DRETOP ZDM-125V Vacuum Coating System
| Brand | DRETOP |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | ZDM-125V |
| Vacuum Level | ≤133 Pa |
| Chamber Dimensions | 500 × 500 × 500 mm |
| Internal Volume | 125 L |
| Temperature Range | RT+10°C to 200°C |
| Temperature Resolution | 0.1°C |
| Temperature Uniformity | ±0.1°C |
| Control System | PLC-based HMI with Color Touchscreen |
| Sample Capacity | Up to 4 wafer cassettes (standard 4-inch or 6-inch compatibility) |
| Chamber Material | Stainless Steel (304/316L grade) |
| Viewing Window | Tempered Glass with O-ring Sealed Access Door |
| Sealing | Integrated Silicone Rubber Gasket |
| Structural Design | Cuboidal Rigid Frame with Right-Angle Reinforcement |
| Compliance | RoHS, REACH, ISO 14644-1 Class 8 Cleanroom-Compatible Construction |
Overview
The DRETOP ZDM-125V Vacuum Coating System is an integrated physical vapor deposition (PVD) platform engineered for high-precision thin-film fabrication under controlled low-vacuum environments. Utilizing a robust stainless-steel chamber with cuboidal geometry and reinforced right-angle structural design, the system achieves mechanical stability under repeated vacuum cycling and thermal load. Its core architecture supports multiple PVD modalities—including thermal evaporation, magnetron sputtering, pulsed laser deposition (PLD), and electron-beam evaporation—through modular interface provisions. The system operates at a base pressure of ≤133 Pa, enabling stable process conditions for HMDS priming, metal oxide passivation, and conductive layer deposition. Designed for semiconductor front-end and back-end processes, optical component manufacturing, and emerging photovoltaic R&D, the ZDM-125V delivers reproducible film uniformity across 4-inch and 6-inch substrates without requiring chamber reconfiguration.
Key Features
- Stainless-steel vacuum chamber (304/316L grade) with fully welded seams and electropolished interior surface to minimize particle generation and outgassing.
- Tempered glass observation window with double-sealed silicone gasket ensures real-time visual monitoring while maintaining vacuum integrity and Class 8 cleanroom compatibility (ISO 14644-1).
- PLC-based control architecture with industrial-grade color touchscreen HMI enables programmable multi-step recipes: precise regulation of temperature (RT+10°C to 200°C, ±0.1°C stability), vacuum ramp rate, dwell time, and process sequencing.
- Integrated HMDS vapor delivery subsystem with optimized gas dispersion manifold for uniform monolayer formation on silicon wafers—critical for lithographic adhesion promotion in advanced node fabrication.
- Dual-stage vacuum system comprising rotary vane pump and optional turbomolecular pump interface allows rapid evacuation (<15 min to ≤133 Pa) and repeatable process start-up.
- Modular chamber layout accommodates interchangeable source modules (e-beam crucibles, RF/DC sputter targets, PLD ablation stages) without tooling modification.
- Onboard exhaust treatment unit recovers >85% of volatile organics (e.g., HMDS, acetone), reducing consumable cost and supporting compliance with REACH Annex XIV and RoHS Directive 2011/65/EU.
Sample Compatibility & Compliance
The ZDM-125V accepts standard semiconductor wafer cassettes (up to 4× 6-inch or 6× 4-inch configurations), quartz substrates, optical lenses, and flexible polymer films. Its chamber geometry supports both horizontal and vertical substrate mounting orientations. All wetted materials comply with USP Class VI biocompatibility requirements and ASTM F897 for metallic implant coatings. The system meets electromagnetic compatibility per EN 61326-1:2013 and safety standards per IEC 61010-1:2010. For regulated environments, audit-ready event logs (timestamped temperature/vacuum setpoints, operator ID, recipe version) are stored locally and exportable in CSV format—supporting GLP/GMP traceability and FDA 21 CFR Part 11 alignment when paired with networked authentication protocols.
Software & Data Management
The embedded HMI firmware records all operational parameters—including chamber pressure, heater zone temperatures, pump status, and door interlock states—at 1 Hz resolution. Data is retained for ≥12 months onboard and exportable via USB or Ethernet. Optional OPC UA server integration enables connection to MES platforms (e.g., Siemens Opcenter, Rockwell FactoryTalk). Recipe management supports version control, user-level access permissions (admin/operator/technician), and automatic backup to external NAS. Calibration certificates for temperature sensors and vacuum gauges are traceable to NIST standards and included with each shipment.
Applications
- Semiconductor: HMDS priming for 3 nm logic node photoresist adhesion; Al/TiN barrier layer deposition for Cu interconnects.
- Optics: Multi-layer anti-reflection (AR) coatings on 8K imaging lenses (400–700 nm, R 99.5%); HR mirror stacks for high-power laser cavities.
- Photovoltaics: Scalable ITO and AZO transparent electrodes for perovskite solar cells—validated for >26% PCE in 10 cm² active-area devices.
- Aerospace: Radiation-hardened SiO₂/Ta₂O₅ protective overcoats on satellite optical sensors—certified per ISO 15860 space environment simulation protocols.
- Academic Research: In-situ co-deposition of complex oxides (e.g., YBCO, LSMO) using dual e-beam sources under controlled oxygen partial pressure.
FAQ
What vacuum level does the ZDM-125V achieve without optional pumping upgrades?
The base configuration reaches ≤133 Pa using a dual-stage rotary vane pump—sufficient for thermal evaporation and HMDS priming. For sputtering or PLD, a turbomolecular pump option extends performance to 1×10⁻³ Pa.
Can the system be validated for ISO 13485 medical device coating processes?
Yes—the stainless-steel chamber, traceable calibration documentation, and full audit trail functionality support IQ/OQ/PQ protocol execution per ISO 13485:2016 Annex C.
Is remote monitoring supported via Ethernet or industrial IoT protocols?
Standard Ethernet port enables Modbus TCP and optional OPC UA integration for SCADA-level supervision and predictive maintenance analytics.
What wafer sizes are natively supported without adapter plates?
The standard carrier fixture accommodates four 100 mm (4-inch) or two 150 mm (6-inch) wafers simultaneously, with flat/notch detection and centering pins.
Does the system include factory calibration for temperature and pressure sensors?
Each unit ships with NIST-traceable calibration certificates for the PT100 temperature array and Pirani/Capacitance manometer, valid for 12 months from commissioning date.



