IC Test & Handler Equipment
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| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-MPS-001 |
| Type | Temperature-Controlled Manual Probe Station |
| Operation | Manual |
| XY Travel Range | 70 mm × 70 mm (with 360° rotation) |
| Z-Axis Stroke | 65 mm |
| Sample Stage Dimensions | 600 mm × 600 mm × 200 mm |
| Max Load Capacity | 10 kg |
| Microscope Compatibility | Stereo or Metallurgical Microscope with C-mount interface |
| Eyepiece Magnification | 20× |
| Working Distance | 18.9–33.61 mm |
| Optical Magnification Options | 5×/10×/20×/50×/100× |
| Imaging Resolution | ≤1.2 µm |
| CCD Camera | 640×480 resolution |
| Vertical Lift Range | 0–50 mm (motorized, speed 0.02–4 mm/s) |
| Electrical Rating | 220 V AC, max 1 A |
| Max Bias Voltage Support | ±1500 V |
| Control PC | Intel i7-7500T, 16 GB DDR4, 256 GB SSD, Windows 10 OS |
| Display | 1920×1080 Full HD |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-PRO-001 |
| Operation Type | Fully Automatic |
| Platform Size | 60 cm × 60 cm |
| XY Travel Range | 50 mm × 50 mm |
| Z Travel | 200 mm |
| Max Sample Size | 65 mm × 65 mm |
| Max Sample Weight | 4 kg |
| CCD Magnification Options | 5×, 10×, 20×, 50× (long-working-distance objective) |
| Vertical Speed Range | 0.02–4 mm/s |
| Rotation | 360° motorized |
| Illumination | Coaxial ring + transmitted backlight |
| Control Interface | Integrated touchscreen (780 mm × 600 mm display), software-driven with manual override capability |
| Environmental Operating Range | 0–40 °C, ≤80% RH |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Model | ABN-PRO-002 |
| Operation Type | Fully Automatic |
| Probe Positioning Resolution | 1 µm |
| Integrated Vacuum Pump | Yes |
| Display | 27-inch 2K Full HD Monitor |
| Motorized Axes | X-Y-Z with Sample Stage Heating & Vacuum Chuck Control |
| Optical Imaging | Nikon CCD Camera (Visible to Near-IR) |
| RF Connectivity | Supported with Multiple RF Connector Types (SMA, K, V) |
| Probe Compatibility | GGB (USA), Korean OEM, and Domestic Probes |
| External Instrument Integration | Picosecond/Femtosecond Lasers, Raman, SHG, Photoconductivity Systems |
| Brand | Abner |
|---|---|
| Model | ABN-VPS-001 |
| Temperature Range | −190 °C to +300 °C |
| Environment Options | Ambient, Vacuum, Inert Gas (N₂/Ar) |
| Operation Mode | Fully Automatic |
| Probe Station Type | Vacuum-Compatible Thermal Probe Station |
| Motion System | Precision XYZ Motorized Stage with Thermal Drift Compensation |
| Microscope Compatibility | Stereo and Metallurgical Microscope Mounting Interface |
| Safety Features | Dual-Stage Over-Temperature Protection, Interlocked Vacuum & Cooling System |
| Compliance | Designed for GLP-compliant lab environments |
| Brand | Accretech (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | AP3000 / AP3000e |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Compliance | ISO Class 4 Cleanroom-Compatible Design |
| Structural Rigidity | High-stiffness granite base with active/passive vibration isolation |
| Alignment System | Integrated ITV (Image Tile Vision) for sub-micron probe-to-pad registration |
| Probe Capacity | Multi-site parallel probing capability |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | FP-2000 |
| Operation Type | Fully Automatic |
| Maximum Wafer Size | 300 mm (12-inch) |
| Sample Types | Bare Wafers, Thin Wafers, Singulated Dies, CSP Substrates on Dicing Frames |
| Alignment Capability | Auto-Wafer Alignment, Auto-Probe-to-Pad Alignment, Die-Level Position Correction Software |
| Brand | Accretech (ACCRETECH) |
|---|---|
| Origin | Japan |
| Model | UF200R |
| Wafer Size Capacity | 200 mm (8-inch) |
| Automation Level | Fully Automatic |
| Probe Station Type | RF Probe Station |
| Compliance | Designed for ISO Class 5 cleanroom environments |
| Structural Rigidity | High-stiffness chuck with ITV fine alignment system |
| Thermal Operation Range | Up to +150 °C |
