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| Brand | Microtronic |
|---|---|
| Origin | USA |
| Model | LBT-210 |
| Test Methods | Solder Bath, Solder Ball, Solder Paste Reflow Simulation |
| Positioning Accuracy | < 5 µm |
| Force Resolution | Sub-milligram |
| Preheat Control | Dynamic Range with Auto-Amplification |
| Bath Surface Detection | Contactless Laser Sensor |
| Data Storage | SQL Database with Audit Trail |
| Compliance | CE, EN 61000-6-2/6-4, IEC 61326-1 |
| Software Languages | English, German, French (customizable) |
| Safety | Integrated E-Stop, Dual-Channel Safety Circuit |
| Brand | Ocean Optics |
|---|---|
| Origin | USA |
| Model | ACCUMAN SR-510 Pro |
| Instrument Type | Portable/Handheld Raman Spectrometer |
| Spectral Range | 170–3900 cm⁻¹ |
| Spectral Resolution | 4 cm⁻¹ |
| Detector | Deep-Cooled Back-Illuminated CCD |
| Excitation Wavelength | 785 nm (standard), optional 532 nm or 1064 nm configurations |
| Laser Stability | <±0.02 nm over 8 hours |
| Spectral Reproducibility | <±0.5 cm⁻¹ (RMS, 24 h) |
| Data Interface | USB 3.0 and Wi-Fi 5 (802.11ac) |
| Operating Temperature | 10–40 °C |
| Weight | 1.4 kg (with battery) |
| Brand | WEB |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 9070 |
| Pricing | Available Upon Request |
| Max Speed | 22,000 rpm |
| Max RCF | 70,000 × g |
| Dimensions (W×D×H) | 38 in × 34 in × 40 in |
| Weight | 545 kg |
| Input Voltage | 230 V AC, Single Phase |
| Display | 4-line × 40-character LCD |
| Interface | RS232 |
| Safety Enclosure | Ballistic-grade steel chamber |
| Rotor–Fixture Integration | Universal compatibility with industry-standard centrifugal test fixtures |
| Compliance | MIL-STD-883C Method 2001, JEDEC JESD22-B103, AEC-Q100 Annex G |
| Brand | SEMICS |
|---|---|
| Origin | South Korea |
| Model | OPUS-SH / OPUS-SD / OPUS3 / OPUS-SS |
| Wafer Compatibility | 6", 8", and 12" (SEMI-compliant) |
| Dimensions (W×D×H) | OPUS-SH: 1490 × 1680 × 960 mm |
| OPUS-SD | 1530 × 1782 × 960 mm |
| XY Travel Range | ±175 mm (SH), ±185 mm × ±175 mm (SD) |
| XY Positioning Accuracy | ±1.5 µm |
| Maximum Downforce | 500 kgf |
| Temperature Range Options | Ambient to +150 °C, -40 °C to +150 °C, -55 °C to +200 °C, and 25 °C environmental chamber control |
| Structural Architecture | Rigid Z-frame with flat-load configuration |
| Key Functionalities | Real-time configuration validation, smart pin alignment algorithm, intelligent probing path optimization, map-shift prevention, drawer-type (SH) or universal probe card interface (SD/OPUS3), full pogo-pin tester compatibility |
| Brand | BNC |
|---|---|
| Origin | USA |
| Model | BNC 845-M |
| Output Connector | BNC |
| Phase Noise | < −110 dBc/Hz @ 10 kHz offset (typ.) |
| Switching Speed | < 200 ns (frequency hop) |
| FM Bandwidth | DC to 10 MHz |
| Reference Stability | ±5 × 10⁻⁹/day (OCXO) |
| Power Supply | +6 VDC, single supply |
| Compliance | RoHS 3, CE, FCC Part 15 Class B |
| Brand | PVA TePla |
|---|---|
| Origin | Germany |
| Model | GIGA 80 Plus |
| Technology | Dual-mode (Microwave + RF) Plasma |
| Chamber Type | Single-chamber, frame-based batch processing |
| Max. Frame Size | 100 × 300 mm |
| Application Focus | Semiconductor packaging pre-bonding, molding, and underfill processes |
| Compliance | Designed for ISO Class 5–7 cleanroom integration |
| Control Architecture | Fully automated PLC-based operation with recipe management |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Model | Jetetch Pro, JetEtch TotalPROTECT |
| Category | Electrochemical Decapsulation Equipment for Semiconductor Failure Analysis |
| Compliance | Designed for ISO/IEC 17025-compliant labs, supports GLP/GMP audit trails via optional software logging |
