ZEISS
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| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | ATOS Q |
| Type | Optical 3D Coordinate Measuring System |
| Measurement Principle | Triple-camera triangulation with fringe projection (3-in-1 sensor head) |
| Weight | 4 kg (sensor head only) |
| Compliance | ISO 10360-8, VDI/VDE 2634 Part 2, ASTM E2924 |
| Software Platform | GOM Inspect Pro (with GD&T, mesh comparison, deviation analysis, and automated reporting) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Axiolab 5 Widefield Microscope |
| Dimensions (L×W×H) | ~304 mm × 210 mm × 357.5 mm (base unit without tube, part no. 430037-9011-000) |
| Operating Temperature | +10 °C to +40 °C |
| Relative Humidity | ≤75% at 35 °C (non-condensing) |
| Max. Altitude | 2,000 m |
| Ambient Pressure | 800–1,060 hPa |
| Pollution Degree | 2 |
| Protection Class | IP20 |
| Electrical Safety | Compliant with DIN EN 61010-1 / IEC 61010-1, CSA, UL |
| RF Emission | EN 55011 Class B |
| Immunity | DIN EN 61326/A1 |
| Power Supply | 100–240 V AC, 50–60 Hz |
| Power Consumption | ≤100 VA |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Manufacturer |
| Origin Category | Domestic |
| Model | BOSELLO MAX |
| Quotation | Upon Request |
| Detector Type | Flat-Panel Detector (FPD) |
| Scan Mode | Translation-Rotation (TR) |
| Inspection Volume | 1700 × 1700 × 2200 mm to 2600 × 2600 × 2600 mm |
| Sample Weight Capacity | 80 – 250 kg |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EVO |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model Range | Full-Series Gratings |
| Application System | Universal |
| Grating Configuration | Dual-Grating Mounting |
| Spectral Resolution | 0.5 nm (at 10 µm slit width) |
| Dispersion | 16 nm/mm |
| Wavelength Range | 190–1100 nm |
| Wavelength Accuracy | ±0.1 nm |
| F-number | F/4 |
| Stray Light | ≤0.1% T |
| [Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Lattice-SIM 3 / Lattice-SIM 5 |
| Imaging Principle | Structured Illumination Microscopy (SIM) with Lattice Light Sheet Integration |
| Resolution (XY) | down to 60 nm (with SIM² reconstruction and Plan-Apochromat 63×/1.40 oil DIC) |
| Optical Sectioning | Yes, via SIM-based optical slicing and TIRF |
| Modalities | SIM, SIM², TIRF, 3D-PALM, SMLM, Leap Mode, Burst Mode |
| Compatibility | Live-cell imaging, fixed specimens, organoids, embryonic tissues, 3D cultures, thick sections |
| Software Platform | ZEN Imaging Software (GLP/GMP-compliant audit trail, FDA 21 CFR Part 11-ready configuration available)] |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | LSM Lightfield 4D |
| Key Specifications | Excitation Wavelength Range: 405–740 nm |
| Max. Volumetric Acquisition Speed | 80 volumes/s |
| Spatial Resolution (X/Y) | 2.2–8.8 µm (dependent on objective & configuration) |
| Axial Resolution (Z) | 2.8–57 µm (deconvolution-optimized) |
| Voxel Size Range | 0.7×0.7×0.9 µm³ to 2.8×2.8×18 µm³ |
| Z-stack Depth Range | 109–1712 µm |
| Field of View | 20.4 mm |
| Recommended Objectives | C-Apochromat 40×/1.2 W Corr, Plan-Apochromat 40×/1.3 Oil DIC, LD LCI Plan-Apochromat 25×/0.8, Plan-Apochromat 20×/0.8, EC Plan-Neofluar 10×/0.5, among others |
| Compatible Platforms | ZEISS LSM 910 and LSM 990 mounted on Axio Observer stand |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ZEISS METROTOM CT |
