Other Semiconductor Inspection Instruments
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| Brand | Allresist |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AR-P 610 Series |
| Pricing | Upon Request |
| Brand | Allresist |
|---|---|
| Origin | Germany |
| Model | AR-P 6200 |
| Product Type | Positive-tone e-beam resist |
| Key Variants | AR-P 6200.09 (standard), AR-P 6200.13 (thick-film), AR-P 6200.18 (ultra-thick), AR-P 6200.04 (low-temperature optimized) |
| Developer Compatibility | AR 600-546, AR 600-548, AR 600-55, AR 600-50/2 |
| Acceleration Voltage Range | 1–100 kV |
| Film Thickness Range | 50 nm – 1.5 µm |
| Sensitivity (AR-P 6200.09, 30 kV, AR 600-546) | ~55 µC/cm² (D₀), ~220 pC/cm² (10 nm trenches) |
| Contrast (γ) | 14.2 |
| Resolution | ≤6 nm (at 6 °C, optimized process) |
| Plasma Etch Resistance | High (CF₄ + O₂), superior to PMMA (AR-P 679.03) and ZEP 520A |
| Post-Exposure Bake (PEB) | Not required |
| Lift-off Capability | ≤20 nm metal lines, defined undercut tunable via dose |
| Two-Layer Compatibility | Validated with AR-P 617 series (e.g., AR-P 617.06) |
| Brand | Allresist |
|---|---|
| Origin | Germany |
| Product Type | Conductive Spin-Coatable Anticharging Coating for E-beam Lithography & SEM/FIB Imaging |
| Model | AR-PC 5090.02, AR-PC 5091.02 |
| Film Thickness | ~40 nm at 4000 rpm |
| Developer | Deionized Water |
| UV/E-beam Insensitivity | Yes |
| Compatibility | AR-PC 5090.02 — PMMA, CSAR 62, HSQ |
| Solubility Post-Exposure | Aqueous |
| Brand | Allresist |
|---|---|
| Origin | UK |
| Model | PMMA Electra 92 (AR-PC 50) |
| Formulation | Aqueous/isopropanol solution of polyaniline derivative |
| Application | Charge-dissipative topcoat for non-novolac e-beam resists |
| Removal | Post-exposure aqueous rinse |
| Compliance | Compatible with standard e-beam lithography workflows (JEOL, Raith, Zeiss systems) |
| Brand | Allresist |
|---|---|
| Origin | Germany |
| Model | SX AR-PC 5000/41 |
| Type | Acid-Resistant, Non-Photosensitive Protective Resist |
| Compatibility | KOH (40% w/w), HF (50% w/w) |
| Processing | Spin-Coatable |
| Regulatory Status | Import Product for Semiconductor Fabrication |
| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported Equipment |
| Model | Refurbished Stepper Photolithography System |
| Pricing | Available Upon Request |
| Brand | ALPHA |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor & Service Provider |
| Equipment Origin | Imported |
| Model | Stepper Photolithography System – Technical Support & Refurbishment Package |
| Pricing | Available Upon Request |
| Brand | Angstrom Sun |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SE Series |
| Pricing | Upon Request |
| Brand | Angstrom Sun |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SR Series |
| Pricing | Upon Request |
| Brand | Artifex |
|---|---|
| Origin | Germany |
| Model | LIV100 (F/L/XL versions), LIV120, LDD100 |
| Current Range | 250 mA – 1200 A |
| Pulse Width Range | 150 ns – 3 s |
| Rise Time | 25 ns (LDD100) to 1 µs (LIV100-XL) |
| Wavelength Coverage | 250–1100 nm & 400–1650 nm |
| Interface | USB 2.0 |
| Measurement Mode | Pulsed (LIV100), Pulsed/QCW/CW (LIV120), Programmable Analog Current Source (LDD100) |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments |
| Software | PC-based GUI with automated PDF report generation, audit-trail-ready configuration logging |
| Brand | ASIDA |
|---|---|
| Model | LJ101A |
| Origin | Guangdong, China |
| Type | PCB/FPC Character Marking System |
| Print Resolution | 720×720 dpi / 720×1440 dpi |
| Max. PCB Size | 660×610 mm |
| Min. PCB Size | 170×220 mm |
| PCB Thickness Range | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL) |
| Positioning Accuracy | ≤35 µm (CCD-based 3-point registration) |
| Print Speed | ≤70 s per side (for 24″×18″ panel) |
| Curing | UV LED system with active cooling |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Air Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350×1790×1500 mm |
| Weight | 1500 kg |
| Brand | ASIDA |
|---|---|
| Model | LJ101A |