| Key Software Capabilities | Inkless wafer mapping, multisite parallel probing, OTS optical auto-alignment |
| Motion Control | Upgraded servo-driven XYZθ stage with sub-micron repeatability |
| Application Domain | LSI/VLSI wafer-level parametric testing, RF device characterization, high-reliability IC qualification |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Model | UF190R / UF200R |
| Automation Level | Fully Automatic |
| Wafer Size Compatibility | 200 mm (8″) and 300 mm (12″) |
| Control Interface | Full-color TFT touchscreen HMI |
| Alignment System | Motorized auto-probe alignment with sub-micron repeatability |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Brand | ARS |
|---|---|
| Origin | USA |
| Model | PS-L |
| Product Category | Temperature-Controlled Probe Station |
| Operation Type | Semi-Automatic |
| Cooling Method | Open-Cycle Cryostat (Liquid He / Liquid N₂) |
| Base Temperature | ~4 K (with LHe) or ~77 K (with LN₂) |
| Temperature Range | 4–400 K (extendable to 500 K or 800 K) |
| Temperature Stability | < ±50 mK |
| Vacuum Chamber | 10-inch welded stainless steel |
| Radiation Shield | 8-inch nickel-plated oxygen-free copper (OFHC) |
| Sample Stage | 2.25-inch gold-plated OFHC, grounded (optional insulated or biased) |
| Microscope | 7:1 zoom, ≤3 µm resolution, coaxial/ring illumination, 24″ HD monitor |
| Vibration Isolation | Triple-stage, sample stage vibration < 100 nm |
| Probe Arms | Up to 8 manually driven 3D micropositioners (X: 2″, Y: 1–2″, Z: 0.5″, 5 µm sensitivity) |
| Temperature Monitoring | Four calibrated DT-670 sensors (including DT-670-CU-4M at sample proximity) and two heaters (50 W on stage, 100 W on shield) |
| Controller | Lake Shore LS336 4-channel temperature controller with cryostat interface cables |
| Optional Upgrades | 16:1 microscope, 4″ sample stage, RF/microwave probes (up to 67 GHz), fiber-optic probe arms, motorized positioning |
| Brand | ARS |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PSF-10-4 |
| Price Range | USD $65,000 – $130,000 |
| Product Category | Temperature-Controlled Probe Station |
| Operation Mode | Semi-Automatic |
| Temperature Range | 7 K – 400 K (configurable down to <4 K with DE215 cold head) |
| Vacuum Chamber | 10-inch welded stainless steel |
| Radiation Shield | 8-inch nickel-plated OFHC copper |
| Sample Stage | 2.25-inch gold-plated OFHC copper, thermally anchored to cold head |
| Optical Viewports | High-purity quartz window + sapphire cold shield window |
| Microscope | Standard 7:1 zoom optics (3 µm resolution, 89 mm working distance) |
| Probe Arms | Up to six 3-axis micromanipulators (manual drive, 2″ X / 1″ Y / 0.5″ Z travel, 5 µm sensitivity) |
| Cooling Method | Closed-cycle helium refrigeration (no liquid cryogens) |
| Vibration Performance | <1 µm total stage motion |
| Temperature Control | Four-channel precision controller with calibrated DT-670 series sensors (±12 mK accuracy), dual heating zones (50 W stage heater + 100 W radiation shield heater) |
| Compliance | Designed for ASTM F1788, ISO/IEC 17025-compliant lab environments |
| Brand | ARS |
|---|---|
| Origin | USA |
| Model | PSG-SM |
| Product Category | Cryogenic Temperature-Controlled Probe Station |
| Operation Mode | Semi-Automatic |
| Cooling Method | Dual-Cryocooler Closed-Cycle Refrigeration (DE210/DE215) |
| Base Temperature | <4 K |
| Temperature Range | 5 K–350 K (optional high-temp stage up to 800 K) |
| Magnetic Field | ±3 T vertical (optional ±6 T or vector magnet) |
| Vacuum Chamber | 11″ stainless steel |
| Sample Stage Diameter | 1.75″ (supports 2″ wafers) |
| Vibration Level | <1 µm RMS |
| Microscopy | Standard 7:1 zoom lens (3 µm resolution), optional 16:1 (2 µm resolution) |
| Probe Arm Configurations | DC/LF, RF (up to 67 GHz), optical fiber (UV–Vis–IR) |
| Temperature Stability | <50 mK |
| Pump-Down Time | ~120 min |
| Cool-Down Time to 10 K | ~5 h (DE210S) |
| Brand | ART Photonics |
|---|---|
| Origin | Germany |
