Lithography & Coating/Developing Equipment
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| Brand | Analysis |
|---|---|
| Origin | Beijing, China |
| Model | HCH300P |
| Maximum Substrate Size | 220 × 220 mm (compatible with ≤8-inch wafers) |
| Temperature Range | Ambient to 300 °C |
| Temperature Resolution | 0.1 °C |
| Temperature Uniformity | <1% across surface |
| Temperature Accuracy | ±0.5 °C |
| Timer Range | 0.1–100,000 s |
| Timer Resolution | 0.1 s |
| Pin-Lift Stroke | 0–30 mm |
| Pin-Lift Resolution | 0.1 mm |
| Heating Power | 1000 W |
| Weight | 25 kg |
| Dimensions (L×W×H) | 450 × 300 × 295 mm |
| Control Interface | 7-inch full-color capacitive touchscreen |
| Heating Plate Material | Anodized aluminum or PTFE-coated corrosion-resistant surface |
| Programmable Lift Steps | 5 per recipe |
| Stored Recipes | 100 user-defined programs |
| Safety Features | Radiant heat shielding cover, stainless steel chassis, thermal insulation design |
| Brand | Analysis |
|---|---|
| Model | HDJS10 |
| Type | Bottle-Top Dispenser-Based Manual Quantitative Dispensing System |
| Construction Materials | PTFE, FEP, BSG, PP |
| Max Operating Pressure | 500 mbar |
| Max Kinematic Viscosity Handling | 500 mm²/s |
| Max Liquid Temperature | 40 °C |
| Max Liquid Density | 2.2 g/cm³ |
| Volume Ranges | 0.5–5 mL (0.1 mL graduation), 1–10 mL (0.2 mL graduation), 2.5–25 mL (0.5 mL graduation), 5–50 mL (1 mL graduation) |
| Includes | Five Universal Bottle Adapters |
| Sterilization | Autoclavable (121 °C, 20 min) |
| Chemical Resistance | Broad-spectrum (acids, bases, solvents, photoresists) |
| Brand | Analysis |
|---|---|
| Origin | USA |
| Manufacturer | Analysis Instruments, Inc. |
| Product Type | Imported |
| Model | X-Pro II |
| Pricing | Available upon Request |
| Origin | Beijing, China |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Domestic |
| Model | EZH-S |
| Price Range | USD 2,800 – 7,000 |
| Max. Rotation Speed | 5000 rpm |
| Speed Resolution | 1 rpm |
| Max. Acceleration | 50000 rpm/s |
| Substrate Diameter | 50 mm (2") |
| Chamber Diameter | 180 mm |
| Heating Plate Diameter | Φ30 mm (customizable) |
| Temperature Range | Ambient to 150 °C |
| Temp. Resolution | 0.1 °C |
| Temp. Stability | ±0.5 °C (steady-state), ±2 °C (during spin-up/down) |
| Programmable Steps | 100 steps × 100 programs |
| Dispense Port | 1-channel auto-dosing |
| Power Input | AC 220 V, 5 A |
| Heating Power | 200 W |
| Motor Power | 200 W |
| Weight | 15 kg |
| Origin | Beijing, China |
|---|---|
| Manufacturer Type | Distributor |
| Origin Category | Domestic |
| Model | SC200-SE |
| Price Range | USD 7,000 – 14,000 (FOB) |
| Max Rotation Speed | 0–5000 rpm |
| Speed Resolution | 1 rpm/s |
| Max Acceleration | 10,000 rpm/s |
| Substrate Diameter | 304.8 mm (12″) |
| Chamber Diameter | 440 mm |
| Speed Stability | < ±1 rpm |
| Time Resolution | 0.1 s/step |
| Programs | 100 × 100 steps |
| Uniformity | < ±3% (6″ measurement area, edge exclusion of 3 mm) |
| Motor | 400 W industrial servo motor |
| Enclosure Material | Electropolished stainless steel (316L-grade compatible) |
| Chamber Lining | PTFE-coated or polyethylene bowl |
| Control Interface | 7″ capacitive touchscreen HMI |
| Exhaust Location | Bottom-mounted, integrated with chuck base |
| Dimensions (W×D×H) | 463 × 613 × 306 mm |
| Brand | Ansys |
|---|---|