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | PRC |
| Print Resolution | 720 × 720 dpi / 720 × 1440 dpi |
| PCB Size Range | 170 × 220 mm to 660 × 610 mm |
| PCB Thickness Capacity | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL drop volume) |
| Print Speed | ≤70 s per side (for 24″ × 18″ panel) |
| Registration Method & Accuracy | CCD-based three-point auto-alignment |
| Curing System | UV LED lamp with active cooling |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Air Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350 × 1790 × 1500 mm |
| Weight | 1500 kg |
| Brand | Asida |
|---|---|
| Model | LJ101A |
| Application | Permanent inkjet marking of legends, serial numbers, barcodes, and identifiers on rigid and flexible printed circuit boards (PCBs) |
| Print Resolution | 720 × 720 dpi / 720 × 1440 dpi |
| Max. PCB Size | 660 × 610 mm |
| Min. PCB Size | 170 × 220 mm |
| PCB Thickness Range | 0.1–6 mm |
| Minimum Line Width | 70 µm |
| Minimum Character Height | 0.5 mm |
| Printhead | KM1024 (14 pL drop volume) |
| Positioning Accuracy | ≤35 µm (CCD-based three-point auto-alignment) |
| UV Curing System | Integrated air-cooled UV lamp with instant curing |
| Cycle Time | ≤70 s per side (for 24″ × 18″ panel) |
| Power Supply | AC 380 V, 10 A, 50 Hz |
| Pneumatic Supply | Dry compressed air, 0.5–0.8 MPa |
| Dimensions (W×D×H) | 1350 × 1790 × 1500 mm |
| Weight | 1500 kg |
| Brand | CEL |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Origin Category | Domestic (China) |
| Model | CEL-RCCO |
| Price | USD 2,800 (FOB Beijing) |
| Active Area | 20 mm × 20 mm |
| Spectral Response Range | 400–1100 nm |
| Calibration Irradiance | 1000 W/m² (AM1.5G) |
| Calibration Temperature | 25 °C ± 0.1 °C |
| Temperature Sensor | Calibrated Pt100 (4-wire Kelvin connection) |
| Window Material | Space-grade radiation-hardened glass |
| Encapsulation | Hermetic epoxy-sealed aluminum housing with optical-grade UV-curable adhesive |
| Output Connectors | Dual LEMO FGG.0B.304.CLAD series (Isc/Voc + Pt100) |
| Short-Circuit Current Temperature Coefficient (α) | Typically −0.05 to −0.07 mA/°C |
| Open-Circuit Voltage Temperature Coefficient (β) | Typically −1.8 to −2.2 mV/°C |
| Stability | < ±0.5% Isc drift over 1,000 h under continuous 1-sun illumination |
| Traceability | NIST-traceable calibration via accredited ISO/IEC 17025 laboratory (certificate included) |
| Brand | ECOPIA |
|---|---|
| Origin | South Korea |
| Model | HMS-3000 / HMS-5000 |
| Current Source Range | 1 nA – 20 mA |
| Resistivity Range | 10⁻⁵ – 10⁷ Ω·cm |
| Carrier Concentration Range | 1×10⁷ – 1×10²¹ cm⁻³ |
| Mobility Range | 1 – 1×10⁷ cm²/V·s |
| Magnetic Field Options | 0.37 T, 0.55 T, 1 T fixed |
| Sample Temperature | Ambient or 77 K (liquid nitrogen) |
| Sample Size Compatibility | 5×5 mm to 20×20 mm (optional 30 mm or 2-inch wafers) |
| Software Platform | Windows XP–10 compatible |
| Compliance | CE certified (July 2004) |
| Brand | EULITHA AG |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Template |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Hakuto IBE-4000 |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 20 IBE-C |
| Pricing | Upon Request |
| Brand | Klocke Nanotechnik |
|---|---|
| Origin | Germany |
| Model | Micro Production |
| Type | Precision Nanomanipulation & 3D Coordinate Metrology Platform |
| Application Domain | Semiconductor Process Development, In-situ SEM/TEM Nanomanipulation, MEMS/NEMS Characterization, Nanofabrication Integration |
| Compliance | Designed for ISO 14644-1 Class 5 cleanroom environments |
| Positioning Resolution | Sub-nanometer (≤1 nm) in X/Y/Z |
| Force Sensing Capability | Integrated piezoresistive microforce feedback (mN range) |
| Vacuum Compatibility | Fully compatible with high-vacuum SEM/TEM chambers (10⁻⁷ mbar and below) |
| Interface | Standardized flange mounts (CF, KF, or custom) for JEOL, Zeiss, Thermo Fisher (FEI), Hitachi, TESCAN, and Raith systems |
| Brand | Kaufman & Robinson, Inc. (KRI) |
|---|---|
| Origin | USA |
| Model | EH 3000 HC |
