Akrometrix AXP TherMoiré Thermal Warpage Analyzer
| Brand | Akrometrix |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | AXP |
| Pricing | Available Upon Request |
Overview
The Akrometrix AXP TherMoiré Thermal Warpage Analyzer is a high-precision, non-contact optical metrology system engineered for real-time, full-field measurement of thermally induced deformation in electronic substrates, packages, and printed circuit boards (PCBs). Based on patented TherMoiré interferometry—a hybrid technique combining moiré fringe analysis with controlled thermal ramping—the AXP captures dynamic warpage evolution across the entire surface during temperature cycling. Unlike point-based or profilometric methods, TherMoiré delivers sub-micron displacement resolution over large fields of view (up to 400 mm × 400 mm), enabling quantitative evaluation of curvature, gradient, and out-of-plane displacement as functions of temperature. The system is purpose-built for semiconductor packaging development, reliability qualification (e.g., JEDEC JESD22-A113, JESD22-B111), and process optimization in advanced packaging technologies including fan-out wafer-level packaging (FOWLP), 2.5D/3D IC integration, and embedded die substrates.
Key Features
- Full-field thermal warpage mapping at up to 1.4 million data points per frame, acquired in ≤2 seconds
- Programmable thermal control from –55 °C to +150 °C (standard); extended range up to +280 °C for reflow simulation
- Uniform forced-convection heating and active cooling architecture ensuring ±0.5 °C thermal uniformity across sample surface
- High-resolution optical path optimized for samples as small as 5 mm × 5 mm while maintaining scalability to 400 mm × 400 mm panels
- Integrated XY-stage motion control and coefficient of thermal expansion (CTE) calculation module based on multi-point displacement gradients
- Dual-sample and multi-sample test configurations supported via modular fixturing—enabling parallel thermal profiling for statistical process control (SPC)
- Robust mechanical design with vibration-damped granite base and environmental enclosure for stable operation in cleanroom or lab environments
Sample Compatibility & Compliance
The AXP accommodates rigid and flex-rigid substrates, leadframes, molded packages (QFN, BGA, LGA), silicon interposers, organic and ceramic substrates, and bare PCBs. Sample thickness ranges from 0.1 mm to 5 mm; clamping-free measurement eliminates mechanical constraint artifacts. The system supports industry-standard thermal profiles per JEDEC JESD22-A113 (temperature cycling), JESD22-B111 (warpage under temperature), IPC-9708 (warpage of surface mount components), and IPC-TM-650 2.4.22 (thermal stress testing). Data acquisition and reporting comply with GLP/GMP documentation requirements, including audit-trail-enabled user authentication, timestamped metadata, and raw interferogram archiving—facilitating FDA 21 CFR Part 11 readiness when integrated with validated LIMS or QMS platforms.
Software & Data Management
TherMoiré Studio software provides end-to-end workflow management: thermal profile definition, real-time warpage visualization (2D contour maps, 3D surface plots, cross-section traces), automated CTE extraction, and statistical warpage trend analysis (e.g., max peak-to-valley, RMS deviation, centroid shift). All measurements are stored in HDF5 format with embedded calibration metadata, supporting traceable data exchange with MATLAB, Python (NumPy/H5Py), and JMP. Export options include CSV, TIFF, and PDF reports compliant with internal QA templates. Version-controlled software updates and remote diagnostics are managed through Akrometrix’s secure support portal—ensuring long-term maintainability and regulatory alignment.
Applications
- Warpage characterization during solder reflow simulation (–55 °C → 280 °C) for package-on-package (PoP) and chip-scale package (CSP) qualification
- CTE mismatch analysis between die, mold compound, and substrate layers in advanced heterogeneous integration
- Process window development for molding compound cure cycles, underfill dispensing, and lamination parameters
- Reliability screening of fan-out redistribution layers (RDL) under thermal-hygroscopic stress
- Root-cause analysis of assembly yield loss linked to board-level warpage-induced solder joint fatigue
- Design validation of low-warpage laminate materials and embedded heat spreaders
FAQ
What thermal ramp rates does the AXP support?
The system achieves programmable heating rates up to 2 °C/s and cooling rates up to 3 °C/s using dual-mode convection control—fully configurable within TherMoiré Studio.
Can the AXP measure warpage during actual reflow soldering?
Yes—its extended-range configuration supports continuous monitoring from ambient to 280 °C with <100 ms temporal resolution, capturing transient warpage dynamics during peak reflow events.
Is the TherMoiré measurement traceable to NIST standards?
The optical path is calibrated using certified step-height standards (NIST-traceable Si wafers with 1 µm and 10 µm steps); thermal sensors are factory-calibrated against PT100 reference probes with ±0.1 °C uncertainty.
Does the system require vacuum or inert atmosphere for high-temperature operation?
No—operation is performed in ambient air; optional nitrogen purge kits are available for oxidation-sensitive samples.
How is data integrity ensured for regulated environments?
TherMoiré Studio implements role-based access control, electronic signatures, change logs, and immutable raw-data archiving—meeting baseline requirements for ISO 17025 and IATF 16949 laboratories.
