Oxford Instruments Etch System
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Etch |
| Pricing | Upon Request |
Overview
The Oxford Instruments Etch System is a high-precision, application-focused dry etching platform engineered for advanced semiconductor process development and production-scale R&D. Leveraging decades of expertise in plasma physics and reactive ion etching (RIE), inductively coupled plasma (ICP) etching, and specialized techniques such as Bosch deep silicon etching and cryogenic etching, this system delivers exceptional process control, repeatability, and material-specific selectivity. Designed for laboratories and pilot lines engaged in compound semiconductor fabrication, MEMS/NEMS development, photonic integrated circuit (PIC) processing, and next-generation power device research, the Etch platform supports both fundamental process optimization and transferable工艺 recipes compliant with industrial manufacturing standards.
Key Features
- Multi-mode plasma source architecture supporting RIE, ICP, and hybrid RIE/ICP operation for tunable ion energy and radical flux control
- Configurable chamber design accommodating 100 mm to 200 mm wafers, with optional load-lock integration for high-throughput or contamination-sensitive processes
- Advanced endpoint detection via optical emission spectroscopy (OES) and real-time mass spectrometry (optional), enabling precise layer-by-layer etch termination
- Temperature-controlled electrostatic chuck (ESC) with liquid nitrogen cooling capability for cryo-etching of Si, SiGe, and III–V materials
- Gas delivery system with up to eight independently controlled MFCs, supporting complex chemistries including Cl2, BCl3, SF6, C4F8, HBr, O2, CHF3, and Ar-based mixtures
- Modular hardware architecture allowing field-upgradable RF matching networks, vacuum pumping configurations (turbo + dry pump), and chamber liners tailored to aggressive halogen or fluorine chemistries
Sample Compatibility & Compliance
The Etch System demonstrates broad compatibility across elemental, compound, and emerging semiconductors — including Si, SiC, GaN, AlN, AlGaN, InP, InGaAsP, GaAs, GaSb, InSb, ZnSe, LiNbO3, LiTaO3, PZT, and GST — as well as metals (Al, Au, Cr, Cu, Mo, Ni, Pt, Ti, Ta, W), dielectrics (SiO2, SiNx, Al2O3, Ta2O5, BCB), and polymers (PMMA, PDMS, PI, photoresists). Process recipes are developed and validated in accordance with ISO/IEC 17025-accredited application laboratories. The system supports documentation workflows aligned with GLP and GMP requirements, including full audit trails for recipe changes, parameter logging, and operator authentication — facilitating compliance with FDA 21 CFR Part 11 where electronic records are employed.
Software & Data Management
Oxford Instruments’ proprietary etch control software provides intuitive recipe management, real-time plasma monitoring, and automated process sequencing. All system parameters — RF power, bias voltage, gas flows, pressure, temperature, and endpoint signals — are logged with timestamped metadata at millisecond resolution. Data export conforms to SEMI E10/E129 standards, enabling seamless integration into factory MES platforms. Optional remote diagnostics and predictive maintenance modules utilize encrypted TLS communication for secure off-site support. Software architecture supports multi-user role-based access control (RBAC), ensuring traceability of operational actions per ISO 9001 and internal quality protocols.
Applications
- High-aspect-ratio trench etching for MEMS accelerometers and gyroscopes using Bosch or cryogenic Si etch processes
- Anisotropic AlGaN/GaN gate recess etching for high-electron-mobility transistors (HEMTs)
- Low-damage ICP etching of InP-based photonic waveguides and quantum cascade laser structures
- Deep etching of SiC substrates for vertical power diodes and MOSFETs
- Sub-10 nm critical dimension (CD) control in TiN and WSi hard mask patterning for advanced logic nodes
- Selective removal of PMMA and BCB planarization layers in 3D integration and wafer bonding applications
- Surface functionalization and sidewall passivation during nanostructure fabrication using tailored gas chemistries
FAQ
Is the Etch System suitable for both R&D and pilot-line production environments?
Yes — its modular design, recipe portability, and process stability make it appropriate for technology transfer from lab-scale development to pre-production qualification.
Can Oxford Instruments provide application-specific process development support?
Yes — our global network of application engineers offers on-site and remote process optimization, including DOE-based etch rate/selectivity/roughness characterization and cross-platform recipe migration.
Does the system comply with international safety and electromagnetic compatibility standards?
All configurations meet CE marking requirements per EN 61000-6-2 (immunity) and EN 61000-6-4 (emissions), as well as EN 61010-1 for electrical safety in laboratory equipment.
What level of after-sales service and spare parts availability is offered?
Oxford Instruments provides comprehensive technical support, preventive maintenance contracts, and guaranteed spare parts availability for ≥10 years post-system discontinuation.
Are custom chamber configurations or automation interfaces available?
Yes — options include robotic wafer handling, SECS/GEM interface, and bespoke liner/coating solutions for highly corrosive chemistries.