| Price Range | USD 1 – 999,000 |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MultiSEM |
| Electron Beam Configuration | Hexagonal array of 91 beams |
| Landing Energy Range | 1.0–3.0 kV |
| Average Resolution (all beams) | ≤ 3.5 nm @ 1.0 / 1.5 / 3.0 kV |
| Resolution Uniformity | ≤ ±1 nm @ 1.0 / 1.5 / 3.0 kV and 12 µm pitch |
| Beam Pitch Options | 12 µm (standard), 15 µm (optional) |
| Pitch Uniformity | ≤ ±1% |
| Field of View (hexagonal long axis) | 132 µm (12 µm pitch) or 165 µm (15 µm pitch) |
| Per-Beam Current | ≥ 570 pA |
| Total Probe Current | ≥ 52 nA |
| Current Uniformity | ≤ +10% |
| Electron Source | Schottky field-emission gun |
| Filament Current Stability | ≤ 1% per hour |
| Beam Blanking | Electrostatic |
| Working Distance | 1.4 mm |
| Detector System | High-efficiency multi-channel secondary electron detection with projection optics |
| Maximum Scan Rate per Beam | 20 MHz |
| Pixel Size Range | 2–20 nm (12 µm pitch) |
| Image Stitching | Fully automated, 91-subimage hexagonal tiling with adjustable overlap |
| Stage Type | Precision stepper stage |
| Stage Travel (X/Y/Z) | 100 / 100 / 30 mm |
| Stage Repeatability (XY) | ≤ ±3 µm |
| Sample Exchange Time (with exchange chamber) | ≤ 5 min |
| Sample Dimensions (max) | 100 × 100 mm² (XY), ≤ 30 mm height, ≤ 0.2 kg mass, surface flatness ≤ 500 nm P–P over 100 µm |
| Vacuum System | Turbo-molecular pump (>260 L/s) + oil-free scroll pump |
| Control Hardware | ≥4-core 64-bit CPU, ≥32 GB DDR RAM, ≥1 TB HDD, dual 1 Gbit Ethernet |
| OS | Windows 10 (64-bit) |
| Image Acquisition Nodes | 12 rack-mounted computers (≥4-core 64-bit CPU, ≥32 GB DDR3, 1 Gbit + 10 Gbit Ethernet) |
| Software Platform | ZEN core interface with Shuttle & Find, API for custom workflow integration, distributed acquisition database, automated focus/astigmatism/detector balancing, ROI-driven auto-sectioning, continuous serial sectioning workflows, real-time system health monitoring (vacuum, alignment, beam stability) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MY 5000 |
| Compliance | ISO 7404, GB/T 6948 |
| Measurement Principle | Polarized Light Microscopy + Photometric Reflectance Quantification |
| Reflectance Resolution | ≤ 0.01% R<sub>max</sub> |
| Measurement Speed | ≥ 1,000 points/min |
| Minimum Measurable Pore Diameter | 5 µm |
| Temperature Compensation | Automatic, traceable to 20 °C reference |
| Data Output Formats | CSV, Excel, Word, PDF |
| Software Compliance | FDA 21 CFR Part 11–ready audit trail, GLP/GMP-compatible metadata logging |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Wafer Handling | Full 200 mm (8-inch) diameter |
| Imaging Mode | Field Emission Scanning Electron Microscopy (FE-SEM) |
| Primary Application | Semiconductor Process Defect Inspection & CD Metrology |
| Vacuum System | Differential pumping with cold trap |
| Stage Type | Motorized polar-coordinate stage with collision-avoidance logic |
| Detector Configuration | In-lens EsB, SE2, and STEM-in-SEM options |
| Operating Voltage Range | 0.1–30 kV |
| Resolution | ≤1.0 nm @ 1 kV (in-lens SE mode) |
| Software Platform | SmartSEM Engineering Edition with wafer map navigation and recipe-driven automation |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Stemi 508 Greenough 8:1 |
