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| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | SCORPION FiS 640 |
| Maximum Test Points | 1024 |
| Board Size Capacity | 350 mm × 400 mm |
| Fixture Change Time | < 60 s |
| Operating System | Windows-based |
| Embedded Network Analyzer | Yes |
| Software Compatibility | Compatible with Acculogic Flying Probe Test (FPT) platforms |
| Footprint | 1050 mm × 1050 mm |
| Fixture Reusability | Supports legacy SCORPION iCT7000 fixtures |
| Programmable Power Supply Integration | Up to 4 external iTH 7000-grade units (optional) |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | SCORPION iCT7000 |
| Maximum Test Points | 8192 |
| Board Size Capacity | 350 mm × 400 mm |
| Fixture Change Time | < 60 s |
| Operating System | Windows-based |
| Embedded Network Analyzer | Yes |
| Software Compatibility | Flying Probe Tester (FPT) software formats |
| Power Integration | Up to 4 external high-performance programmable power supplies |
| Compliance | Designed for IPC-A-610, IPC-J-STD-001, and ISO 9001-aligned manufacturing environments |
| Interface Protocol | SMEMA-compatible (via optional iTH7000 handler integration) |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series |
| Configuration | Dual-Sided, Closed-Loop System |
| Maximum Probe Modules | 22 (top + bottom) |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Programmable Probe Angle | ±6° |
| Max PCB Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Tip Height | 45 mm |
| Tip Radius Range | 50–500 µm |
| Tip Profiles | Needle, Cup, Dome |
| Measurement Speed | Up to 1000 measurements/sec |
| Analog Test Capability | 4-wire per probe |
| Supported Test Modes | 2-wire, 4-wire, Quasi-4-wire, Powered Functional Test, Boundary Scan (JTAG), NetScan™ |
| Laser-Based Board Warpage Compensation | Yes |
| Vision System | High-Resolution Reference Camera with Advanced Image Processing |
| Motion Architecture | Frictionless Air-Gap Linear Shuttles |
| Compliance Framework | Supports GLP/GMP audit trails, ISO/IEC 17025 traceability workflows, and FDA 21 CFR Part 11–ready software logging (via Integrator™) |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980Dxi |
| Motion Control | Closed-loop linear motor shuttles |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Maximum Probes | 22 (top + bottom) |
| Programmable Probe Tilt | ±6° |
| PCB Max Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Height | 45 mm |
| Tip Radius Range | 50–500 µm |
| Tip Geometry Options | Needle, Cup, Dome |
| Analog Measurement Speed | Up to 1000 measurements/sec |
| Measurement Modes | 2-wire, 4-wire, quasi-4-wire |
| Stimulus/Measurement Resources | Dual independent channels |
| Supported Test Types | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), NetScan™ |
| Warpage Compensation | Integrated LaserScan™ and high-res fiducial camera |
| Software Platform | Integrator™ with motion control & measurement algorithms |
| Compliance Framework | Supports GLP/GMP audit trails, ASTM F2627 (for PCB test system validation), ISO/IEC 17025 traceability workflows |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | ACCULOGIC FLS980 Series |
| Pricing | Upon Request |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 |
| Configuration | Dual-Sided, Closed-Loop, Up to 22 Probes |
| Minimum Step Resolution | 1 µm |
| Positioning Repeatability | ±10 µm |
| Programmable Probe Tilt | ±6° |
| Max PCB Size | 813 × 965 mm (32″ × 38″) |
| Max Component Height | 85 mm |
| Max Probe Tip Radius | 50–500 µm |
| Analog Measurement Speed | Up to 1000 measurements/sec |
| 4-Wire Capability | Full per probe |
| Test Channel Count | Up to 128 non-multiplexed channels |
| Warpage Compensation | LaserScan + High-Resolution Vision |
| Compliance | Supports GLP/GMP audit trails, ASTM F2622 (for electronic assembly test systems), ISO/IEC 17025 traceability frameworks |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series III |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Maximum PCB Size | 813 × 965 mm (32" × 38") |
| Programmable Probe Angle | ±6° |
| Max. Probe Count (Top + Bottom) | 22 |
