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| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB10 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter Range | 17–75 µm (gold/aluminum) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Ultrasonic Power Output | 0–5 W |
| Bond Time | 0–10 s |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-Axis Stroke | 17 mm |
| Deep-Cavity Bond Head Clearance | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage Capacity | 100 recipes |
| Temperature Control Range | up to 250 °C (±1 °C) |
| Power Supply | 100–240 V AC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB16 |
| Bonding Methods | Wedge-Wedge, Ball-Wedge, Ribbon & Bump Bonding |
| Wire Diameter | 17–75 µm (Au/Al) |
| Ribbon Size | up to 25 × 250 µm |
| Ultrasonic Frequency | 62 kHz, PLL-controlled |
| Bond Force | 5–150 cNm (350 cNm optional) |
| Motorized Z-axis Travel | 17 mm |
| Motorized Y-axis Travel | 7 mm |
| Bond Head Depth | 16 mm |
| Bond Arm Length | 165 mm |
| Touchscreen Interface | 6.5" LCD |
| Program Storage | 100 recipes |
| Temperature Control | up to 250 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions | 680 × 640 × 490 mm |
| Weight | 42 kg |
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