| Zoom Ratio | 8:1 (0.63×–5.0×) |
| Standard Magnification Range (with 10× eyepieces, no auxiliary lens) | 6.3×–50× |
| Extended Magnification Range (with interchangeable objectives & eyepieces) | 1.9×–250× |
| Working Distance | 35–287 mm |
| Resolution (Rayleigh criterion, test target) | up to 450 lp/mm (g = 2.2 µm) |
| Minimum Resolvable Structure | 1.1 µm |
| Maximum Field Diameter | 122.7 mm |
| Eyepiece Field Number | 23 mm |
| Interpupillary Distance Adjustment | 55–75 mm |
| Viewing Angle | 35° |
| Optional Imaging Ports | 100% beam split (Stemi 508 doc) or 50/50 permanent beam splitter (Stemi 508 trino), both with replaceable 0.5× C-mount adapter (60NC type) |
| Base Compatibility | M-series mechanical base (M and M LED variants), including integrated LED illumination electronics, fiber-optic coupling interfaces (2× M8), transmission stage interface (Ø84 mm), polarizer mounting interface (Ø45 mm), and central aperture (40 mm) |
| Stand Load Capacity | 5 kg |
| Focusing Stand Travel | 360 mm height / 190 mm vertical lift |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | SUPRA 1540 |
| Operational Age | 10 Years |
| Resolution | 2 nm @ 15 kV, 3 nm @ 1 kV |
| Magnification Range | 12× to 2,000,000× |
| Accelerating Voltage | 20 V – 30 kV (continuously adjustable) |
| Probe Current | 5 pA – 20 nA (optional extended range: 12 pA – 100 nA) |
| Chamber Dimensions | Ø330 mm × 270 mm (H) |
| Stage Motion | 5-axis motorized eucentric stage (X = 130 mm, Y = 130 mm, Z = 50 mm, Tilt = –3° to +70°, Rotation = 360° continuous) |
| Control System | SmartSEM software suite on Windows 7 platform, compatible with mouse, keyboard, and dedicated hardware control panel |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | GEMINI SUPRA 40 VP |
| Resolution | 1.3 nm @ 15 kV, 2.1 nm @ 1 kV, 5.0 nm @ 0.1 kV (Standard Mode) |
| Magnification Range | 12× – 900,000× |
| Accelerating Voltage | 0.02 – 30 kV |
| Beam Current | 4 pA – 10 nA (optional up to 20 nA) |
| Electron Source | Thermal Field Emission Gun (TFEG) |
| Detector Configuration | In-lens SE, ETSE, VPSE, STEM-in-SEM, and integrated Energy Dispersive X-ray Spectrometer (EDS) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Configuration | SUPRA 40VP + Oxford X-MaxN EDS + Symmetry EBSD |
| Operating Hours | ~6 years |
| Resolution | 1.0 nm @ 20 kV (SE), 2.0 nm @ 30 kV (VP mode) |
| Acceleration Voltage | 0.1–30 kV |
| Vacuum Mode Range | 2–133 Pa (variable pressure, 1 Pa step) |
| Probe Current | 4 pA–10 nA (up to 20 nA optional) |
| Chamber Dimensions | Ø330 mm × H270 mm |
| Stage Motion | 5-axis motorized (X/Y ±130 mm, Z 0–50 mm, Tilt −3° to +70°) |
| Magnification | 12×–900,000× |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Visioner 1 |
| Technology | Micro-Mirror Array Lens System (MALS™) |
| Max. Height Difference Coverage | 69 mm |
| Micro-Mirror Size | ~100 × 100 µm |
| Mirror Actuation | Independent rotation and lateral translation |
| EDoF Enhancement Factor | Up to 100× vs. conventional optical microscopy |
| Imaging Mode | Real-time, focus-free, full-field extended depth of field |
| Compliance | Designed for ISO/IEC 17025-aligned inspection environments, compatible with GLP/GMP documentation workflows |