| Origin | USA |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported Instrument |
| Model | Apogee 450 |
| Rotation Speed | 0–30,000 rpm/s (no-load) |
| Speed Accuracy | ±0.2 rpm |
| Speed Resolution | <0.2 rpm |
| Max Acceleration | 0–3000 rpm/s (with 350 mm × 6 mm embedded chuck) |
| Substrate Compatibility | Ø10 mm to Ø450 mm wafers |
| Step Time Resolution | 0.1 s (max step duration: 9999.9 s) |
| GUI | Full-color 7″ capacitive touchscreen with alphanumeric graphical interface |
| Data Interface | USB 2.0, Ethernet (10/100 Mbps), StreamSync™ communication protocol |
| Vacuum & Lid Interlock | Yes |
| Chamber Material | HDPE (High-Density Polyethylene) spin bowl |
| Optional Features | N₂ purging for inert ambient, X-PRO standalone workstation integration, overhead exhaust hood with chemical fume containment |
| Brand | Apogee |
|---|---|
| Origin | USA |
| Manufacturer | Apogee Instruments, Inc. |
| Model | Apogee200 |
| Rotation Speed Range | 0–30,000 rpm (no-load) |
| Speed Accuracy | ±0.2 rpm |
| Acceleration | 0–30,000 rpm/s (no-load) |
| Step Time Resolution | 0.1 s (max step duration: 9999.9 s) |
| Substrate Compatibility | Ø1 mm to Ø200 mm circular |
| Chamber Material | HDPE (High-Density Polyethylene) |
| Power Input | 100–125 VAC / 208–240 VAC, 50/60 Hz |
| Max Power Consumption | 655 W |
| Vacuum Range | 20–25 inHg |
| Exhaust Flow | 20–50 CFM at 0.2″ H₂O |
| N₂/CDA Supply | 70 psi |
| Dimensions (W×D×H) | 13.25″×19″×12″ (33.65×48.26×30.48 cm) |
| Net Weight | 40 lb (18.14 kg) |
| Shipping Weight | 100 lb (45.36 kg) |
| Brand | Appo |
|---|---|
| Origin | Shanghai, China |
| Model | NIL-100 |
| Imprint Area | 4-inch (100 mm) wafers/substrates |
| Max. Pressure | 8 bar (integrated air compressor), 20 bar (external cleanroom supply) |
| Temperature Range | Ambient to 250 °C |
| UV Source | 400 W high-pressure Hg lamp, dominant wavelength 365 nm |
| Vacuum Level | ≤10 Pa |
| Heating Method | Electromagnetic single-side heating |
| Automation | Motorized auto-demolding |
| Compatible imprint modes | Thermal embossing & UV-curable step-and-flash imprint lithography (S-FIL) |
| Optional consumables | Full suite of nanoimprint resists (thermal, UV-curable, lift-off, deep-etch), anti-sticking agents, adhesion promoters, and custom mold fabrication support (Ni, SFP®, Hybrid Mold®) |
| Resolution capability | ≤20 nm (with appropriate mold and process optimization) |
| Compliance | Designed for R&D and pilot-line use under GLP-aligned lab practices |
| Brand | ARMS SYSTEM |
|---|---|
| Origin | Japan |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | UTA-IA |
| Exposure Mode | Projection-Based |
| Resolution | 1–2 µm |
| Light Source | High-Power LED |
| Wavelength Range | Visible Spectrum (400–700 nm) |
| Maximum Exposure Field | 2.5 mm × 1.5 mm |
| Minimum Patterned Area | 100 µm × 100 µm |
| Optical Architecture | Integrated Metallurgical Microscope + DLP Digital Micromirror Device (DMD) Projection Engine |
| Software-Controlled Pattern Generation | Yes |
| Compatibility | Standalone or Coupled to User-Provided Microscope (Optional Adapter Kit) |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Model | 1460K |
| Type | Contact/Proximity Mask Aligner |
| Application | R&D and low-volume semiconductor prototyping, MEMS, microfluidics, academic cleanroom fabrication |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Product Category | Mask Aligner / Stepper-Based Lithography System for Semiconductor Fabrication |