| Model | ATR-P-D-6-30-150/50 |
| Tip Material | Diamond (D) |
| Prism Diameter | 6 mm |
| Path Length | 30 µm |
| Fiber Core Diameter | 150 µm |
| Cladding Diameter | 50 µm |
| Probe Shaft Length | 300 ± 5 mm |
| Total Length | 1.5 ± 0.05 m |
| Fiber Length | 1.2 m |
| Connector Type | SMA905 |
| Sheath Material | Stainless Steel with Polymer Coating |
| Shaft Material | Hastelloy C22 |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | EPS-300 / EPS-500 / EPS-1000 |
| Type | Manual probe station |
| Category | Temperature-controlled probe station |
| Compliance | Designed for ISO/IEC 17025-compliant lab environments, compatible with ASTM F1768 and SEMI S2/S8 safety standards |
| Software Interface | Analog signal output (BNC), optional digital I/O for external controller integration |
| Stage Travel | X/Y fine adjustment via micrometer drives (10 µm resolution), Z-axis manual lift with locking mechanism |
| Maximum Wafer Size | EPS-300: up to 4″ |
| EPS-500 | up to 6″ |
| EPS-1000 | up to 8″ |
| Thermal Options | Optional heated chuck (−40 °C to +200 °C) available on EPS-500 and EPS-1000 |
| Vacuum Compatibility | Standard vacuum-compatible baseplate (10⁻³ mbar) for glovebox or controlled-atmosphere integration |
| Brand | EMU |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Batch Aligner and Elevator |
| Wafer Diameters Supported | 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Alignment Reference | Flat or Notch |
| Lifting Mechanism | Dual Non-Vacuum Comb Lifters |
| Illumination | Configurable LED (Standard: Red or White) |
| Substrate Compatibility | Si, SiC, GaN, and Other Compound Semiconductors |
| Interface | Touchscreen HMI with Angle Selection for Edge Alignment |
| Brand | EMU |
|---|---|
| Origin | UK |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Equipment |
| Model | IDWR |
| Price Range | USD 14,000 – 72,000 (FOB) |
| Compatible Wafer Diameters | 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Throughput | 25 wafers per batch in ≤ 120 seconds (including cassette mapping, batch alignment, and full-surface ID reading) |
| Imaging System | Cognex In-Sight 1741 Smart Camera |
| Read Targets | Laser-etched marks and Data Matrix codes on wafer frontside and backside |
| Interface Protocols | RS-232, Ethernet, SECS/GEM compliant |
| User Interface | Integrated industrial touchscreen with recipe management and maintenance diagnostics |
| Brand | EMU |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Selective Wafer Elevator |
| Wafer Diameters Supported | 75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Operation Mode | Manual Actuation with Indexed Slot Selection (e.g., slots 1, 6, 11, 16, 21) |
| Construction Materials | Cleanroom-Compatible Organic Polymers and Non-Shedding Structural Components |
| Compliance | Designed for ISO Class 1–5 Cleanroom Environments |
| Substrate Compatibility | Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Sapphire, SOI |
| Brand | EMU |
|---|---|
| Origin | United Kingdom |
| Model | SMIF Batch ID Reader |
| Wafer Size | 200 mm |
| Integration Interface | GEM300 / SEMI E84 |
| Cycle Time | < 3 minutes |
| System Architecture | Integrated KUKA robotic handler + SMIF load port + IDWR200SMIF reader module |
| Application Scope | Automated wafer lot tracking, SMIF pod-to-pod transfer, front-end fab traceability |
| Brand | EMU |
|---|---|
| Origin | UK |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | SPPE |
| Throughput | 400 WPH |
| Wafer Diameters Supported | 75 mm / 100 mm, 125 mm / 150 mm, and 150 mm / 200 mm |
| ESD Protection | Full Integrated ESD-Safe Architecture |
| Compatibility | Si, SiC, GaN, and Other Semiconductor Substrates |
| Control System | Embedded PC with Touchscreen HMI |
| Interface Options | SECS/GEM Compliant |
| Cassette Handling | Auto-mapping with Dual-Slot & Cross-Loading Detection |
| Safety | Real-time Wafer Presence & Edge Detection Sensors |
| Brand | GBITEST |
|---|---|
| Model | GCP-CPX |
