Wafer Thinning Machine
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| Brand | G&N |
|---|---|
| Origin | Germany |
| Model | MPS R400CV |
| Wafer Compatibility | 2″, 3″, 4″, 5″, 6″, 8″ |
| Chuck Flatness Error | ≤2 µm |
| Grinding Method | Z-axis plunge grinding with synchronized wafer and spindle rotation |
| Spindle Type | Integrated high-precision air-bearing spindle |
| Spindle Speed | 2560 rpm |
| Spindle Power | 3.7 kW |
| Grinding Wheel Diameter | 200 mm |
| Number of Spindles | 1 |
| Coarse/Fine Feed Range | 170 mm |
| Feed Resolution | ≤1 µm |
| Minimum Step Size | 0.1 µm |
| Coarse Grinding Rate | 2–1000 µm/min |
| Fine Grinding Rate | 2–1000 µm/min |
| Surface Roughness (Ra) | Down to 0.016 µm (with D7 diamond wheel) |
| Total Thickness Variation (TTV) | ≤3 µm per wafer |
| Inter-wafer Thickness Uniformity | ≤2 µm |
| Wheel Material | Diamond or CBN |
| Wheel Mounting | Single or dual-wheel configuration (manual or optional automatic change) |
| Chuck Sizes | Multiple vacuum chucks for 2″–8″ wafers |
| Sample Table Diameter | 400 mm |
| Sample Table Speed | 2–20 rpm |
| Control System | High-precision PLC-based controller with touchscreen HMI |
| Recipe Storage | Multiple programmable process recipes |
| Optional Module | In-situ thickness measurement unit |
| Enclosure | Fully enclosed grinding chamber |
| Machine Weight | 1130 kg |
| Footprint | 1640 × 1210 mm |
| Brand | Mengqi |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Wafer Size Capacity | 8-inch |
| Grinding Wheel OD | 203 mm |
| Spindle Speed Range | 0–6000 rpm |
| Chuck Rotation Speed | 0–400 rpm |
| Z-Axis Stroke | 130 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional down to 0.01 µm/sec) |
| In-situ Thickness Measurement Resolution | 0.1 µm |
| In-situ Thickness Repeatability | ±0.001 mm |
| Material Compatibility | Si, GaAs, SiC, GaN, Sapphire, and other brittle semiconductor substrates |
| Customization | Fully configurable chuck, coolant delivery, metrology integration, and process recipe management |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |
| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |