Tianyan TY-CHY Automatic Thickness Gauge for Plastic Films and Packaging Materials

Overview

The Tianyan TY-CHY Automatic Thickness Gauge is a precision mechanical contact-type thickness measurement system engineered for high-reproducibility metrology across packaging, flexible electronics, and paper industries. It operates on the standardized principle of controlled-force mechanical displacement sensing: a motorized measuring head descends under programmable load onto a flat specimen placed on a precision-ground anvil, compressing it within defined pressure and contact-area parameters per ISO, ASTM, and GB standards. This method ensures traceable, operator-independent thickness quantification—critical for quality control in roll-to-roll manufacturing of polymer films, battery separators, metallized foils, coated papers, and semiconductor wafers. Unlike optical or ultrasonic alternatives, the TY-CHY delivers direct physical measurement unaffected by material transparency, surface reflectivity, or bulk density variation—making it especially suitable for opaque, multilayered, or heterogeneous substrates where non-contact methods may yield ambiguous results.

Key Features

• Motor-driven auto-lift/lower mechanism eliminates manual probe positioning errors and ensures consistent dwell time and loading profile.
• Dual-pressure configuration (17.5 ± 1 kPa for thin films; 50 ± 1 kPa for rigid sheets) aligns with ISO 4593 and GB/T 451.3 requirements for standardized deformation control.
• High-resolution linear encoder with 0.1 µm resolution and ±0.5 µm accuracy meets Grade 0.5 metrological classification per JJG 864-2015.
• Large-color LCD interface displays real-time measurements, statistical summaries (mean, max, min, SD), and pass/fail status against user-defined tolerance bands.
• Integrated thermal printer outputs hard-copy reports including date/time stamp, sample ID, operator code, and full statistical summary—supporting GLP documentation workflows.
• RS232 serial interface enables bidirectional communication with laboratory information management systems (LIMS) or custom QA databases for automated data archiving and audit trail generation.
• ISP-enabled firmware allows remote calibration updates and protocol adjustments without hardware intervention—ensuring long-term compliance readiness.

Sample Compatibility & Compliance

The TY-CHY accommodates specimens up to 5 mm thick and supports broad material classes—including polyethylene (PE), polypropylene (PP), PET, BOPP, aluminum foil, laminated composites, corrugated board, cellulose-based papers, silicon wafers (up to 300 mm diameter), nonwovens, and solid dielectric insulators. Its dual-contact-area design (50 mm² for compliant films; 200 mm² for stiff substrates) satisfies mechanical equivalence requirements across ISO 534 (paper), ASTM D374 (electrical insulation), and JIS Z1702 (packaging films). All mechanical and pneumatic components are constructed from hardened stainless steel and ceramic-coated bearings to minimize hysteresis and thermal drift. The instrument is factory-calibrated using NIST-traceable gauge blocks and certified per ISO/IEC 17025-accredited procedures. Documentation includes full uncertainty budgeting, as-received calibration certificates, and conformity statements referencing each applicable standard listed in its technical dossier.

Software & Data Management

Optional PC-based software provides advanced statistical process control (SPC) capabilities—including X-bar/R charts, capability indices (Cp/Cpk), trend analysis, and histogram visualization. Raw data export is supported in CSV, TXT, and XML formats for integration into JMP, Minitab, or enterprise MES platforms. Audit trail functionality logs all user actions—including measurement initiation, parameter modification, calibration events, and report generation—with timestamps and operator IDs—meeting FDA 21 CFR Part 11 requirements for electronic records and signatures when configured with user authentication and digital signature modules. Data encryption and role-based access control (RBAC) ensure integrity during multi-shift operations in regulated environments.

Applications

• Quality assurance of lithium-ion battery separators during coating and calendering processes.
• In-process thickness verification of metallized PET film used in flexible packaging barrier layers.
• Batch release testing of food-grade parchment paper and wax-coated boardstock.
• Thickness profiling of silicon wafers prior to photolithography—enabling localized thickness deviation mapping.
• Validation of composite laminate uniformity in aerospace prepreg production.
• Compliance testing for medical device packaging per ISO 11607-1 and ASTM F1929.

FAQ

Does the TY-CHY comply with ISO/IEC 17025 requirements for accredited testing laboratories?

Yes—the instrument’s calibration methodology, uncertainty budgeting, and documentation structure conform to ISO/IEC 17025:2017 Clause 6.4 (Equipment) and Clause 7.7 (Uncertainty of Measurement), provided users maintain traceable calibration intervals and environmental controls.
Can the system perform multi-point thickness mapping across large-area samples?

When equipped with the optional auto-sampler module, the TY-CHY executes programmable grid-based measurements (e.g., 3×3, 5×5 arrays) with positional repeatability ≤±2 µm, enabling thickness uniformity assessment per ASTM D5264.
Is pressure calibration required before each test series?

No—pressure transducers are factory-calibrated and thermally compensated; however, daily verification using certified reference weights is recommended per ISO 9001 internal audit protocols.
What is the maximum allowable surface roughness for reliable measurement?

For optimal repeatability, Ra should not exceed 0.8 µm. Specimens exceeding this threshold require surface flattening or use of extended-dwell protocols to stabilize compression response.
How does the system handle temperature-induced dimensional drift?

The baseplate incorporates low-expansion Invar alloy, and internal thermal compensation algorithms adjust encoder output based on real-time sensor readings—reducing coefficient-of-thermal-expansion (CTE) error to <0.02 µm/°C over 15–30°C operating range.