| Brand | Chemcut |
|---|---|
| Model | CC8000 |
| Origin | USA |
| Equipment Type | Horizontal Conveyor-Based Wet Processing System |
| Application Scope | Semiconductor Wafers (Cu, Ti/W etching), Leadframes (QFN/BGA), IC Substrates, HDI/FPC, Display Panels (LCD/Touch), Solar Cells, Precision Metal Parts |
| Spray Manifold Design | Optimized for Uniform Chemical Delivery & High-Resolution Pattern Transfer |
| Installed Base | >700 Systems Worldwide |
| Compliance Framework | Designed for GLP/GMP-aligned cleanroom integration and ASTM F2164-compliant wet process validation |
| Software Capability | PLC-based process control with recipe management, audit trail logging, and optional 21 CFR Part 11 compliance modules |
| Brand | Bruker |
|---|---|
| Origin | USA |
| Model | Opterra II |
| Type | Multipoint Scanning Confocal Microscope |
| Application Focus | Live-Cell Quantitative Imaging |
| Optical Architecture | Dual-Galvo Scanning with High-Density Pinhole Array |
| Excitation Compatibility | 405–640 nm Laser Lines |
| Z-Step Resolution | Adjustable down to 100 nm |
| Maximum Z-Stack Acquisition Speed | ≤60 s for 56 slices at 2 µm intervals |
| Field Uniformity | <±1.5% Intensity Variation Across FOV |
| Phototoxicity Profile | Optimized for Extended Time-Lapse Imaging of Sensitive Specimens |
| Compliance | Designed for GLP/GMP-Compliant Workflow Integration |
| Software Platform | Prairie View™ v6.x with FDA 21 CFR Part 11 Audit Trail Support |
| Brand | Kainova |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Product Category | Domestic (Taiwan-made) |
| Model | KAM-201 |
| Pricing | Upon Request |
| Reticle Handling Compatibility | EUV & Optical Reticles |
| Bonding Precision | ±0.1 mm |
| Post-Bonding Optical Distortion | <2 nm |
| Bonding Force Range | 0.035–0.4 kN |
| Cleanroom Particle Control | 0 EA for particles >100 nm |
| AMHS Integration | SEMI E84/E87 compliant |
| Vision-Based Alignment | Real-time image registration with dynamic parallelism compensation |
| AOI Inspection | Dedicated structured-light illumination for pellicle defect detection |
| Automated End-Effector Exchange | Yes |
| KAX-311 Reticle Transfer Module | Integrated rotational, flipping, and cassette exchange functions |
| Brand | BNC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | BNC 835-6 |
| Pricing | Available Upon Request |
| Brand | Heller |
|---|---|
| Origin | USA |
| Model | Mark III |
| Instrument Type | Box-type Reflow/Curing Oven |
| Max Temperature | 400 °C |
| Temperature Control Accuracy | ±1 °C |
| Max Power | 2500 W |
| Heating Rate to Max Temp | 15 min |
| Heating Method | Resistive Wire Heating |
| Internal Chamber Dimensions | 450 × 150 × 180 mm |
| Compliance | SMEMA-compatible |
| Cooling | Water-cooled BlowThru Module |
| Flux Recovery | Integrated Drain Tube with Collection Jar |
| Vacuum Option | Optional Vacuum Module (Model 755 compatible) |
| Nitrogen Atmosphere | Optional |
| Conveyor Width Range | 75–250 mm |
| Cycle Time Range | 7.5 min to several hours |
| Brand | Bruker |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | S2 PUMA Series 2 WDXRF/EDXRF Hybrid Platform |
| Price | Upon Request |
| Brand | BNC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | BNC 835-6-R |
| Pricing | Available Upon Request |
| Brand | Chroma |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Chroma Sputter-Coated Optical Filters |
| Price | Upon Request |
| Brand | WEB |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 4800 |
| Pricing | Upon Request |
| Brand | BNC |
|---|---|
| Origin | USA |
| Model | BNC 745, 1201, 1302CA |
| Time Resolution | 250 fs |
| Jitter (Internal Trigger) | ≤5 ps |
| Jitter (External Trigger) | ≤25 ps |
| Output Rise Time | ~1 ns |
