Agilent CombiTSP Titanium Sublimation Pump Assembly

Overview

The Agilent CombiTSP Titanium Sublimation Pump Assembly is a high-performance, oil-free ultra-high vacuum (UHV) and extreme-high vacuum (XHV)-capable pumping solution engineered for demanding scientific environments where hydrocarbon-free operation, long-term stability, and minimal outgassing are critical. Unlike conventional turbomolecular or diffusion pumps, the CombiTSP integrates a titanium sublimation pump (TSP) with a complementary ion pump—configurable as triode, diode, or inert-gas-optimized diode—within a single, thermally and mechanically integrated housing. This hybrid architecture leverages the complementary gas removal mechanisms of both technologies: the TSP provides rapid, high-capacity pumping of active gases (H₂, O₂, N₂, CO, CO₂) via chemisorption onto freshly deposited titanium films, while the ion pump continuously removes noble gases (He, Ne, Ar) and residual reactive species through ion burial in titanium cathodes. The system operates without moving parts or lubricants, eliminating vibration, particulate generation, and hydrocarbon contamination—making it ideal for surface science experiments, particle physics beamlines, synchrotron endstations, and atomic-scale thin-film deposition systems requiring base pressures below 10⁻⁹ mbar after bakeout.

Key Features

• Integrated dual-pump architecture combining a high-speed (500 L/s) titanium sublimation pump with a configurable ion pump module for broad-spectrum gas removal
• ConFlat (CF) non-rotating inlet flange (typically CF150 or CF200, customizable per application) ensuring leak-tight UHV compatibility and alignment stability
• Dual-conduction cryopanel mounted directly to the TSP’s CF flange, offering scalable thermal management: operable with liquid nitrogen cooling (enhancing water vapor capture and H₂ pumping speed), water cooling (for continuous-duty applications), or uncooled (for XHV maintenance after initial pump-down)
• Pre-installed, voltage-selectable (120 Vac / 230 Vac) TSP heater with precision temperature control circuitry for reproducible titanium evaporation profiles and film uniformity
• Modular electrical feedthrough options compliant with international accelerator and UHV standards—including Fischer, King, DESY, Varian, and SHV 10 kV (Safeconn) connectors—enabling integration into radiation-hardened or high-voltage experimental setups
• Customizable pump body geometry and conductance paths to match chamber layout constraints, including side-port CF openings and multi-flange configurations for distributed pumping networks

Sample Compatibility & Compliance

The CombiTSP is compatible with all standard UHV/XHV materials and fabrication practices, including stainless steel 316L, oxygen-free copper, and ceramic insulators. Its all-metal, bakeable construction supports full-system bakeouts up to 150 °C, enabling achievement of ultimate pressures < 1 × 10⁻¹⁰ mbar in properly conditioned systems. The pump conforms to ISO 27893 (vacuum technology — terminology and definitions), ASTM E575 (standard guide for vacuum practice in electron microscopy), and meets mechanical and electromagnetic compatibility requirements per CE/EN 61000-6-3 and EN 61000-6-4. It is designed to support GLP-compliant vacuum monitoring protocols when paired with calibrated Bayard–Alpert gauges and data-logged pressure controllers.

Software & Data Management

While the CombiTSP operates as a stand-alone hardware module, its heater power supply and optional ion pump controller (e.g., Agilent 5000-series) support RS-232, RS-485, and Ethernet (Modbus TCP) interfaces for integration into centralized vacuum supervision systems. Logged parameters—including TSP heater current/voltage, ion pump discharge current, and interlock status—are timestamped and exportable in CSV format. When deployed in regulated environments (e.g., accelerator facilities under DOE or CERN QA frameworks), the system supports audit-trail-enabled operation consistent with FDA 21 CFR Part 11 principles when used with validated SCADA platforms.

Applications

• Particle accelerator beamline vacuum systems requiring zero hydrocarbon background and long-term pressure stability
• Surface analysis chambers (XPS, AES, LEED) where titanium film purity and absence of pump oil residuals are essential for quantitative spectral interpretation
• Nanofabrication tools (MBE, ALD) operating in UHV/XHV regimes with stringent water vapor and hydrogen partial pressure limits
• Cryogenic detector enclosures (e.g., transition-edge sensors, superconducting qubits) where magnetic silence and zero vibration are mandatory
• Gravitational wave interferometer vacuum tubes demanding ultra-low outgassing rates and immunity to seismic perturbation

FAQ

Can the CombiTSP operate without liquid nitrogen cooling?
Yes—the cryopanel is fully functional in uncooled mode for XHV maintenance; however, LN₂ cooling significantly enhances water vapor pumping speed and improves H₂ removal efficiency during initial pump-down.
What ion pump configuration is recommended for helium-rich environments?
A triode ion pump is preferred for elevated helium pumping capacity; alternatively, an inert-gas-optimized diode pump offers higher sputtering yield for He and Ne in compact footprints.
Is the pump compatible with automated vacuum sequencing logic?
Yes—via standard serial or Ethernet communication protocols, enabling synchronization with gate valves, pressure gauges, and bakeout controllers in programmable vacuum sequences.
Does the CombiTSP require periodic maintenance beyond titanium cartridge replacement?
No consumables other than the titanium source rod are required; the ion pump cathodes exhibit multi-year service life under typical UHV conditions, and the all-metal structure eliminates gasket or bearing wear concerns.
Can the CF flange configuration be modified post-purchase?
Flange layouts are factory-configured per order; mechanical rework is not supported, but Agilent offers engineering consultation for retrofit kits and adapter solutions prior to shipment.