Hefei Kejing Conductive Graphene Powder

Overview

Hefei Kejing Conductive Graphene Powder is a high-purity, surface-engineered graphene material designed for functional integration into conductive composites, energy storage systems, and anti-static coatings. Unlike conventional carbon additives such as carbon black or graphite flakes, this grade leverages the intrinsic two-dimensional electronic structure of graphene to achieve significantly lower percolation thresholds—typically below 3 wt% in polymer matrices—while preserving mechanical integrity and chemical stability. Its synthesis adheres to controlled exfoliation and defect-minimized reduction protocols, ensuring reproducible charge-carrier mobility and minimal interfacial resistance at filler–matrix boundaries. The material operates on the principle of electron delocalization across sp²-hybridized carbon lattices, enabling efficient charge transport pathways even at low volumetric loading. It is not an instrument or measurement device; rather, it functions as a critical functional raw material within B2B industrial formulation workflows—particularly where electromagnetic interference (EMI) shielding, electrostatic dissipation (ESD), or enhanced electrode kinetics are required.

Key Features

• Low percolation threshold (<3 wt%) in thermoplastic, thermoset, and water-based coating systems—reducing raw material cost and minimizing viscosity impact during processing.
• Engineered surface chemistry ensures compatibility with common dispersants and coupling agents, facilitating uniform distribution via high-shear mixing, three-roll milling, or ultrasonication.
• Thermally stable up to 400 °C in inert atmosphere; retains >90% of initial conductivity after 500 cycles in Li-ion battery anode configurations (tested per ASTM D7856).
• Non-oxidizing, non-corrosive morphology—no catalytic degradation of polymer backbones or electrolyte solvents under standard processing conditions.
• Consistent batch-to-batch performance validated by BET surface area, laser diffraction particle sizing (Malvern Mastersizer), and four-point probe resistivity measurements.

Sample Compatibility & Compliance

This graphene powder is compatible with epoxy, polyurethane, acrylic, and PVC resin systems; demonstrates stable dispersion in NMP, DMF, and aqueous surfactant solutions; and integrates effectively into slurry formulations for LiCoO₂, NMC, and silicon-based anodes. It complies with RoHS Directive 2011/65/EU (restricted substances below threshold limits) and meets REACH Annex XIV pre-registration requirements. While not classified as hazardous under GHS for standard packaging volumes (<3 m³), it is designated UN 3088, Class 4.2 (self-heating solid, n.o.s.) when shipped in bulk containers exceeding 3 m³—requiring UN-certified III-class packaging, thermal monitoring during transit, and documentation per IMDG Code Chapter 4.1 and IATA Dangerous Goods Regulations Section 2.6. Safety Data Sheet (SDS) conforms to ISO 11014 and OSHA HazCom 2012 standards.

Software & Data Management

As a physical material—not a digital instrument—this product does not incorporate embedded firmware, connectivity, or proprietary software. However, its technical specifications are fully traceable through certified third-party analytical reports (available upon request), including: XRD phase identification, Raman spectroscopy (I_D/I_G ratio < 0.3), TGA weight-loss profiles, and SEM/EDS elemental mapping. All lot-specific QC data are archived for 5 years and accessible via secure client portal under GLP-aligned documentation protocols—including audit trails, analyst signatures, instrument calibration logs (per ISO/IEC 17025), and deviation records.

Applications

• Conductive Coatings & Inks: Enables ESD-safe floor finishes, aerospace primer layers, and printed electronics substrates meeting ANSI/ESD S20.20 and IEC 61340-5-1 standards.
• Lithium-Ion Battery Electrodes: Applied as conductive additive in cathode (e.g., LFP, NMC811) and anode (Si/C, hard carbon) slurries to reduce interfacial impedance and improve C-rate capability (validated per IEEE 1625 and UL 1642).
• EMI Shielding Composites: Integrated into injection-molded housings for medical devices and 5G infrastructure enclosures achieving >30 dB attenuation in 30 MHz–10 GHz range (ASTM D4935).
• Antistatic Rubber & Plastics: Used in conveyor belts, fuel hoses, and cleanroom components requiring surface resistivity <10⁶ Ω/sq (per ASTM D257).

FAQ

Is this material suitable for food-contact or biomedical applications?

No—this grade is not manufactured under ISO 13485 or FDA 21 CFR Part 117 conditions and lacks biocompatibility certification (e.g., ISO 10993). It is intended exclusively for industrial formulation use.

What dispersion methods are recommended for high-viscosity epoxy resins?

Three-roll milling (gap ≤15 µm) followed by degassing at 60 °C/−0.1 MPa yields optimal dispersion homogeneity; sonication (>400 W, 30 min, pulsed mode) is acceptable for lab-scale trials but may induce lateral size reduction.

Does the product require inert-gas handling during storage?

Ambient dry storage is sufficient if sealed under nitrogen in HDPE/Al-laminate pouches; long-term (>12 months) storage above 25 °C or >60% RH may increase moisture uptake and reduce interfacial adhesion in composite matrices.

Can conductivity be further enhanced via thermal annealing post-processing?

Yes—annealing at 800 °C for 1 h under Ar/H₂ (5%) reduces residual oxygen groups and improves crystallinity, typically increasing bulk conductivity by 20–40%; however, this step must be performed prior to matrix incorporation to avoid polymer degradation.