English Product Name
| Brand | Generic |
|---|---|
| Origin | Imported |
| Distributor Type | Authorized Distributor |
| Temperature Range | −70 °C to +150 °C (selectable low-temp stages: −20 °C / −40 °C / −60 °C / −70 °C |
| high-temp stages | +100 °C / +150 °C) |
| Internal Dimensions (L×W×H, cm) | 40×50×40 to 100×100×100 |
| External Dimensions (L×W×H, cm) | 120×165×110 to 190×210×185 |
| Transfer Time (typ.) | <15 s between zones |
| Compliance | Designed per IEC 60068-2-14, ASTM D5229/D570, MIL-STD-810H Method 503.7 |
Overview
The OK-TS Series Thermal Shock Test Chamber is an engineered dual-zone environmental test system designed for rapid, repeatable thermal cycling between extreme temperature extremes. It operates on a liquid-cooled, forced-air transfer principle—featuring independent high-temperature and low-temperature chambers with a vertically or horizontally actuated specimen carrier that moves samples between zones in under 15 seconds. This architecture enables precise simulation of real-world thermal stress conditions encountered during storage, transportation, and operational life cycles of electronic assemblies, semiconductor packages, PCBs, automotive sensors, and aerospace components. Unlike single-chamber ramp-based systems, the OK-TS series delivers true step-function thermal shock profiles, critical for detecting latent interfacial delamination, solder joint fatigue, coefficient-of-thermal-expansion (CTE) mismatch failures, and seal integrity degradation.
Key Features
- Dual independent chamber design with separate refrigeration and heating circuits—ensuring stable setpoint maintenance during transition cycles
- Stainless steel SUS304 mirror-finish interior walls and floor, corrosion-resistant and non-outgassing for cleanroom-compatible operation
- PID-controlled digital temperature controller with auto-tuning algorithm and SSR/SSR+SCR hybrid output for stable thermal regulation ±0.5 °C uniformity (within working volume)
- Low external surface temperature (<45 °C at ambient 25 °C) achieved via multi-layer insulation and high-efficiency silicone rubber gasket sealing
- Modular structural frame supports custom internal dimensions—from 40×50×40 cm (OK-TS-100) up to 100×100×100 cm (OK-TS-1000)—with reinforced load-bearing platforms rated for ≤30 kg payload
- Integrated safety interlocks including over-temperature cut-off, refrigerant pressure monitoring, door-open alarm, and emergency stop circuit compliant with EN 61000-6-2/6-4 EMC standards
Sample Compatibility & Compliance
The OK-TS series accommodates a broad range of sample types—including bare die, QFN/BGA packages, MEMS devices, battery cells (Li-ion, solid-state), optical modules, and polymer-based housings—without requiring fixture modification. Internal chamber geometry ensures unrestricted airflow and minimal thermal shadowing. All models are configured to meet essential requirements of IEC 60068-2-14 (Test N: Change of temperature), ASTM D5229 (low-temperature impact resistance), ASTM D570 (water absorption after thermal cycling), and MIL-STD-810H Method 503.7 (temperature shock). Optional validation kits support IQ/OQ documentation per ISO/IEC 17025 and GMP Annex 11 guidelines. Traceable calibration certificates (NIST-traceable thermocouples, Class A accuracy) are available upon request.
Software & Data Management
Equipped with embedded RS485/RS232 and optional Ethernet interface, the chamber integrates with industry-standard test management software (e.g., WinTest Pro, TestXpert II, or custom SCADA systems) for remote parameter setting, real-time data logging, and automated cycle sequencing. Logged parameters include zone temperatures, transfer time, dwell duration, and alarm status—all timestamped with millisecond resolution. Audit trails comply with FDA 21 CFR Part 11 requirements when paired with validated user access control and electronic signature modules. Data export formats include CSV, XML, and PDF reports with embedded calibration metadata and pass/fail flagging against user-defined limits.
Applications
This thermal shock chamber serves as a core qualification tool across R&D, reliability engineering, and quality assurance laboratories. Typical use cases include: accelerated life testing of power electronics subjected to automotive under-hood thermal gradients; qualification of medical device PCBAs per IEC 60601-1 clause 11.1.3; evaluation of adhesive bond strength in optoelectronic subassemblies after 500–1000 shock cycles; screening of conformal coating integrity on aerospace avionics; and verification of hermetic seal performance in MEMS pressure sensors per MIL-STD-883 Method 1010.8. Its reproducible step-change profile makes it particularly effective for identifying early-life failure mechanisms not revealed by gradual ramp testing.
FAQ
What is the typical temperature transition time between zones?
Standard transfer time is ≤15 seconds for all models; actual measured values depend on payload mass and thermal inertia—validated during factory acceptance testing.
Can the chamber operate continuously for extended qualification tests?
Yes—designed for unattended 24/7 operation with redundant compressor staging, oil-level monitoring, and predictive maintenance alerts via serial diagnostics port.
Is humidity control available as an option?
No—this is a dry thermal shock system. For combined temperature/humidity shock, refer to the OK-THS Series Humidity-Thermal Shock Chambers.
Does the system support programmable dwell times and cycle counts?
Yes—up to 999 cycles with independent dwell settings (1 min to 999 min per zone) and customizable ramp rates within physical limits.
Are validation services and IQ/OQ documentation included?
Factory-installed validation kits and third-party IQ/OQ execution support are available as optional add-ons—not included in base configuration.
