ALL-5800B Multi-Axis X-ray Crystal Orientation Analyzer
| Origin | Liaoning, China |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Domestic (PRC) |
| Model | ALL-5800B |
| Pricing | Upon Request |
Overview
The ALL-5800B Multi-Axis X-ray Crystal Orientation Analyzer is an integrated electro-opto-mechanical instrument engineered for high-precision angular alignment of single-crystal ingots—specifically optimized for sapphire (A-, C-, R-, and M-planes), silicon, and gallium arsenide (GaAs). It operates on the Bragg diffraction principle: a collimated Cu-Kα X-ray beam (λ = 0.15406 nm) impinges on the crystal lattice; angular position of the diffracted intensity maxima is measured to determine crystallographic orientation relative to defined reference planes. Unlike conventional single-axis orienters, the ALL-5800B enables sequential or simultaneous multi-directional measurement without manual repositioning, eliminating cumulative mechanical misalignment and enabling full crystallographic vector reconstruction. Its design targets industrial crystal growth, wafer slicing, and epitaxial substrate preparation workflows where orientation fidelity directly impacts downstream device yield—particularly in LED, RF, and power electronics manufacturing.
Key Features
- Multi-axis kinematic architecture with motorized vertical lift (Z-axis), horizontal translation (X/Y loading stage), and precision 360° rotation (θ-axis), all driven by closed-loop stepper motors with microstepping control.
- Integrated Heidenhain ECN 113 rotary encoder (installed beneath the turntable) providing 0.001° angular resolution and traceable positional feedback directly to the digital readout unit.
- Dedicated 2D adjustable fixture with ±4° tilt range and symmetric locking mechanism—engineered to maintain clamping force under dynamic load during cutting or rod extraction, preventing slippage-induced angular drift.
- Automated Bragg peak search function utilizing high-sensitivity scintillation detectors and real-time signal-to-noise optimization algorithms to identify zero-order and higher-order reflections without manual threshold tuning.
- PLC-based motion control system compliant with IEC 61131-3 standards, featuring dual-redundant limit sensing at all travel endpoints and thermal-stable housing for continuous operation (>72 h unattended).
- Heidenhain ND 287 digital display unit offering simultaneous readout of motor displacement (µm), diffraction angle (arcseconds), and encoder-derived rotational position (0.001°), with RS-232/USB interface for external logging.
Sample Compatibility & Compliance
The ALL-5800B accommodates cylindrical and rectangular ingots up to 300 kg mass and 300 mm diameter. Compatible crystal systems include hexagonal (sapphire, ZnO), cubic (Si, Ge, GaAs), and tetragonal (LiNbO₃) lattices. All mechanical and radiation safety components conform to GB/T 18871-2002 (Chinese national standard for ionizing radiation protection) and IEC 61000-6-2/6-4 (EMC immunity/emission). The X-ray tube housing meets ISO 15707:2006 requirements for leakage radiation (<1 µSv/h at 5 cm). While not certified to ASTM F394 or SEMI F20, its angular reproducibility (±10 arcseconds) satisfies internal process control specifications aligned with SEMI PV27 for photovoltaic ingot orientation and JEDEC JESD22-A108 for compound semiconductor substrate qualification.
Software & Data Management
The analyzer operates via embedded firmware with no external PC dependency; however, optional USB-connected host software (Windows 10/11 compatible) supports data export in CSV and XML formats—including raw detector counts, motor positions, encoder angles, timestamp, and operator ID. Audit trail functionality logs all parameter changes, calibration events, and emergency stops in accordance with GLP principles. Data files are digitally signed using SHA-256 hashing to ensure integrity; optional 21 CFR Part 11 compliance package includes electronic signatures, role-based access control, and immutable event history.
Applications
- Precise orientation of sapphire boules prior to c-plane or r-plane wafer slicing for LED epitaxy.
- Verification of off-cut angles on Si(100) and Si(111) wafers used in MEMS and SOI fabrication.
- Alignment of GaAs substrates for high-electron-mobility transistor (HEMT) layer growth.
- Quality assurance of LiTaO₃ and LiNbO₃ crystals for surface acoustic wave (SAW) filter production.
- In-process verification of crystallographic homogeneity across large-diameter ingots (>200 mm) to support statistical process control (SPC) initiatives.
FAQ
What crystallographic planes can be measured with the ALL-5800B?
The system supports standard Miller index determination for A-plane (11̅02), C-plane (0001), R-plane (10̅12), and M-plane (10̅10) in sapphire, as well as (100), (110), (111), and low-symmetry orientations in cubic semiconductors.
Is radiation shielding included in the base configuration?
Yes—the X-ray generator is fully enclosed in lead-lined steel housing meeting national regulatory limits for occupational exposure; no additional shielding installation is required for standard lab deployment.
Can the instrument be calibrated in-house?
A two-point angular calibration protocol using certified quartz reference crystals (NIST-traceable SRM 1976b) is supported via firmware menu; full calibration requires annual verification by an accredited metrology lab.
Does the system support automated batch reporting?
With optional software license, users may define report templates including sample ID, orientation vector, uncertainty budget, and pass/fail status per ANSI/ASQ Z1.4 sampling plans.
