Zhengye XG5010 LED Package X-ray Non-destructive Inspection System
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG5010 |
| Pricing | Upon Request |
Overview
The Zhengye XG5010 LED Package X-ray Non-destructive Inspection System is an industrial-grade microfocus X-ray imaging platform engineered for high-contrast, real-time internal structural analysis of LED packaging assemblies. Utilizing transmission X-ray radiography with a sealed microfocus X-ray source (typical focal spot size ≤ 5 µm), the system generates high-resolution projection images based on differential X-ray attenuation across material interfaces—enabling non-invasive visualization of wire bonds, die attach voids, lead frame misalignments, encapsulant delamination, and solder joint integrity. Designed for integration into QC/QA workflows in LED manufacturing, the system supports both offline failure analysis and inline process verification, delivering quantitative image data compatible with root cause investigation per IPC-A-610, J-STD-001, and JEDEC JESD22-A111 standards.
Key Features
- Triaxial motorized motion control: Independent X-, Y-, and Z-axis movement of the X-ray tube and image intensifier, driven by precision stepper motors coupled with ground滚珠丝杆 (ball screw) mechanisms for sub-micron repeatability and vibration-damped positional stability.
- CNC programmable inspection: Stores and recalls multi-point scanning trajectories; enables repeatable, batch-consistent inspection protocols for low-to-medium volume production runs without manual repositioning.
- Intuitive navigation interface: Large real-time preview window with click-to-move functionality—select any region-of-interest (ROI) on the live radiograph to automatically drive the stage to optimal geometric magnification and focus position.
- Digital image processing engine: Supports real-time contrast enhancement, edge sharpening, dynamic range compression, noise reduction, and grayscale histogram equalization; exports images in TIFF, PNG, and DICOM-compliant formats.
- Integrated automated measurement & pass/fail logic: Custom-developed software module performs dimensional metrology (e.g., bond wire length, solder thickness, cavity depth), detects anomalies via pixel-intensity thresholding and morphology-based segmentation, and outputs binary classification results with timestamped audit logs.
Sample Compatibility & Compliance
The XG5010 accommodates standard LED package formats including SMD (e.g., 2835, 3030, 3535), COB (Chip-on-Board), and ceramic-based high-power packages up to 150 mm × 150 mm footprint. Sample height clearance supports substrates up to 80 mm tall. The system complies with IEC 61000-6-3 (EMC emissions), IEC 61000-6-2 (immunity), and meets Class I radiation safety requirements per GBZ 138–2019 (Chinese national standard for industrial X-ray equipment). Optional lead shielding enclosures and interlocked safety curtains are available to satisfy local regulatory installation requirements. All operational parameters—including kV, µA, exposure time, and magnification—are logged with user ID and timestamp to support GLP/GMP traceability and FDA 21 CFR Part 11–compliant electronic record retention when configured with audit trail enabled.
Software & Data Management
The proprietary Zhengye X-Ray Vision Suite provides a Windows-based GUI with dual-mode operation: manual exploration mode for R&D and FA labs, and automated recipe-driven mode for production floor deployment. Software features include DICOM import/export, ROI-based measurement reporting (with statistical summary across batches), customizable pass/fail criteria tables, PDF report generation with embedded images and metadata, and SQLite-backed local database storage. Remote diagnostics and firmware updates are supported via secure HTTPS API. Data export supports CSV for statistical process control (SPC) integration and XML for MES/ERP linkage. Audit trails capture all user actions, parameter changes, and result modifications—fully compliant with ISO 17025 documentation requirements for accredited testing laboratories.
Applications
- LED packaging quality assurance: Detection of broken or lifted bond wires, insufficient die attach coverage, silver paste voids, and epoxy cracking.
- Failure analysis (FA) of field-return units: Correlation of internal defects with electrical test failures (e.g., open-circuit, thermal runaway).
- Process validation for reflow soldering, wire bonding, and molding steps—supporting DOE studies and capability analysis (Cp/Cpk).
- Comparative analysis of alternative encapsulants or substrate materials under thermal cycling stress.
- Support for AEC-Q102 qualified automotive LED component qualification through serial defect mapping and trend analysis over production lots.
FAQ
What is the maximum detectable void size within die attach layers?
Detection sensitivity depends on material density contrast, geometric magnification, and exposure settings; typical resolution for void detection in Ag-filled epoxy is ≥ 25 µm at 10× magnification.
Does the system support automated defect classification using AI algorithms?
The base software includes rule-based classification; optional AI-assisted pattern recognition modules (trained on customer-supplied defect libraries) can be deployed via SDK integration.
Is the XG5010 suitable for use in cleanroom environments?
Yes—the system is rated IP20 and can be equipped with ESD-safe components and stainless-steel housings to meet ISO Class 5–7 cleanroom compatibility requirements.
Can the system be integrated with factory automation systems?
It offers Modbus TCP and OPC UA interfaces for PLC communication, as well as trigger-in/trigger-out I/O for synchronization with conveyor belts or robotic handlers.
What radiation safety certifications does the XG5010 hold?
It conforms to GBZ 138–2019 and is CE-marked for electromagnetic compatibility; full Type Approval documentation is provided for regional registration (e.g., FDA 510(k), Health Canada license application support).
