (AFM), nanometer-level lateral resolution, µm-to-mm field-of-view (WLI) |
| Brand | Park SYSTEMS |
|---|---|
| Origin | South Korea |
| Model | NX-Hybrid WLI |
| Primary Technology | Integrated White Light Interferometry (WLI) and Atomic Force Microscopy (AFM) |
| Optical Modes | WLI & Phase-Shifting Interferometry (PSI) |
| Objective Lenses | 2.5×, 10×, 20×, 50×, 100× (motorized turret) |
| Interferometric Objective Type | Mirau |
| Measurement Principle | Coherence scanning interferometry with sub-nanometer vertical resolution |
| Application Domain | Semiconductor front-end & back-end process control, advanced packaging metrology, wafer-level defect review, CMP characterization, GLP/GMP-compliant R&D and inline QA |
| Brand | SOPTOP |
|---|---|
| Origin | Zhejiang, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (China) |
| Model | AWL Series |
| Pricing | Upon Request |
| Primary Applications | Front-end & back-end wafer process monitoring, outgoing wafer quality control |
| Supported Wafer Diameters | 100 mm, 150 mm, 200 mm, 300 mm |
| Configurations | AWL046 (4″/6″), AWL068 (6″/8″), AWL812 (8″/12″) |
| Macro Inspection | 360° full-rotation stage with dual-side tilt (front-side max 70°, back-side 1 max 90°, back-side 2 max 160°) |
| Micro Inspection | Semi-apochromatic metallurgical objectives supporting brightfield, darkfield, DIC, and polarized light modes |
| Vacuum Chuck | Manual quick-release mechanism |
| Control System | Motorized precision stage with μm-level defect resolution |
| Brand | TZTEK |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | TB Series |
| Instrument Category | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Semiconductor Wafer Defect Detection |
| Supported Wafer Diameters | 200 mm (8-inch), 300 mm (12-inch) |
| Compliance | Designed for integration into semiconductor front-end and back-end process lines |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM300 |
| Excitation Wavelength | 532 nm (standard), 275 nm UV optional |
| Laser Power | 50 mW |
| Autofocus Precision | < 0.2 µm |
| Spatial Resolution | < 2 µm |
| Raman Shift Range | 80–9000 cm⁻¹ |
| Spectral Resolution | < 2.0 cm⁻¹ |
| Mapping Scan Area | > 300 × 300 mm² |
| Minimum Step Size | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" customizable) |
| Objective | 100× semi-apochromatic |
| Detection Mode | Confocal Raman + PL + Fluorescence Lifetime (TCSPC) |
| Software Compliance | Supports ASTM E2912, ISO/IEC 17025 workflows, GLP/GMP audit trail logging per FDA 21 CFR Part 11 requirements |
| Brand | ZOLIX |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Optical Defect Inspection System for Semiconductor Wafers |
| Model | SPM900 |
| Instrument Type | Steady-State and Time-Resolved Photoluminescence (PL) Mapping System |
| Excitation Wavelengths | 213 nm, 266 nm, 375 nm, 405 nm |
| Autofocus Accuracy | < 0.2 µm |
| Scan Range | > 300 × 300 mm² |
| Minimum Spatial Resolution | 1 µm |
| Compatible Wafer Sizes | 2", 4", 6", 8" (12" optional) |
| Objective Lenses | UV (5×), NUV (20×/100×), Visible (20×/50×/100×) |
| Spectrometer | 320 mm focal length, 1200 g/mm grating, spectral resolution ≤ 0.2 nm |
| PL Lifetime Range | 50 ps – 1 ms |
| Lifetime Precision | 8 ps |
| Detection Modes | Confocal steady-state PL, time-resolved PL (TRPL), fluorescence lifetime imaging (FLIM), Raman mapping, photocurrent mapping |