Angstrom Sciences Backing Plates for Sputtering Targets

Overview

Angstrom Sciences Backing Plates are precision-engineered mechanical support components designed for integration with sputtering targets in DC, RF, and magnetron sputter deposition systems. Unlike consumable targets, backing plates serve a critical structural and thermal management function—providing uniform mechanical support, enabling efficient heat dissipation from the target surface during high-power plasma operation, and ensuring consistent cathode assembly integrity under vacuum cycling and thermal stress. Constructed from high-conductivity, non-magnetic, ultra-low-outgassing materials (typically oxygen-free copper or specialized stainless steel alloys), these plates are manufactured to tight dimensional tolerances (±0.05 mm flatness, ±0.1 mm thickness control) and feature precisely machined coolant channel interfaces, mounting hole patterns, and surface finishes compatible with industry-standard target bonding methods (e.g., indium soldering, epoxy bonding, or mechanical clamping).

Key Features

• High thermal conductivity substrate (e.g., OFE copper per ASTM B170) optimized for rapid heat transfer away from the sputtering surface
• Ultra-smooth, vacuum-compatible surface finish (Ra ≤ 0.8 µm) minimizing particle generation and facilitating reliable target bonding
• Customizable geometry—including round, rectangular, and annular configurations—with diameters up to 600 mm and thicknesses from 6 mm to 25 mm
• Optional integrated features: precision-machined coolant grooves, O-ring sealing grooves, alignment dowel holes, and vacuum flange compatibility (CF, ISO-KF, or custom)
• Surface passivation and cleaning per SEMI F21 and ASTM E1559 standards; packaged under dry nitrogen or argon to prevent oxidation prior to installation
• Traceable documentation including material certification (MTR), dimensional inspection reports, and outgassing test data (per ASTM E595)

Sample Compatibility & Compliance

These backing plates are engineered for universal compatibility with sputtering targets across all major material classes supplied by Angstrom Sciences—including precious metals (Au, Pt, Pd, Ir, Rh), refractory metals (W, Mo, Ta), transition metals (Cu, Ni, Cr, Ti), oxides (ITO, SiO₂, Al₂O₃), nitrides (TiN, Si₃N₄), and complex multi-layer targets. They meet mechanical interface requirements for leading OEM sputter coaters (e.g., Denton, Kurt J. Lesker, AJA International, ULVAC). All plates comply with vacuum safety standards for UHV applications (<1×10⁻⁹ Torr base pressure), conform to RoHS Directive 2011/65/EU, and support GLP/GMP-compliant thin-film process validation through full traceability and controlled manufacturing records.

Software & Data Management

While backing plates themselves are passive hardware components, their specifications are fully integrated into Angstrom Sciences’ Target Configuration Database—a secure, web-accessible platform used by customers to define target/backing plate pairings for process replication. Each plate is assigned a unique serial number linked to its dimensional report, thermal conductivity verification, and packaging log. This enables seamless alignment with QC/QA workflows requiring audit-ready documentation per ISO 9001:2015 and FDA 21 CFR Part 11–compliant electronic record retention where applicable.

Applications

• Thin-film fabrication for semiconductor interconnects, MEMS sensors, and photovoltaic absorber layers
• High-resolution TEM/SEM sample preparation via conductive metal coating (e.g., Au/Pd, Pt, Cr)
• Optical coating stacks requiring precise thermal stability during reactive sputtering (e.g., TiO₂/SiO₂ AR coatings)
• Research-scale functional oxide deposition (e.g., YBCO, LSCO) where thermal runaway must be avoided
• Industrial roll-to-roll sputtering systems demanding long-term mechanical reliability under continuous duty cycles

FAQ

What is the standard surface finish specification for Angstrom Sciences backing plates?

Standard finish is Ra ≤ 0.8 µm; tighter finishes (Ra ≤ 0.4 µm) are available upon request with additional metrology reporting.
Do you offer thermal expansion matching services for composite target assemblies?

Yes—we provide CTE-matched backing plate materials (e.g., CuMo, CuW) for high-temperature or pulsed-power applications where differential expansion could compromise bond integrity.
Can backing plates be reused after target replacement?

Reusability depends on prior usage conditions; we recommend inspection for warpage (>0.1 mm deviation), surface pitting, or coolant channel fouling before reuse. Refinishing services are available.
Are custom coolant port configurations supported?

Yes—standard NPT, BSP, or metric threaded ports are offered; non-standard geometries (e.g., manifold-integrated inlets) can be quoted with CAD submission.
What documentation accompanies each shipment?

Each order includes a Certificate of Conformance, dimensional inspection report, material test report (MTR), and inert-gas packaging verification log.