| Measurement Speed | Up to 1000 measurements/sec |
| Electrical Test Capabilities | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), Powered Functional Test (up to GHz range) |
| Warpage Compensation | LaserScan-enabled Z-axis mapping |
| Vision System | High-resolution fiducial camera with advanced image processing |
| Compliance Support | ASTM F2413-18 (for test system validation), ISO/IEC 17025 traceability framework, GLP/GMP-aligned audit trail in Integrator™ software |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | FLS980 Series III |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Max. Configurable Probes | 22 (dual-sided) |
| Programmable Probe Tilt Angle | ±6° |
| Max. PCB Size | 813 × 965 mm (32″ × 38″) |
| Max. Component Height | 85 mm |
| Max. Probe Tip Radius Range | 50–500 µm |
| Analog Measurement Speed | up to 1000 measurements/sec |
| Test Channel Count (non-multiplexed) | up to 128 |
| Laser-Based Board Warpage Compensation | Yes |
| Vision System | High-resolution fiducial camera with advanced image processing |
| Compliance | Designed for GLP/GMP-aligned test environments |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | MA300 Gen3 |
| Wafer Size Support | 200 mm & 300 mm |
| Alignment Accuracy (Top-Side) | ±0.5 µm |
| Alignment Modes | Top-Side, Bottom-Side, Infrared (IR) |
| Exposure Method | Contact/Near-Contact Photolithography |
| Optical System | MO Exposure Optics® |
| Application Focus | Advanced Packaging (TSV, RDL, Bumping), MEMS, LED, Power Devices, WLP, Flip-Chip |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Automation Level | Full cassette-to-cassette robotic handling |
| Brand | SUSS |
|---|---|
| Origin | Germany |
| Model | MA200 Gen3 |
| Substrate Compatibility | ≤200 mm wafers & square substrates |
| Alignment Accuracy (Top-Side) | ≤0.5 µm |
| Resolution (Vacuum Contact Mode) | <0.8 µm |
| Resolution (Proximity Mode) | ≥3.5 µm |
| Exposure Optics | MO Exposure Optics® with telecentric illumination, HR/LGO mode switching, customizable filters & reduction kits for smaller wafers |
| Automation Level | Fully automated batch processing |
| Compliance | Designed for ISO Class 5–7 cleanroom integration, compatible with SEMI S2/S8 safety standards and GLP/GMP-aligned process documentation workflows |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SUSS MA200 Gen3 |
| Pricing | Upon Request |
| Brand | SUSS |
|---|---|
| Origin | Germany |
| Model | DSC300 Gen3 |
| Wafer Size Support | 300 mm (optional 200 mm) |
| Resolution | 2 µm (line/space) |
| Overlay Accuracy | ≤1.0 µm |
| Depth of Focus (DOF) | High (NA-tunable) |
| Substrate Compatibility | Si, glass, SiC |
| Max. Warp Tolerance | 2 mm bow |
| Optical System | Wynne-Dyson broadband imaging optics |
| Exposure Source | Broadband UV (g-, h-, i-line compatible) |
| Operation Mode | Full-field projection + continuous scanning |
| Automation Level | Fully automated platform |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB10 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter Range | 17–75 µm (gold/aluminum) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Ultrasonic Power Output | 0–5 W |
| Bond Time | 0–10 s |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-Axis Stroke | 17 mm |
| Deep-Cavity Bond Head Clearance | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage Capacity | 100 recipes |
| Temperature Control Range | up to 250 °C (±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | SUSS |
|---|---|
| Origin | Germany |
| Model | MA12 Gen3 |
| Type | Semi-Automatic Mask Aligner for Photolithography |
| Application Scope | Mask & Reticle Manufacturing, Wafer-Level Packaging, MEMS, R&D Prototyping |
| Alignment Accuracy | ≤ 1.0 µm (Optical, Off-Axis/IR Options Available) |
| Maximum Substrate Size | 200 mm |
| Max. Wafer Bow Tolerance | ±2 mm |
| Resolution | ≤ 2 µm (Line/Space, with Optimized Resist & Process) |
| Exposure Source | Broadband UV (i-line, g-line, h-line) |
| Numerical Aperture (NA) | Adjustable |
| DOF | Up to 150 µm (Configurable) |