| Cooling Options | Liquid Nitrogen (LN₂) or Liquid Helium (LHe) |
| Base Temperature | <5 K (with LHe) |
| Sample Stage Diameter | Standard 2-inch, Optional up to 4-inch |
| Cooling Method | Direct cryogen immersion with multi-layer radiation shields |
| Temperature Monitoring | Multiple calibrated Pt sensors with ±10 mK stability |
| Operation Mode | Manual probe positioning |
| Construction | Stainless steel vacuum chamber with optical access windows |
| Vacuum Compatibility | <1×10⁻⁶ Torr typical base pressure |
| Radiation Shield Configuration | Dual-layer (LN₂ and LHe optimized) |
| Visual Access | Integrated quartz viewport on radiation shield |
| Mounting Interface | Standard SM1 (1.035"-40) and kinematic optical breadboard compatibility |
| Electrical Feedthroughs | 24-channel low-noise coaxial + 4-channel triaxial (optional) |
| Compliance | Designed per ISO 14644-1 Class 5 cleanroom handling guidelines for semiconductor lab use |
| Brand | Hprobe |
|---|---|
| Origin | France |
| Model | IBEX-300 |
| Wafer Compatibility | 100–300 mm |
| Magnetic Field Orientation | Full 3D vector control (in-plane & out-of-plane) |
| Field Scan Speed | Sub-second field reorientation |
| Integrated Calibration | On-board Hall sensors with traceable calibration |
| Software Suite | MRAM characterization, sensor parameter extraction, and automated test sequencing |
| Probe Interface | Compatible with standard RF/microwave and DC probe cards |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments and GLP-compliant magnetic device qualification |
| Brand | Instec |
|---|---|
| Origin | USA |
| Model | HCP621G-PM |
| Temperature Range | -190 °C to 600 °C (LN₂ required for sub-ambient operation) |
| Heating/Cooling Rate | +80 °C/min (heating at 100 °C), -50 °C/min (cooling at 100 °C) |
| Temperature Stability | ±0.05 °C (>25 °C), ±0.1 °C (<25 °C) |
| Temperature Resolution | 0.01 °C |
| Control Sensor | 100 Ω Pt RTD |
| Control Method | PID with LVDC low-noise power supply |
| Heating Area | 28 mm × 30 mm |
| Sealing | Hermetic chamber (N₂ or inert gas compatible) |
| Optical Access | Removable φ38 mm viewport, ±60.7° viewing angle, 8.5 mm objective working distance |
| Electrical Interface | Standard BNC, optional triaxial for pA-level measurements |
| Probe Type | Manual lever-actuated Re-W bent probes |
| Sample Stage Grounding | Default grounded, optional floating or triaxial back-electrode configuration |
| Optional Modifications | Non-magnetic construction, internal feedthroughs, transmission-mode optical port, in-chamber wiring posts |
| Operation Mode | Manual probe positioning |
| Compliance | Designed for ASTM F1528, ISO/IEC 17025-aligned lab environments, supports GLP/GMP traceability via software SDK |
| Brand | MicroXact |
|---|---|
| Model | MPS-C-300 |
| Category | RF Probe Station |
| Wafer Size Capacity | Up to 200 mm (standard 10–150 mm) |
| Magnetic Field Range | ±6 kOe (±0.6 T) in 3D vector configuration |
| Field Directional Accuracy | ±1.0° |
| Field Uniformity | ±2% over 10 mm diameter |
| Field Stability | <0.1% over 24 h |
| Minimum Field Resolution | 200 mG |
| Frequency Bandwidth | DC to ~67 GHz |
| Motion Range (X-Y) | 100 mm × 100 mm |
| Chuck Type | Isolated / Grounded / Coaxial configurable |
| Control Software | LabVIEW-based, open-source, modular API |
| Brand | MPI |
|---|---|
| Origin | Taiwan |
| Model | TS150 & TS200 & TS300 |
| Probe Station Type | Manual RF Probe Station |
| Wafer Compatibility | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Platen Lift Range | 0–300 µm / 3 mm (3-stage) |
| Positioning Repeatability | ±1 µm |
| XY-θ Motion Stage | 25 × 25 mm with micrometer adjustment |
| Z-Axis Fine Adjustment | 25 mm travel with 1 mm engraved scale |
| RF MicroPositioner Capacity | up to 4 four-port RF probes or 10 DC probes |
| Thermal Chuck Compatibility | ERS-series temperature-controlled chucks (–60 °C to +300 °C) |
| Optical Options | MPI SZ10 stereo zoom, MZ12 monocular zoom, 90° tilt standard |