| Models | TWINSCAN XT:1900Gi, XT:2000i, NXT:1980Di, NXT:2050i, NXE:3400B/C, NXE:3600D, EXE:5000 Series |
| Light Source Wavelengths | 248 nm (KrF), 193 nm (ArF dry & immersion), 13.5 nm (EUV) |
| Single-Exposure Resolution | 38 nm (ArF immersion), 13 nm (EUV, NA=0.33), 8 nm (High-NA EUV, NA=0.55) |
| Throughput | Up to 275 wafers/hour (NXT:2050i), ~170 wafers/day (NXE:3400C), target 220 wafers/day (EXE:5000) |
| Supported Process Nodes | 28 nm to sub-2 nm |
| Compliance | ISO 14644-1 Class 1 cleanroom integration, SEMI S2/S8 safety standards, compatible with 300 mm wafer handling automation (SECS/GEM) |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Type | Mask Aligner / Stepper / Scanner |
| Technology | EUV (13.5 nm) and DUV (193 nm ArFi, 248 nm KrF, 365 nm i-line) |
| Numerical Aperture (NA) | 0.75–0.55 |
| Resolution | ≤8 nm (High-NA EUV) to ≤220 nm (i-line) |
| Overlay Accuracy | ≤1.1 nm (NXE:3800E) |
| Throughput | 160–350 wafers/hour (300 mm) |
| Compliance | ISO 14644-1 Class 1 cleanroom integration, SEMI S2/S8 certified, compatible with 21 CFR Part 11 audit trails via integrated metrology interfaces |
| Brand | ASML |
|---|---|
| Origin | Netherlands |
| Model | Twinscan NXT:1980Di |
| Light Source | ArF Excimer Laser (193 nm) |
| Numerical Aperture (NA) | 1.35 |
| Resolution (single-exposure) | ≤38 nm |
| Overlay Accuracy | <1.5 nm (3σ) |
| Throughput | 275 wafers per hour (300 mm) |
| Platform Architecture | NXT3 |
| Immersion Technology | Water-based liquid immersion |
| Compliance | SEMI S2/S8, ISO 14644-1 Class 1 Cleanroom Compatible |
| Software Interface | TWINSCAN Control System (TCS) v5.x with integrated metrology feedback loops |
| Brand | Auniontech |
|---|---|
| Model | MicroFAB-3D |
| Lithography Mode | Projection-based Two-Photon Polymerization (TPP) |
| Resolution | Adjustable from 0.2 µm to 3 µm |
| Origin | Imported |
| Compliance | CE-marked for laboratory use in Class 100–1000 cleanrooms |
| Sample Stage | Motorized XYZZ (4-axis) with closed-loop positioning |
| Laser Source | Femtosecond pulsed NIR laser (typically 780–800 nm, <150 fs pulse width) |
| File Input | STL, OBJ, 3MF, G-code via proprietary slicing engine |
| Software Platform | MicroFAB Control Suite v4.x (Windows 10/11, 64-bit) |
| Brand | Canon (Japan) |
|---|---|
| Origin | Japan |
| Equipment Type | Mask Lithography System (Stepper/Scanner/NIL) |
| Wafer/Substrate Compatibility | 200 mm, 300 mm, Gen 8.6 to Gen 10.5 FPD glass |
| Resolution | ≤65 nm (KrF stepper, with multi-patterning), 0.18–0.35 µm (i-line/KrF), 1–2 µm (packaging), 3–5 µm (FPD), <10 nm (NIL, theoretical) |
| Exposure Source | i-line (365 nm), KrF (248 nm), NIL UV imprint |
| Alignment Accuracy | ±0.5 µm (FPA-5520iV) |
| Throughput | ~100–120 wph (300 mm, FPA-8000 series) |
| Compliance | ISO 14644-1 Class 5 cleanroom compatible, SEMI S2/S8 certified, supports GLP/GMP-aligned process documentation |
| Brand | Canon |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | FPA5000 ES4 |
| Resolution | 0.13 µm |
| Exposure Wavelength | 248 nm |
| Maximum Exposure Field | 26 mm × 33 mm |
| Numerical Aperture (NA) | 0.5–0.8 |
| Reduction Ratio | 4:1 |
| Overlay Accuracy | ±25 nm |
| Brand | CIF |
|---|---|
| Model | SC1 |
| Type | Benchtop Precision Spin Coater |
| Rotation Speed Range | 0–10,000 rpm |
| Speed Accuracy | ±1% |
| Acceleration Rate | 0–10,000 rpm/s |