| Discharge Voltage/Current | 50–300 V / up to 20 A |
| Beam Divergence (HWHM) | >45° |
| Cooling | Water-cooled |
| Compatible Gases | Ar, Xe, Kr, O₂, N₂ |
| Dimensions | Ø9.7" × H6" |
| Application | IBAD for high-density, uniform optical thin-film deposition |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | WS-650Mz-23N |
| Maximum Speed | 12,000 rpm |
| Acceleration | 0–12,000 rpm/sec |
| Speed Accuracy | ≤ ±1 rpm (NIST-traceable) |
| Speed Stability | < ±1% |
| Time Resolution | 0.1 sec (1–5999.9 sec/step) |
| Chuck Compatibility | Ø10–150 mm wafers or 125×125 mm square substrates |
| Chamber Diameter | 9.5 in (241 mm) |
| Controller | PLC-based with SPIN3000 software integration |
| Construction Material | NPP (Natural Polypropylene) |
| Programmability | 20 stored recipes, up to 51 steps per recipe |
| Vacuum System | Oil-free pump, 220–240 VAC, 50/60 Hz |
| Leveling | Included NIST-calibrated digital level |
| Brand | Lumina |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT Series (AT1, AT1-Auto, AT2, AT2-EFEM) |
| Pricing | Available Upon Request |
| Brand | McScience |
|---|---|
| Origin | South Korea |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | M6000 |
| Pricing | Upon Request |
| Brand | MicroChem Corp |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Product Line | AZ1500 Series |
| Solvent System | Propylene Glycol Monomethyl Ether Acetate (PGMEA) |
| UV Sensitivity Range | 310–440 nm (i-, h-, g-line) |
| Recommended Development Time | AZ1500/AZ1514H: 50–60 s |
| AZ1500HS | 20–30 s |
| Compatible Developers | AZ 351B (1:4 dilution), 0.5% NaOH, AZ 726MIF |
| Film Thickness Range | 0.5–4.0 μm (spin-coated) |
| Storage Conditions | 0–25°C, sealed container, light-protected |
| Shelf Life | Batch-specific (see label: YYYY/MM/DD) |
| Compliance | Fully compatible with standard semiconductor cleanroom protocols and ISO Class 5–7 environments |
| Brand | 1124123/13213112 |
|---|---|
| Origin | France |
| Supplier Type | Authorized Distributor |
| Import Status | Imported |
| Model | NISQ-5 |
| Price | USD 1.4M (FOB) |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Etch |
| Pricing | Upon Request |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | Ionfab 300 |
| Configuration Options | Direct-Load, Single-Wafer Transfer, Cassette-to-Cassette Transfer |
| Process Modes | Ion Beam Deposition (IBD), Ion Beam Etching (IBE), Co-deposition & Reactive IBE |
| Wafer Handling | 300 mm single-wafer or cluster-integrated |
| Surface Roughness | Sub-nanometer RMS (typical for IBD films) |
| Uniformity | ≤±1.5% across 300 mm wafer (process-dependent) |
| Reproducibility | CV < 2% for etch/deposition rate (run-to-run) |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PlasmaPro 100 ALE |
| Pricing | Available Upon Request |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | PlasmaPro 100 Estrelas |
| Substrate Size | 50–200 mm |
| Application Scope | Deep Silicon Etching (DSiE), MEMS, Advanced Packaging, Nanotechnology |
| Chamber Configuration | Single-chamber dual-mode (Bosch™ and cryogenic etching) |
| Process Flexibility | In-situ switchable between smooth sidewall, high-aspect-ratio, tapered via, and high-rate cavity etching |
| Key Hardware | Electrostatic/Heated chuck, optimized chamber liner, high-efficiency turbomolecular pump, fast-response mass flow controllers (MFCs), close-coupled RF delivery |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | PlasmaPro 100 Polaris |
| Wafer Size | 100 mm (4-inch) |
| Plasma Source | Inductively Coupled Plasma (ICP) with Magnetic Confinement |
| Electrode Configuration | Actively Cooled Bottom Electrode |
| Chuck Type | Electrostatic Chuck (ESC) with DC Bias Control |
| Chamber Liner | Heated, Anodized Aluminum |
| Pumping System | High-Capacity Turbomolecular Pump with Cryo-Assisted Roughing |
| Process Gas Compatibility | Cl₂, BCl₃, SF₆, CHF₃, O₂, Ar, N₂, and custom gas mixtures |
| Control Architecture | PLC-based real-time process control with Ethernet-enabled SECS/GEM interface |
| Compliance | CE-marked |