MicroChem Corp
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| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Model | MMA(8.5)MAA |
| Solvent System | Ethyl Lactate |
| Viscosity Range | Adjustable via Concentration (Typical Spin-Coated Film Thickness: 50–500 nm) |
| Packaging Options | 500 mL, 1 L, 4 L, 20 L HDPE Bottles |
| Recommended Storage | 10–27 °C |
| Developer | MIBK:IPA (1:3 v/v) |
| Stripper | Remover PG |
| Diluent | A Thinner |
| Brand | MicroChem Corp |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Product Line | AZ1500 Series |
| Solvent System | Propylene Glycol Monomethyl Ether Acetate (PGMEA) |
| UV Sensitivity Range | 310–440 nm (i-, h-, g-line) |
| Recommended Development Time | AZ1500/AZ1514H: 50–60 s |
| AZ1500HS | 20–30 s |
| Compatible Developers | AZ 351B (1:4 dilution), 0.5% NaOH, AZ 726MIF |
| Film Thickness Range | 0.5–4.0 μm (spin-coated) |
| Storage Conditions | 0–25°C, sealed container, light-protected |
| Shelf Life | Batch-specific (see label: YYYY/MM/DD) |
| Compliance | Fully compatible with standard semiconductor cleanroom protocols and ISO Class 5–7 environments |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Variants | gL2000-L, gL2000-M, gL2000-H |
| Developer Options | gL Developer, gL Developer HR |
| Rinse Agent | gL Rinse |
| Stripper | gL Remover |
| Etch Resistance | Superior to PMMA |
| Resolution Capability | Sub-10 nm (under optimized e-beam conditions) |
| Tone | Negative |
| Processing | Aqueous-based development |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Model | PMGI/LOR |
| Type | Negative Tone Bilayer Lift-Off Resist |
| Thermal Glass Transition (Tg) | ~190 °C |
| Resolution Capability | ≤ 0.25 µm |
| Maximum Compatible Metal Thickness | > 3 µm |
| Developer | MicroChem 101 Developer |
| Stripper | MicroChem Remover PG |
| Diluent | MicroChem G Thinner |
| Recommended Storage Temperature | 4–27 °C |
| Process Ambient | 20–25 °C ±1 °C, 35–45% RH ±2% |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Type | Inkjet-Compatible Negative Tone Photoresist |
| Model | PriElex® SU-8 1.0 |
| Curing Temperature | <150 °C |
| Optical Transparency | High (UV–Visible Range) |
| Chemical Resistance | Excellent (against common acids, bases, and solvents) |
| Young’s Modulus | Low (~2–4 GPa, typical for flexible SU-8 derivatives) |
| Layer Compatibility | Single- and multi-layer stackable |
| Developer Compatibility | Standard SU-8 aqueous alkaline developers (e.g., Microposit®显影液 equivalents) |
| Printer Compatibility | Fujifilm Dimatix DMP-series inkjet platforms (e.g., DMP-2831, DMP-3000) |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Type | Photoimageable epoxy-based wafer bonding adhesive |
| Series | PermiNex™ 1000 and 2000 |
| Temperature Resistance | <200 °C cure |
| Resolution | High-resolution patterning |
| Aspect Ratio | Up to 3:1 |
| Developer Compatibility | Aqueous alkaline solutions |
| Substrate Adhesion | Silicon, glass, quartz, SiO₂, SiNₓ |
| Shelf Life Storage | 4–21 °C |
| Corrosivity | Low metal ion contamination |
| Conformality | Void-free, conformal interface |
| Edge Acuity | Sharp, crack-free pattern edges |
| Reliability | Qualified for HAST (JESD22-A110) and TCT (JESD22-A104) |
| Seal Integrity | High hermeticity post-bond |
| Process Compatibility | Compatible with dicing, laser welding, and backend packaging steps |