Wafer Slicing Machine
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| Brand | Accretech |
|---|---|
| Origin | Japan |
| Model | AD2000TS |
| Equipment Type | Semiconductor Wafer Slicing System |
| Application Domain | Silicon Wafer Dicing & Kerfless Slice Separation |
| Compliance Context | Designed for ISO 14644-1 Class 5 Cleanroom Integration |
| Control Architecture | CNC-based Closed-loop Motion Control with Real-time Vibration Damping |
| Brand | ACCRETECH |
|---|---|
| Origin | Japan |
| Model | SS20 |
| Type | Semi-Automatic Diamond Blade Dicing Saw |
| Cutting Method | Wet/Dry Compatible Blade Dicing |
| Blade Diameter | Standard 6-inch (152 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Z-Axis Travel | ≥30 mm |
| Spindle Speed Range | 1,000–45,000 rpm |
| Coolant System | Integrated Deionized Water Delivery with Filtration |
| Machine Dimensions (W×D×H) | 1,200 × 950 × 1,700 mm |
| Weight | ≈ 1,200 kg |
| Compliance | CE Marked, ISO 9001 Certified Manufacturing Process |
| Control Interface | Touchscreen HMI with Programmable Motion Axes (X/Y/Z/θ) |
| Brand | AdvR |
|---|---|
| Model | PPKTP |
| Substrate Material | KTP (KTiOPO₄) |
| Poling Period Range | 3.5–22 µm (customizable) |
| Operating Wavelength Range | 350–5000 nm |
| Nonlinear Interaction Types | Type-0, Type-I, Type-II phase matching |
| Primary Applications | SHG, SFG, DFG, SPDC |
| Waveguide Configuration | Ti-indiffused or proton-exchanged ridge/strip waveguides |
| Input/Output Options | Fiber-pigtailed (SMF-28, PM fiber), free-space collimated input/output |
| Max. Continuous Pump Power | ≤500 mW (standard), ≤2 W (high-power variant) |
| Conversion Efficiency | Up to 300 %/W (internal, 1560 nm → 780 nm) |
| Operating Temperature Range | 20–80 °C (thermally stabilized options available) |
| Compliance | RoHS-compliant packaging, ISO 9001-certified manufacturing process |
| Customization | Period, length, AR coating (R < 0.2% @ specified λ), polarization handling, thermal tuning design |
| Brand | Freiberg Instruments |
|---|---|
| Origin | Germany |
| Model | MDPlinescan |
| Sample Type | Monocrystalline & Multicrystalline Silicon Wafers, Ingots, and Processed Substrates |
| Measurement Principle | µ-PCD (Microwave Photoconductance Decay) & Steady-State Photoconductance |
| Carrier Lifetime Range | 0.1 µs – 10 ms (typ.) |
| Resistivity Range | 0.2 – 10³ Ω·cm |
| Conductivity Type | p-type & n-type |
| Sample Dimensions | Up to 50 × 50 mm² |
| Hardware Interface | Ethernet (TCP/IP, Modbus TCP) |
| Power Supply | 24 V DC, 2 A |
| Dimensions | 174 × 107 × 205 mm |
| Weight | 3 kg |
| Compliance | CE, RoHS, IEC 61000-6-2/6-4 |
| Software Protocol | Standard OPC UA & RESTful API support |
| Brand | Siegert Wafer |
|---|---|
| Origin | Germany |
| Model | Siegert Wafer Series |
| Material Options | Borofloat® 33, Fused Silica |
| Diameter | Up to 200 mm |
| Thickness | 0.5–2.0 mm |
| Shape | Round or Rectangular |
| Surface Coatings | ITO, Photoresist, Custom Thin-Film Layers |
| Compliance | ISO 14644-1 Class 5 Cleanroom Processing |
| Packaging | Vacuum-Sealed, Particle-Free Cassette |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS200 |
| Maximum Wafer Size | 200 mm |
| Bonding Force | up to 100 kN |
| Temperature Range | up to 550 °C |
| Vacuum Chamber Pressure Range | 5×10⁻⁵ mbar to 3 bar |
| Heating/Cooling Rate | up to 40 K/min (heating), up to 30 K/min (cooling) |
| Bonding Force Repeatability | < 2% |
| Temperature Uniformity | < 1% |
| Process Control | Programmable ramp/soak profiles with independent pressure, temperature, and force regulation |