FISCHERSCOPE MMS PC2 Desktop Coating Thickness Gauge for PCB Copper Plating Measurement
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MMS PC2 |
| Pricing | Upon Request |
Overview
The FISCHERSCOPE® MMS PC2 is a modular, high-precision desktop measurement system engineered for non-destructive thickness analysis of metallic coatings—including copper plating on printed circuit boards (PCBs)—as well as material property characterization. Designed and manufactured in Germany, the instrument employs multiple physical measurement principles—including eddy current (SIGMASCOPE®), magnetic induction (PERMASCOPE®), beta backscatter (BETASCOPE®), and phase-sensitive eddy current (PHASCOPE®)—to deliver traceable, repeatable results across diverse substrate-coating combinations. Its primary application in PCB manufacturing focuses on simultaneous, independent quantification of surface copper (face copper) and through-hole copper (via copper) thickness—critical parameters governing current-carrying capacity, thermal dissipation, and via reliability per IPC-6012 and IPC-4552A standards. The system operates under controlled environmental conditions and complies with ISO 2178, ISO 2360, ISO 4525, and ASTM B499 for coating thickness verification.
Key Features
- Modular architecture supporting up to eight interchangeable probes—enabling concurrent measurement of face copper and hole copper on multi-layer PCBs without cross-talk or signal interference.
- Integrated Windows® CE-based touchscreen interface with 800 × 480 resolution LCD, providing intuitive navigation, real-time data visualization, and on-device statistical evaluation (mean, std. dev., min/max, Cp/Cpk).
- Expandable functionality via seven embedded measurement modules: SIGMASCOPE® (eddy current for non-ferrous conductive layers), PERMASCOPE® (magnetic induction for ferromagnetic substrates and ferrite content), BETASCOPE® (beta backscatter for thin metallic coatings <1 µm), PHASCOPE® (phase-resolved eddy current for layered systems), DUPLEX (dual-method correlation), NICKELSCOPE® (Ni/Fe differentiation), and SR-SCOPE® (substrate-insensitive surface copper measurement on FR-4 laminates).
- Rugged industrial-grade chassis with vibration-damped base, ESD-safe housing, and temperature-stabilized probe electronics—ensuring long-term calibration stability in production lab environments.
- Full compliance with GLP/GMP documentation requirements: audit trail logging, user access levels (admin/operator), electronic signatures, and 21 CFR Part 11–ready configuration options available via optional firmware upgrade.
Sample Compatibility & Compliance
The MMS PC2 accommodates rigid and flexible PCBs ranging from 0.2 mm to 6.0 mm in thickness, including standard FR-4, polyimide, and ceramic substrates. It measures copper layers from 0.1 µm to 200 µm (depending on module and probe selection), with sub-micron resolution for face copper and axial profiling capability for plated through-holes down to 0.3 mm diameter. All measurements adhere to IPC-TM-650 Test Methods 2.2.17 (eddy current) and 2.2.18 (magnetic induction), and are validated against NIST-traceable reference standards. System validation kits—including certified Cu-on-epoxy and Cu-on-steel foils—are supplied with each unit for daily performance verification per ISO/IEC 17025 internal quality procedures.
Software & Data Management
The included FISCHER DataCenter software (v5.x) provides full bidirectional communication with the MMS PC2 via USB or Ethernet. It supports automated report generation in PDF/Excel formats compliant with ISO 9001 and IATF 16949 requirements, including SPC charts (X̄/R, Cpk), trend analysis, and batch-level pass/fail flagging based on user-defined tolerances. Raw measurement files (.fcd) retain full metadata—operator ID, timestamp, probe serial number, calibration certificate ID, and environmental sensor readings (temperature/humidity). Data export conforms to ASTM E1447 and is compatible with MES/SPC platforms such as Siemens Opcenter, Rockwell FactoryTalk, and custom SQL databases via ODBC driver.
Applications
- Quantitative verification of electroplated copper thickness on outer and inner PCB layers—both planar surfaces and barrel walls of microvias and blind vias.
- Process control during pattern plating, panel plating, and additive manufacturing post-processing of embedded traces.
- Quality assurance of solder mask (LPI) thickness over copper—using PERMASCOPE® module with low-frequency induction for dielectric layer estimation.
- Conductivity mapping of copper foil to detect annealing inconsistencies or grain boundary variations affecting etch uniformity.
- Iron content analysis in austenitic stainless steel fixtures used in PCB handling jigs—ensuring non-magnetic compatibility per MIL-STD-130.
- Multi-layer stack-up validation: simultaneous measurement of Ni underplate, Au flash, and OSP on edge connectors—without destructive cross-sectioning.
FAQ
Can the MMS PC2 measure both face copper and hole copper in a single setup?
Yes—the system supports dual-probe synchronization using SIGMASCOPE® and SR-SCOPE® modules, enabling simultaneous acquisition of surface and through-hole copper thickness with independent calibration curves and zero crosstalk.
Is probe calibration required for each PCB stack-up configuration?
No—calibration is performed on reference standards traceable to national metrology institutes; once validated, the same probe configuration remains valid across all FR-4, polyimide, and metal-core PCBs within specified thickness and conductivity ranges.
Does the system support automated reporting for ISO/TS 16949 audits?
Yes—DataCenter generates fully compliant inspection reports with revision-controlled templates, electronic signatures, and immutable audit logs meeting Clause 8.6.2 requirements.
What is the minimum via diameter measurable with standard probes?
With the optional MMS-PC2-VIA probe kit (part no. 605-620), axial profiling is supported down to 0.3 mm drilled holes with ±0.1 µm repeatability at 95% confidence.
Can the instrument be integrated into an Industry 4.0 production line?
Yes—via OPC UA server add-on (optional), the MMS PC2 publishes real-time measurement data, status flags, and diagnostic codes to SCADA and MES systems without proprietary middleware.