| Substrate Compatibility | Ø150 mm (6-inch) wafers, square substrates up to 105 × 105 mm |
| Chamber Diameter | 180 mm |
| Drive System | Closed-loop servo motor with digital tachometric feedback |
| Control Interface | 7-inch full-color capacitive touchscreen (bilingual English/Chinese) |
| Programmability | Standard 10-step gradient program |
| Safety | Dual interlocked lid with electromagnetic cut-off, PTFE-embedded tempered glass upper chamber, vacuum-sealed chuck interface, triple-seal sample tray mounting |
| Construction | Powder-coated stainless steel housing |
| Chamber Lining | PTFE |
| Chuck Material | NPP-H polypropylene (acid/alkali resistant) |
| Optional Accessories | N₂ purge kit, N₂ inert atmosphere module, automated dispense system, manual dropper kit |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Brand | ELIONIX INC. |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ELS-F150 |
| Price Range | USD 1.6–2.7 million (FOB Japan) |
| Brand | Germanlitho (Tianren Micronano) |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | OEM Manufacturer |
| Origin Category | Domestic (China) |
| Model | GL8 CLIV Gen2 |
| Pricing | Upon Request |
| Brand | EV Group (EVG) |
|---|---|
| Origin | Austria |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | EVG Mask Aligner Series |
| Exposure Mode | Proximity Mode |
| Resolution | ≥0.5 µm |
| Light Source | Mercury Arc Lamp |
| Wavelength | UV (i-line, g-line, h-line) |
| Illumination Uniformity | ±0.4% |
| Maximum Wafer/substrate Size | 2–8 inch (standard configuration) |
| Compatible Substrate Types | Si, SiC, GaAs, glass, quartz, flexible polymers |
| Alignment Accuracy | Sub-micron top-side and backside alignment |
| Vacuum Chuck Type | Pneumatic or electrostatic (model-dependent) |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | OEM Manufacturer |
| Country of Origin | China |
| Model | CDS-6C |
| Pricing | Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | OEM Manufacturer |
| Regional Category | Domestic (China) |
| Model | DEV-6LS |
| Pricing | Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Origin | Domestic (China) |
| Model | SCP-12LD |
| Pricing | Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | SCP-4LD |
| Pricing | Available upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Category | Domestic (China-made) |
| Model | SCP-6LD |
| Pricing | Available Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | SCP-8C |
| Pricing | Available Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (China) |
| Model | SCP-8LD |
| Pricing | Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Regional Classification | Domestic (China) |
| Model | SCP-8LSY |
| Pricing | Upon Request |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | HPT-L7 |
| Pricing | Upon Request |
| Brand | JEOL |
|---|---|
| Origin | Japan |
| Model | JBX-9500FS |
| Acceleration Voltage | 100 kV |
| Maximum Substrate Size | 300 mm Ø wafers or 6-inch masks |
| Maximum Field Size | 1000 µm × 1000 µm |
| Stage Travel Range | 260 mm × 240 mm |
| Minimum Positioning Unit (LBC) | 0.15 nm (λ/4096) |
| Overlay Accuracy | ≤ ±11 nm |
| Field Stitching Accuracy | ≤ ±10 nm |
| In-Field Placement Accuracy | ≤ ±9 nm |
| Position DAC Resolution | 20-bit |
| Scan DAC Resolution | 14-bit |
| Scan Step Size | 0.25 nm |
| Maximum Scan Rate | 100 MHz |
| Electron Source | ZrO/W Schottky Emitter |