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LabCompanion TH-608-3 Rapid Temperature Transition Environmental Test Chamber

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Brand LabCompanion
Origin Guangdong, China
Manufacturer Type Direct Manufacturer
Product Origin Domestic (China)
Model TH-608-3
Temperature Range −70 °C to +150 °C
Temperature Fluctuation ±0.5 °C
Temperature Deviation ±2.0 °C
Temperature Uniformity ≤2.0 °C
Heating Rate 1–25 °C/min (linear or non-linear)
Cooling Rate 1–25 °C/min (linear or non-linear)
Working Chamber Dimensions 800 × 950 × 800 mm

Overview

The LabCompanion TH-608-3 Rapid Temperature Transition Environmental Test Chamber is an engineered solution for accelerated thermal stress testing of materials, components, and finished products under precisely controlled and dynamically variable temperature conditions. Based on forced-air convection with dual-stage refrigeration and high-efficiency electric heating systems, the chamber delivers rapid, repeatable, and traceable thermal transitions—critical for evaluating thermal shock resistance, solder joint integrity, polymer dimensional stability, and electronic package reliability. Designed in accordance with IEC 60068-2-14 (Test N: Change of Temperature), MIL-STD-810H Method 503.5, and ISO 16750-4 for automotive electronics, the TH-608-3 supports both linear ramping and user-defined non-linear temperature profiles, enabling simulation of real-world thermal environments encountered during transportation, storage, and operational life cycles.

Key Features

  • High-speed thermal transition capability: Programmable heating and cooling rates from 1 to 25 °C/min, independently adjustable for ramp-up and ramp-down phases;
  • Precision climate control architecture featuring PID-based digital temperature regulation with dual-sensor feedback (chamber air and load surface monitoring optional);
  • Stainless steel inner chamber (SUS304) with seamless welding and electrostatically coated outer enclosure for corrosion resistance and long-term structural integrity;
  • Integrated safety system including over-temperature cut-off, compressor high-pressure protection, phase failure detection, and door interlock switch;
  • Intuitive 7-inch TFT-LCD touchscreen controller with multi-language UI (English, Chinese, Korean, Japanese), USB data export, and real-time trend graphing;
  • Compliance-ready design supporting audit trails, parameter locking, and user-level access control—facilitating GLP/GMP-aligned validation protocols.

Sample Compatibility & Compliance

The TH-608-3 accommodates test specimens up to 800 mm (W) × 950 mm (H) × 800 mm (D), making it suitable for printed circuit board assemblies (PCBAs), automotive ECUs, optical modules, battery packs, and molded plastic housings. Internal airflow distribution is optimized via adjustable vane diffusers and rear-mounted centrifugal fans to ensure uniform thermal exposure across heterogeneous sample loads. The chamber meets key international standards including ASTM D5276 (thermal cycling of packaging), IPC-9701A (performance requirements for thermal cycle testing of interconnects), and JESD22-A104 (temperature cycling). Optional qualification packages support IQ/OQ/PQ documentation per ISO/IEC 17025 and FDA 21 CFR Part 11 requirements when paired with validated software configurations.

Software & Data Management

Standard operation is managed through the embedded LabCompanion TC-Link controller firmware, which logs timestamped temperature data at user-selectable intervals (1–60 seconds) and stores up to 100 test programs with 99 segments each. For advanced analysis, optional PC-based software (TC-View Pro) enables remote monitoring, multi-chamber synchronization, statistical process control (SPC) charting, deviation alarm escalation via email/SNMP, and automated report generation compliant with ISO 17025 clause 7.8. All data files are saved in CSV and XML formats with embedded metadata (operator ID, calibration certificate reference, environmental conditions), ensuring full traceability and compatibility with LIMS and MES platforms.

Applications

  • Thermal shock evaluation of semiconductor devices per JEDEC JESD22-A106B;
  • Reliability screening of aerospace avionics under extreme ambient transients;
  • Validation of adhesive bond strength and coating adhesion after cyclic thermal exposure;
  • Accelerated aging studies of lithium-ion battery cells and BMS modules;
  • Qualification testing of medical device enclosures per ISO 14971 risk management requirements;
  • Process window verification for reflow soldering and conformal coating curing steps.

FAQ

What is the maximum allowable thermal load inside the chamber?
The TH-608-3 is rated for continuous operation with internal heat loads up to 500 W. Higher dissipation requires optional auxiliary cooling or derating of ramp rates.

Does the chamber support humidity control?
No—the TH-608-3 is a dry-temperature-only system. For combined temperature/humidity testing, consider the LabCompanion THU series.

Can the controller be integrated into a factory SCADA system?
Yes—Modbus RTU (RS-485) and Ethernet/IP interfaces are available as factory-installed options for PLC and SCADA interoperability.

Is third-party calibration certification included?
A NIST-traceable temperature calibration certificate (per ISO/IEC 17025) is available upon request; standard delivery includes internal sensor verification report only.

What maintenance schedule is recommended?
Compressor oil and refrigerant filter replacement every 24 months; air intake filter cleaning weekly; annual verification of sensor accuracy and door seal integrity.

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