DRETOP TBJ-180 Class 100 Cleanroom Drying Oven
| Brand | DRETOP |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic |
| Model | TBJ-180 |
| Temperature Range | RT+25°C to 300°C |
| Temperature Uniformity | ±2.5% |
| Temperature Fluctuation | ±1°C |
| Internal Chamber Dimensions (W×D×H) | 600×500×600 mm |
| Chamber Volume | 180 L |
| Control System | Color Touchscreen with PID Auto-Tuning |
| Heating Method | Forced Convection with Positive-Pressure Air Circulation |
| Chamber Material | 316 Stainless Steel |
| Filtration | H14 HEPA Filter (99.995% @ 0.3 µm) |
| Cleanroom Classification | ISO 14644-1 Class 5 (FS209E Class 100) |
| Power Supply | AC 220 V / 50 Hz |
| Rated Power | 3.5 kW |
| Operating Ambient Temperature | 0–40°C |
| Safety Features | Over-Temperature Cut-off, Phase-Loss Detection, Fan Overheat Protection, Leakage Current Protection, Fault Code Diagnostics |
| Compliance | ISO 14644-1, SEMI S2, GMP-Ready Architecture with Audit Trail & User Permission Levels |
Overview
The DRETOP TBJ-180 Class 100 Cleanroom Drying Oven is an engineered solution for thermal processing in controlled environments where particulate contamination must be rigorously constrained. Unlike conventional drying ovens that rely on static air or unfiltered convection, the TBJ-180 integrates a continuously monitored, positive-pressure laminar airflow system with certified H14 high-efficiency particulate air (HEPA) filtration—ensuring sustained ISO 14644-1 Class 5 (formerly FS209E Class 100) cleanliness during operation and idle states. Its core principle centers on dynamic particle exclusion: internal recirculation passes air through heated stainless-steel ducts and multi-stage filtration before reintroduction into the chamber at uniform velocity, preventing sedimentation and eliminating “clean-but-static” degradation common in legacy systems. Designed for semiconductor wafer pre-bake, photoresist hardbake, optical component low-oxygen drying, and sterile pharmaceutical intermediate handling, the TBJ-180 bridges the functional gap between standard laboratory ovens and cleanroom-grade process tools—without requiring integration into full cleanroom infrastructure.
Key Features
- ISO 14644-1 Class 5-certified chamber environment maintained actively during heating cycles and standby via continuous H14 HEPA filtration (99.995% efficiency at 0.3 µm) and real-time pressure monitoring;
- 316 stainless-steel seamless inner chamber fabricated using full-perimeter argon arc welding—corrosion-resistant, non-shedding, and compatible with IPA, acetone, and low-concentration acid vapor exposure;
- Forced convection system with forward-curved centrifugal blower and spiral baffle airflow path, generating stable positive pressure (>15 Pa) to suppress external ingress and ensure uniform temperature distribution (±2.5% across chamber volume);
- Intelligent touchscreen controller with embedded PID auto-tuning, programmable ramp-soak profiles, event-triggered data logging, and configurable user permissions (Level 1–3) aligned with FDA 21 CFR Part 11 Annex 11 expectations;
- Comprehensive safety architecture including dual independent over-temperature cutoffs (mechanical and electronic), phase-loss detection, fan motor thermal protection, earth-leakage circuit interruption, and fault-code-based diagnostics displayed directly on interface;
- Modular I/O options: RS-485 Modbus RTU for MES/SCADA integration, USB port for audit trail export (operator ID, timestamp, setpoint history, alarm logs), and optional Ethernet-enabled remote supervision.
Sample Compatibility & Compliance
The TBJ-180 accommodates substrates and components up to 15 kg per shelf (customizable to ≥25 kg), including silicon wafers (200 mm/300 mm), lithium niobate crystals, fused silica optics, CMOS image sensors, and lyophilized biopharmaceutical intermediates. Its inert 316SS chamber and absence of organic gaskets or painted surfaces eliminate outgassing risks critical for photolithography and sterile API drying. The system conforms to ISO 14644-1:2015 (Class 5), SEMI S2-0218 (safety guidelines for semiconductor equipment), and supports GLP/GMP validation protocols—including IQ/OQ/PQ documentation templates, calibration traceability to NIST standards, and electronic audit trail generation compliant with ALCOA+ principles.
Software & Data Management
The embedded control firmware records all operational parameters at 1-second intervals—including chamber temperature (dual RTD redundancy), filter differential pressure, blower RPM, door status, and user authentication events. Data is stored locally in encrypted binary format and exportable via USB as CSV or PDF reports with digital signature capability. Optional software modules provide automated report generation per USP , trend analysis of temperature deviation over time, and role-based access control (RBAC) for SOP-driven workflows. All changes to setpoints or programs are logged with operator ID, timestamp, and reason-for-change field—meeting FDA 21 CFR Part 11 requirements for electronic records and signatures.
Applications
- Semiconductor fabrication: Pre-deposition bake, post-spin coat soft-bake and hard-bake, post-etch resist stripping, and wafer-level packaging moisture removal;
- Optoelectronics: Anti-reflective coating curing, lens element stress-relief annealing, and fiber optic ferrule drying under inert atmosphere compatibility;
- Pharmaceutical R&D: Sterile active pharmaceutical ingredient (API) tray drying, excipient moisture profiling, and stability study sample conditioning per ICH Q1A(R2);
- Advanced materials research: Graphene oxide reduction, MOF solvent removal, and perovskite precursor film annealing in low-particulate thermal environments;
- Medical device manufacturing: Catheter polymer drying, sensor die attachment curing, and implant-grade metal sintering support under validated thermal profiles.
FAQ
What cleanroom classification does the TBJ-180 maintain during operation?
It sustains ISO 14644-1 Class 5 (equivalent to FS209E Class 100) with continuous H14 filtration and positive-pressure airflow—verified per ISO 14644-3 Annex B protocols.
Is the chamber suitable for oxygen-sensitive processes?
While not a vacuum or inert-gas purged system, its sealed construction and rapid air exchange rate (<60 sec half-life) enable effective ambient oxygen displacement when paired with nitrogen purge kits (optional accessory).
Can the TBJ-180 be qualified for GMP production use?
Yes—it supports full qualification (IQ/OQ/PQ), includes factory calibration certificates traceable to national standards, and provides electronic audit trails meeting 21 CFR Part 11 and EU Annex 11 requirements.
Does it support multi-step thermal profiles with hold times?
Yes—the controller allows up to 32 segments per program, including ramp rates (°C/min), soak durations (1 min to 9999 min), and conditional branching based on temperature thresholds.
How is temperature uniformity validated across the chamber?
Uniformity is confirmed using 9-point thermocouple mapping per ASTM E2203, with results documented in the OQ report; typical deviation remains within ±2.5% of setpoint at 200°C steady state.
