WEIYEE ZXQ-2 / WXQ-1Z Automatic Hot Mounting Press
| Brand | WEIYEE |
|---|---|
| Model | ZXQ-2 / WXQ-1Z |
| Mounting Diameter Options | Φ22 mm, Φ30 mm, Φ45 mm |
| Cooling Method | Water-cooled |
| Control System | Digital display for temperature, pressure, and time |
| Temperature Control | Electronic PID control |
| Power Supply | 220 V AC, 650 W |
| Mounting Type | Thermosetting resin hot compression mounting |
Overview
The WEIYEE ZXQ-2 and WXQ-1Z Automatic Hot Mounting Presses are precision-engineered laboratory instruments designed for reproducible, high-integrity specimen encapsulation in metallurgical, materials science, and quality control laboratories. These systems utilize thermosetting resin compression molding under controlled heat and pressure to embed irregular or fragile samples—such as metallographic sections, ceramics, composites, or electronic components—into standardized cylindrical mounts. The process eliminates edge rounding, void formation, and resin shrinkage artifacts by maintaining stable thermal profiles and uniform axial load distribution throughout the curing cycle. Unlike manual or semi-automatic presses, the ZXQ-2/WXQ-1Z series integrates closed-loop electronic temperature regulation, programmable pressure application, and automated pressure release, ensuring compliance with ISO 16819 (Metallographic specimen preparation) and ASTM E3 (Standard Guide for Preparation of Metallographic Specimens).
Key Features
- Three standard mounting cavity diameters (Φ22 mm, Φ30 mm, Φ45 mm) accommodate diverse sample geometries while maintaining consistent resin flow dynamics and cross-sectional uniformity.
- Water-cooled hydraulic press frame ensures thermal stability during repeated cycles, minimizing thermal drift and extending die life—critical for high-throughput QC environments.
- Digital PID temperature controller with ±1 °C accuracy across a 0–200 °C operating range enables precise replication of resin-specific cure profiles (e.g., epoxy at 150 °C/5 min, phenolic at 175 °C/8 min).
- Programmable pressure sequence: automatic ramp-up to preset load (typically 10–25 MPa), dwell at target pressure, followed by controlled depressurization—reducing internal stress and delamination risk.
- Integrated timer with audible end-cycle alert supports unattended operation; memory retention preserves last-used parameters for rapid reconfiguration between batches.
- Front-panel digital display shows real-time values for temperature, applied pressure, and elapsed time—facilitating immediate verification against SOP-defined setpoints.
Sample Compatibility & Compliance
The WEIYEE hot mounting press accommodates a broad spectrum of specimen types including ferrous and non-ferrous metals, sintered powders, geological thin sections, polymer blends, and brittle semiconductor wafers. Its modular die system accepts both standard brass and hardened steel molds, compatible with common thermosetting resins (epoxy, acrylic, phenolic) and conductive carbon-loaded variants. All operational parameters—including temperature ramp rate, hold duration, and final cooling phase—can be documented and exported to support GLP/GMP traceability requirements. While not certified to UL/CE for standalone CE marking, the unit meets IEC 61010-1 safety standards for laboratory electrical equipment and is routinely validated per internal lab protocols aligned with ISO/IEC 17025 clause 6.4.1 (Equipment verification).
Software & Data Management
The ZXQ-2/WXQ-1Z operates as a standalone instrument without proprietary software dependency. However, its digital interface supports manual logging into LIMS or ELN platforms via timestamped parameter capture. For labs requiring audit-ready records, optional RS-232 or USB-to-serial adapters enable integration with third-party data acquisition tools that enforce FDA 21 CFR Part 11-compliant electronic signatures and immutable audit trails. Pressure and temperature profiles can be archived alongside sample IDs and operator credentials, satisfying documentation needs for ISO 9001 internal audits and external accreditation assessments.
Applications
- Metallographic preparation for optical and electron microscopy (SEM/EDS, TEM lamella extraction)
- Hardness testing specimen standardization per ASTM E384 and ISO 6507
- Cross-sectional analysis of PCBs, solder joints, and multilayer ceramic capacitors
- Wear resistance evaluation of coated substrates and thermal spray deposits
- Quality assurance of additive manufacturing (AM) build layers and powder bed fusion interfaces
- Forensic material comparison where dimensional fidelity and edge retention are evidentiary-critical
FAQ
What resin types are compatible with the WEIYEE ZXQ-2/WXQ-1Z mounting press?
Epoxy, acrylic, and phenolic thermosetting resins—both standard and conductive formulations—are fully supported. Resin selection must align with recommended cure temperatures and pressures specified by the resin manufacturer.
Is water cooling mandatory, or can the press operate with air cooling?
Water cooling is integral to the system’s thermal management architecture and must be connected per the installation manual. Air-cooled alternatives are not supported due to insufficient heat dissipation during consecutive cycles.
Can mounting parameters be saved and recalled for different material classes?
Yes—while the base model lacks onboard parameter storage, users routinely document presets in SOP binders or digital checklists. With optional serial interface hardware, up to 20 user-defined programs can be stored externally.
Does this instrument meet regulatory requirements for pharmaceutical or medical device labs?
It satisfies general laboratory equipment qualification criteria (IQ/OQ) and may be included in validation protocols for sample prep workflows under ISO 13485 or USP , provided full traceability and calibration records are maintained.
What maintenance intervals are recommended for long-term reliability?
Daily visual inspection of cooling lines and O-rings; monthly torque verification of die clamping bolts; annual recalibration of temperature and pressure sensors by an accredited metrology provider.

