Other Brands OK-TH Series Compact Environmental Test Chamber for Temperature & Humidity Cycling

Overview

The OK-TH Series Compact Environmental Test Chamber is an engineered solution for precise, repeatable simulation of temperature and humidity stress conditions in laboratory and industrial quality assurance environments. Designed around a dual-stage refrigeration architecture and high-fidelity PID-controlled humidification system, this chamber operates on the principle of forced-air convection with integrated steam-based humidification and direct-expansion cooling. It enables controlled exposure of electronic components, aerospace subsystems, automotive ECUs, polymer packaging, and coated materials to defined thermal-hygric profiles—supporting accelerated life testing, qualification validation, and environmental screening per internationally recognized standards. Its compact footprint (starting at 80 L internal volume) makes it suitable for space-constrained QC labs while maintaining full compliance with military, industrial, and regulatory test protocols.

Key Features

• High-precision color touchscreen controller with intuitive bilingual (English/Chinese) interface, supporting real-time data logging, profile programming, and alarm history recall.
• Double-layer high-tensile silicone gasket sealing between door and chamber body ensures leak-tight integrity and minimizes thermal bridging during extreme low-temperature operation down to –70°C.
• Multi-layer vacuum-insulated observation window with embedded conductive film heating prevents condensation and enables unobstructed visual monitoring under all humidity conditions.
• Stainless steel (SUS#304) construction throughout interior and exterior surfaces provides corrosion resistance, non-outgassing performance, and compatibility with cleanroom and GLP-compliant facilities.
• Standard 50 mm diameter cable port (left-side mounted) allows external signal/power feedthrough without compromising chamber seal integrity or thermal uniformity.
• Integrated safety architecture includes independent over-temperature, over-humidity, compressor high-pressure, and phase-failure detection—triggering immediate shutdown and on-screen fault code display.

Sample Compatibility & Compliance

The OK-TH chamber accommodates samples up to 100 × 100 × 100 cm (OK-TH-1000 model), with adjustable stainless steel shelves and leveling casters for stable placement. Its thermal-hygric performance meets the stringent spatial uniformity and temporal stability requirements of MIL-STD-810G Method 501.5 (high temperature), 502.5 (low temperature), and 507.5 (humidity); IEC 60068-2-1 (cold), -2 (dry heat), -30 (cyclic damp heat), and -78 (steady-state damp heat); as well as GB/T 2423.1–4 series for China domestic certification. All control firmware and data handling workflows are structured to support audit readiness for ISO/IEC 17025 accredited laboratories and FDA-regulated environments requiring traceable parameter verification.

Software & Data Management

The embedded controller supports export of time-stamped temperature/humidity logs in CSV format via USB port. Optional PC-based software (OK-Link Suite) provides remote monitoring, multi-chamber synchronization, statistical process control (SPC) charting, and automated report generation compliant with 21 CFR Part 11 requirements—including electronic signature capability, user access levels, and immutable audit trails. Data retention follows GLP principles: all setpoint changes, alarm events, and calibration adjustments are timestamped and archived with operator ID linkage.

Applications

• Electronics reliability testing: solder joint fatigue, conformal coating adhesion, PCB delamination under thermal cycling with humidity bias.
• Aerospace component qualification: avionics housing integrity, sensor drift characterization across –55°C to +125°C with 85% RH hold.
• Automotive electronics validation: ECU thermal shock resistance per ISO 16750-4, battery module moisture ingress simulation.
• Pharmaceutical packaging stability: blister pack permeability assessment under ICH Q1A(R3) long-term and accelerated storage conditions.
• Polymer aging studies: tensile strength degradation kinetics of elastomers exposed to 40°C/93% RH for 1000+ hours.
• Coating and paint evaluation: ASTM D714 blister rating after cyclic exposure to 60°C/95% RH → –25°C transitions.

FAQ

What temperature and humidity ranges are standard, and which configurations require optional specification?
Standard configuration covers –20°C to +150°C and 20–98% RH. Extended low-temperature options (–40°C and –70°C) and enhanced humidity range (5–98% RH) are available as factory-configured options—subject to additional lead time and validation documentation.
Is the chamber compatible with automated test sequencing and integration into existing MES or LIMS platforms?
Yes—via Modbus RTU (RS-485) or optional Ethernet/IP interface, the controller supports bidirectional communication for setpoint synchronization, status polling, and event-triggered data push to upstream systems.
How is calibration traceability maintained, and what documentation is provided upon delivery?
Each unit ships with a NIST-traceable calibration certificate covering temperature (–70°C to +150°C) and humidity (20–98% RH) at three points, performed using accredited reference standards. Full calibration procedure documentation and uncertainty budgets are included.
Can the chamber be operated continuously for extended qualification tests exceeding 1000 hours?
Yes—the dual-stage refrigeration system, redundant fan motor design, and continuous-duty compressors are rated for uninterrupted operation under full load. Preventive maintenance intervals are specified at 500 operating hours for filter replacement and 2000 hours for refrigerant charge verification.
Are custom internal dimensions or specialized mounting fixtures available?
Yes—OEM mechanical integration services include bespoke internal rack systems, vibration-isolated sample platforms, and modified port configurations (e.g., multiple 30 mm feedthroughs), subject to structural validation and thermal uniformity requalification.