| Clock Input Range | 10 MHz to 80 MHz (user-selectable in 100 kHz increments) |
| Interface | Ethernet GUI |
| Max Channels per Unit | 64 |
| Compliance | RoHS, CE, FCC Class A |
| Brand | Ocean Optics |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | HRS-5A |
| Pricing | Available Upon Request |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF35 CT + ZoomScan |
| Max. Sample Rotation Radius | 260 mm |
| Max. Sample Height | 800 mm |
| Max. CT Scan Volume | 510 mm × 600 mm |
| Max. Payload | 27 kg |
| Motion Axes | 7 (standard), 8 (optional) |
| X-ray Source | 190 kV water-cooled microfocus tube, 225 kV refraction tube (dual-source optional) |
| Detector | CsI scintillator-based, multiple configurations available |
| Minimum Detectable Feature Size | 150 nm |
| ZoomScan Resolution Enhancement | 5×–10× vs. conventional CT |
| Scanning Modes | Full-volume CT, ROI-CT, FlexCenter + ZoomScan hybrid |
| Calibration Features | Focus drift auto-correction, ring artifact correction, noise calibration, beam hardening correction (material-specific), metal scatter correction, ScatterFix 2.0, automatic voxel segmentation |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | Cougar EVO |
| Detector Type | Flat-Panel Digital Detector (42 × 42 mm FOV) |
| Max. Geometric Magnification | 2000× |
| Gray Levels | 65,000 |
| Display | 20" LCD Monitor |
| Max. Sample Dimensions | 440 × 550 mm |
| Max. Inspection Area | 310 × 310 mm |
| Motion Axes | X/Y Translation, X-ray Tube Z-Adjustment, Detector Z-Adjustment, Detector Tilt (±72.5°), Optional Rotary Stage (360°), Optional Manual Sample Tilt/Rotate (±30°) |
| CT Acquisition Time | ≤3 min per scan |
| Spatial Resolution (2D) | <1.0 µm |
| Software | FGUI with CNC Automation, BGA Void Analysis, and μCT Reconstruction Engine |
| Upgrade Path | Field-upgradable to full micro-CT capability |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PlasmaEtch |
| Pricing | Available Upon Request |
| Brand | OAI |
|---|---|
| Origin | USA |
| Model | MODEL 800MBA |
| Exposure Modes | Proximity, Soft Contact, Hard Contact, Vacuum Contact |
| Maximum Mask Size | 9" × 9" (228.6 mm × 228.6 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Light Source Type | High-Uniformity Broadband UV Lamp System |
| Alignment Accuracy | ≤ ±0.5 µm (typical, with optional auto-alignment upgrade) |
| Baseplate Thermal Stability | < ±0.1 °C over 4 hours |
| Compliance | ASTM F39–22 (Photolithography Equipment), ISO 14644–1 Class 5 Cleanroom Compatible |
| Brand | Royce |
|---|---|
| Origin | USA |
| Model | Royce 650 |
| Compliance | MIL-STD-883, MIL-STD-750, ASTM F1269, JESD22-B116, JESD22-B117, CE, RoHS |
| Sample Stage | 305 × 155 mm |
| X/Y Resolution | 1 µm |
| Z Resolution | 0.1 µm |
| System Accuracy | ±0.1% |
| Repeatability (25 µm move) | <1 µm |
| Max Shear Force Capacity | 200 kgf |
| Integrated Industrial PC | Yes (DVD±RW, USB, Ethernet) |
| Motorized Microscope Height Adjustment | Yes |
| Cold LED Fiber-Optic Illumination | Yes |
| Test Curve Plotting & Wire Arc Height Measurement | Yes |
| Brand | Teltec Semiconductor Pacific Limited |
|---|---|
| Origin | Hong Kong |
| Model | RIE-ICP FA System |
| Configuration | RIE/PE and ICP dual-mode plasma etching platform |
| Wafer Compatibility | Up to 300 mm |
| Etch Modes | Reactive Ion Etching (RIE), Plasma Enhanced (PE), Inductively Coupled Plasma (ICP) |
| Process Flexibility | Anisotropic and isotropic etching capability |
| Target Materials | SiO₂, Si₃N₄, poly-Si, Al, Cu, low-k dielectrics, PI (polyimide), TEOS-based films |
| Application Domain | Failure Analysis (FA), Cross-sectioning, Delayering, Package-level and Die-level deprocessing |
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