| Software Compliance | Supports Audit Trail, User Access Levels, and Electronic Signature per FDA 21 CFR Part 11 Requirements |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB16 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter | 17–75 µm (Au/Al) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-axis Travel | 17 mm |
| Motorized Y-axis Travel | 7 mm |
| Bond Head Depth | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage | 100 recipes |
| Temperature Control | up to 250 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions | 680 × 640 × 490 mm |
| Weight | 42 kg |
| Brand | Acculogic |
|---|---|
| Origin | Canada |
| Model | Acculogic FLS980 |
| Type | Flying Probe Tester for PCBs |
| Positioning Repeatability | ±10 µm |
| Minimum Step Resolution | 1 µm |
| Programmable Probe Angle | ±6° |
| Max. Configurable Probes | 22 (dual-side) |
| Max. PCB Size | 813 × 965 mm (32″ × 38″) |
| Max. Component Height | 85 mm |
| Max. Probe Tip Radius Range | 50–500 µm |
| Measurement Speed | Up to 1000 measurements/sec |
| Electrical Test Capability | Analog, Digital, Mixed-Signal, Boundary Scan (JTAG), Powered Functional Test up to GHz range |
| Compliance | Supports GLP/GMP audit trails, ASTM F2413-18 (PCB test methodology reference), ISO/IEC 17025 traceability framework (via software logging) |
| Brand | SUSS MicroTec |
|---|---|
| Country of Origin | Germany |
| Model | MA/BA Gen4 |
| Type | Semi-Automated Mask Aligner & Thermal/Nanoimprint Lithography Platform |
| Application Scope | R&D, Pilot Production, High-Volume Prototyping |
| Compliance | ISO 9001 Certified Manufacturing, CE Marked, Compatible with ISO 14644-1 Class 5 Cleanroom Integration |
| Optical System | MO Exposure Optics® with Telecentric Illumination |
| Alignment Modes | Top-Side, Bottom-Side, IR Alignment |
| Optional Alignment Accuracy | ≤ 0.5 µm (with DirectAlign®) |
| Resolution | Down to 0.8 µm (hard/soft/vacuum contact mode) |
| Substrate Compatibility | 100–200 mm wafers, reticles, glass, quartz, SiC, GaAs, flexible substrates |
| Automation Level | Semi-Automated with SMILE™ Process Integration Framework |
| Software | LITHOGRAPH® v5.x with Audit Trail, User Role Management, Recipe Versioning, and GLP/GMP-Ready Data Logging |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Mounting Type | Desktop |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | ±2 µm (typical, under calibrated lab conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Z-Axis Stroke | 17 mm (motorized) |
| Placement Force Range | 10–150 cN·m (350 cN·m optional) |
| Placement Time | 1–10,000 ms (extendable to 20,000 ms) |
| Dispensing Capability | Optional adhesive dispensing module |
| Dip-Coating Function | Integrated |
| Vacuum Source | Onboard integrated vacuum pump |
| Motion Architecture | True orthogonal X-Y-Z kinematics |
| Tool Changer | Rotating nozzle turret |
| Programmable Recipes | Up to 100 stored programs |
| Operating Modes | Manual, semi-automatic, and step-by-step guided placement |
| Heating Stage | Optional temperature-controlled platform (up to 250 °C ±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | Nordson Dage |
|---|---|
| Origin | United Kingdom |
| Model | XD7500VR Jade FP |
| X-ray Tube Type | Open Transmission Tube |
| Operating Voltage Range | 30–160 kV |
| Target Power | 3 W |
| Feature Resolution | 950 nm (0.95 µm) |
| Geometric Magnification | Up to 1400× |
| System Magnification | Up to 4200× |
| Maximum Sample Dimensions | 736 × 580 mm |
| Detector Resolution | 1.33 MP |
| Compliance | CE, RoHS, ISO 9001-certified manufacturing environment |
| Software Platform | DAGE VisionX™ v5.x with GLP-compliant audit trail and FDA 21 CFR Part 11-ready configuration options |
| Brand | SUSS |
|---|---|
| Origin | Germany |
| Model | MJB4 |
| Substrate Size | Up to 100 mm |
| Alignment Accuracy | Sub-micron |
| Resolution | ≤ 0.5 µm (hard contact) to 2 µm (soft contact) |
| Exposure Modes | Soft Contact, Hard Contact, Vacuum Contact |
| Optical System | MO® Exposure Optics with Telecentric Illumination |
| Uniformity | >95% across field |
| Compatible Substrates | Fragile, III-V, Compound Semiconductors, Glass, Si, SOI, Flexible Foils (thickness up to 4 mm) |
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