Assembly & Packaging Equipment
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| Brand | RKD |
|---|---|
| Origin | USA |
| Model | RA-880 Laser Decapsulation System |
| Application | Semiconductor Plastic Encapsulant Removal |
| Compliance | Designed for ISO/IEC 17025-aligned failure analysis labs |
| Software Control | Windows-based real-time co-focal imaging & programmable laser scanning platform |
| Laser Type | Q-switched Nd:YAG (1064 nm) with variable pulse width and energy modulation |
| Focus Control | Auto-focus sensor with programmable depth-of-field (DOF) adjustment |
| Imaging | Integrated high-resolution coaxial CCD with 10×–50× optical zoom and real-time overlay of scan path |
| Pattern Definition | Vector-based graphical interface supporting DXF, JPEG, BMP import |
| Energy Management | Closed-loop pulse energy monitoring with ±2% stability |
| Reproducibility | <±3 µm positional repeatability across >1000 cycles |
| Maintenance | Solid-state laser source |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | DSM8/200 Gen2 |
| Measurement Principle | Dual-microscope optical alignment metrology with TIS-compensated image registration |
| Accuracy | ≤ 0.2 µm (after TIS compensation) |
| Configuration Options | Manual loading (DSM8 Gen2) / Robotic handling with custom chuck (DSM200 Gen2) |
| Illumination Options | Visible + optional IR illumination (for through-silicon feature imaging) |
| Software Platform | Cognex PatMax®-powered automated image analysis with recipe-driven operation |
| Compliance Context | Designed for GLP/GMP-aligned semiconductor process development and high-reliability packaging workflows |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Type | Manual Cleaving Instrument |
| Model | Small Sample Cleaver |
| Sample Width Capacity | 3–15 mm |
| Sample Thickness Range | 200–900 µm |
| Cleave Platform Dimensions | ≤2 × 2 mm |
| Indent Length | 0.5 mm |
| Compatibility | Designed for use with PELCO® LatticeAx® (1 mm indent) |
| Mounting | Four magnetic fixation points |
| Portability | Handheld, volume ≈ 100 mm³ |
| Brand | Tops |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | TL-1 EX, TL-1 Plus |
| Laser Source | Pulsed Fiber Laser (Nd:YAG, 1064 nm) |
| Operation Mode | Q-switched Pulsed |
| Laser Pulse Width | Nanosecond Range |
| Beam Delivery | Precision Galvo Scanning System |
| Safety Class | Class 4 Laser Product (IEC 60825-1) |
| Compliance | CE, RoHS, FDA 21 CFR Part 1040.10 |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB10 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter Range | 17–75 µm (gold/aluminum) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Ultrasonic Power Output | 0–5 W |
| Bond Time | 0–10 s |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-Axis Stroke | 17 mm |
| Deep-Cavity Bond Head Clearance | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage Capacity | 100 recipes |
| Temperature Control Range | up to 250 °C (±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB16 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter | 17–75 µm (Au/Al) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-axis Travel | 17 mm |
| Motorized Y-axis Travel | 7 mm |
| Bond Head Depth | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage | 100 recipes |
| Temperature Control | up to 250 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions | 680 × 640 × 490 mm |
| Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |
| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |
| Brand | UniTemp |
|---|---|
| Origin | USA |
| Model | 2Z-HVS-200 |
| Vacuum Level | ≤1×10⁻⁶ hPa |
| Max Temperature | 450 °C |
| Programmable Steps | 100 per Recipe, 20 Recipes Stored |
| Optical Process Monitoring | 360° Quartz Viewing Cylinder |
| Cooling | Active Water-Cooled Lower Platen + External Closed-Loop Chiller Recommended (Optional Accessory WC-I) |
| Controller | Siemens SIMATIC® S7-1200 PLC with HMI Interface |
| Data Logging | Real-Time Temperature, Pressure, Gas Flow, and Time Stamping |
| Brand | UniTemp |
|---|---|
| Model | VSS-300 |
| Origin | Germany |
| Chamber Dimensions | 350 × 350 × 75 mm (expandable to 300 mm height) |
| Max Ramp-Up Rate | 150 K/min |
| Max Ramp-Down Rate | 120 K/min |
| Bottom Heating Power | 2 × 12-lamp arrays, 18 kW total |
| Cooling | Water-cooled graphite plate (310 × 310 mm) |
| Control System | SIMATIC PLC with 7" touchscreen HMI |
| Programmable Steps | 50 programs × 50 steps each |
| Process Gas Flow | Standard 1.5 sL/min MFC (up to 4 gas lines optional) |
| Vacuum Options | MPC (10 hPa) or RVP (10⁻³ hPa) |
| Power Supply | 3-phase + N + PE, 230 V, CEE 3×32 A |
| Weight | ~140 kg |
| Compliance | Designed for ISO 9001-compliant SMT manufacturing environments |
| Enclosure Material | Polished aluminum chamber walls (stainless steel optional) |
| Brand | Westech |
|---|---|
| Origin | USA |
| Model | 7476D |
| Bonding Angle Options | 45° & 90° (deep cavity) |
| Wire Diameter Range | 18–100 µm |
| Ribbon Dimensions | 0.0005 × 0.010 in or 0.001 × 0.010 in |
| Ultrasonic Power Output | 4 W |
| Bonding Force Control | Dual-range, programmable |
| Heating | Resistive tool heating |
| Motion Control | Direct-drive motor with programmable tail control |
| Platform | Adjustable height (0.625 in), 12 × 12 in |
| Display | LCD interface |
| ESD Protection | Standard |
| Deep Cavity Capability | ≥13 mm (1 in optional) |
| Software | Multi-device recipe storage |
| Compliance | ESD-safe architecture, designed for Class 100/ISO 5 cleanroom integration |
| Brand | XinSheng Technology |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (PRC) |
| Model | XSM-FA100 |
| Pricing | Available Upon Request |
| Brand | YCT |
|---|---|
| Origin | Taiwan |
| Model | WM5100 |
| Application | Semiconductor Wire Bonding Process Inspection |
| Sample Handling | Vacuum Chuck Platform |
| Software | QX3000 Metrology Suite |
| Compliance | Supports SECS/GEM Interface |
| User Interface | Bilingual (English & Chinese) |
| Measurement Automation | CAD-based Program Import, Auto-Focus, Pass/Fail Thresholding, Audit-Trail Enabled Reporting |