| Vibration Isolation | Integrated damping base |
| EMI Shielding | Optional light-tight, EMI-shielded enclosure |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TS200-SE Probe System |
| Price Range | USD 13,500 – 40,500 (FOB) |
| Product Category | Temperature-Controlled Manual Probe Station |
| Operation Mode | Manual |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | MCT 500 |
| Pricing | Available Upon Request |
| Brand | Tianwei (Shandong Tianwei Environmental Technology Co., Ltd.) |
|---|---|
| Model | TW-6481B5+ |
| Origin | Shandong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Application Scope | Length measurement, attenuation profiling, splice/connector loss evaluation, and fault localization in single-mode and multimode optical fiber cables |
| Dynamic Range | 28 dB |
| Maximum Test Distance | 100 km |
| Event Dead Zone | 3 m |
| Sampling Resolution | 2.5 cm |
| Display | 7-inch capacitive touchscreen (800 × 480 TFT LCD) |
| Battery | 3.7 V / 4600 mAh Li-polymer with smart power management |
| Operating Wavelengths | 1310 / 1550 / 1625 / 1650 ±20 nm |
| Compliant File Formats | Bellcore GR-196, SR-4731 |
| Integrated Functions | OTDR, Optical Power Meter (OPM), Visual Fault Locator (VFL, 650 nm), Stable Light Source (LS), Live-fiber detection with automatic optical input warning |
| Interface | USB Type-C, microSD slot |
| Weight | ≤700 g (with battery) |
| Dimensions | ≤200 × 150 × 38 mm |
| Environmental Rating | Operating temperature 0–40 °C |
| Brand | Truth Instruments Company Limited |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | Wafer-MOKE |
| Pricing | Available Upon Request |
| Sample Size | Up to 300 mm (12-inch) wafers, downward compatible with fragments |
| Vertical Field Range | ±2.4 T |
| In-Plane Field Range | ±1.3 T |
| Field Resolution | 0.01 mT |
| Field Uniformity | Better than ±1% over Ø1 mm |
| Kerr Rotation Resolution | 0.3 mdeg (RMS) |
| Throughput | 12 WPH (9 sites, 200 mm wafer, ±1.3 T) |
| Sample Repositioning Accuracy | <10 µm |
| Uptime | ≥90% |
| EFEM Integration | Optional |
| Brand | TRY |
|---|---|
| Model | Customized |
| Application Scope | High-power IC packaging (e.g., IGBT modules), semiconductor manufacturing, materials R&D, automotive electronics |
| XY Stage | 150 × 150 mm |
| Max Shear Force Capacity | 1000 kg |
| Compliance | ASTM F468, ISO 13473-2, JEDEC JESD22-B116 (Bond Strength), MIL-STD-883 Method 2011 |
| Sensor Technology | Digital load cell with thermal drift compensation |
| Control Interface | Touchscreen HMI + Ethernet/RS232 for integration into factory MES/LIMS |
| Software | TRY-BondTest Suite v3.2 with audit trail, user role management, and 21 CFR Part 11–compliant electronic signatures |
| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | Micro-110 |
| Product Category | Vacuum Probe Station |
| Operation Type | Manual |
| Wafer Size Compatibility | 1–8 inch |
| Temperature Range Options | (a) –40 °C to 200 °C (Peltier), (b) –40 °C to 170 °C (Peltier), (c) RT to 450 °C (Ceramic Heater), (d) RT to 750 °C (Ceramic Heater), (e) 77 K to 300 K (Liquid Nitrogen Cryostat) |
| Vacuum Chamber | Hermetic Sealed with Optical Viewports |
| Gas Delivery | Mass Flow Controller (MFC)-Equipped Multi-Gas Inlet |
| Electrical Interface | Standard Coaxial & Triaxial Feedthroughs |
| Pricing | USD $150,000–$250,000 |
| Brand | ULTECH |
|---|---|
| Origin | South Korea |
| Model | MPS |
| Category | Vacuum Probe Station |
| Operation | Manual |
| Wafer Size Compatibility | 1″ to 8″ |
| Temperature Range Options | −40 °C to 200 °C (Peltier), −40 °C to 170 °C (Peltier), RT to 450 °C (Ceramic Heater), RT to 750 °C (Ceramic Heater), 77 K to 300 K (Liquid Nitrogen Cooling) |
| Vacuum Chamber | Yes, hermetic sealing |
| Gas Delivery | Mass Flow Controller (MFC)-equipped multi-gas inlet |
| Optical Access | Integrated viewport for microscope coupling |
| Electrical Interface | Standard coaxial and triaxial feedthroughs |