DRETOP UVG-DS20-90 High-Vacuum Gradient Drying Oven
| Brand | DRETOP |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic |
| Model | UVG-DS20-90 |
| Instrument Type | Vacuum Drying Oven |
| Temperature Range | RT+10°C to 250°C |
| Temperature Uniformity | ±0.5°C |
| Internal Chamber Dimensions | 450 × 450 × 450 mm |
| Temperature Resolution | 0.1°C |
| Operating Ambient Temperature | 5–45°C |
| Chamber Material | 304 Stainless Steel |
| Heating Method | Four-Side External Heating |
| Ultimate Vacuum Level | ≤133 Pa |
| Power Supply | AC 220 V, 50 Hz |
| Rated Power | 1600 W |
| Timer Range | 1–9999 min |
| Safety Protections | Over-temperature alarm, overheat cutoff, short-circuit protection, leakage current protection, power-failure data retention |
Overview
The DRETOP UVG-DS20-90 High-Vacuum Gradient Drying Oven is an engineered solution for controlled thermal processing under reduced-pressure environments. It operates on the fundamental principle of vacuum-assisted drying: by evacuating ambient air via a compatible vacuum pump (e.g., oil-sealed rotary vane or corrosion-resistant diaphragm type), the system lowers the partial pressure of water vapor and volatile solvents—thereby reducing their boiling points and enabling moisture removal at significantly lower temperatures than atmospheric drying. This mechanism preserves thermally labile compounds, prevents oxidative degradation, and eliminates surface oxidation or carbonization commonly observed in conventional convection ovens. The UVG-DS20-90 is specifically configured for high-reproducibility gradient drying protocols where precise vacuum-level staging and temperature ramping are critical—such as solvent removal from battery electrode slurries, residual moisture elimination in semiconductor packaging substrates, or stabilization of lyophilized biopharmaceutical intermediates.
Key Features
- Four-side external heating architecture ensures uniform thermal distribution across the 90 L stainless steel chamber (450 × 450 × 450 mm internal volume), minimizing hot spots and enhancing batch consistency.
- Microprocessor-based PID temperature controller with 0.1°C resolution and ±0.5°C stability over the full operating range (RT+10°C to 250°C), compliant with ISO 17025 calibration traceability requirements.
- Integrated self-diagnostic firmware displays real-time fault codes on the large backlit LCD interface, enabling rapid troubleshooting without external service tools.
- Dual-stage mechanical door lock with zinc-alloy handle and fluorosilicone gasket delivers leak-tight sealing performance down to ≤133 Pa, verified per ASTM E595 outgassing specifications for cleanroom-compatible applications.
- Comprehensive safety suite includes independent over-temperature cut-off, ground-fault circuit interruption (GFCI), thermal fuse backup, and non-volatile memory retention for setpoints and timer values after power interruption.
- Electrostatically coated carbon steel exterior and electropolished 304 stainless steel interior resist corrosion, facilitate cleaning validation (per FDA 21 CFR Part 11 Annex 11), and support repeated autoclave-compatible wipe-downs.
Sample Compatibility & Compliance
The UVG-DS20-90 accommodates diverse sample formats—including wafers, pouch cells, ceramic substrates, polymer films, powdered APIs, and biological tissue sections—without mechanical agitation or airflow-induced displacement. Its vacuum chamber design eliminates convective heat transfer, making it suitable for fragile, low-density, or electrostatically sensitive materials. The unit meets key regulatory prerequisites for GMP/GLP environments: temperature uniformity and stability conform to USP and ISO 20538 for drying process validation; vacuum integrity supports IEC 61000-4-30 immunity testing prep; and optional RS485/Modbus RTU integration enables audit-ready data logging aligned with 21 CFR Part 11 electronic record requirements. Optional inert gas purging (N₂ or Ar) via front-panel-mounted mass flow-controlled inlet further extends compatibility with oxygen-sensitive catalysts or pyrophoric nanomaterials.
Software & Data Management
While the base configuration features a standalone microcontroller with programmable ramp-soak profiles and real-time parameter display, the UVG-DS20-90 supports seamless upgrade to DRETOP’s proprietary TouchControl™ software suite (optional P-series or VT-series color touchscreen). This platform provides synchronized vacuum-pressure vs. temperature trajectory plotting, automated pass/fail criteria evaluation against user-defined limits, CSV export with UTC timestamps, and configurable alarm escalation (email/SMS via Ethernet gateway). All logged datasets include operator ID, instrument serial number, environmental sensor readings (ambient temp/humidity), and digital signature fields—fully satisfying ALCOA+ data integrity principles for regulated QC laboratories.
Applications
- Semiconductor manufacturing: Pre-bake of photoresist-coated wafers, desorption of adsorbed H₂O from SiC substrates prior to epitaxial growth.
- Lithium-ion battery R&D: Solvent recovery from NMP-based cathode slurries, moisture control in dry rooms for cell assembly.
- LED & optoelectronics: Degassing of encapsulant resins, post-cure stabilization of phosphor-coated chips.
- Pharmaceutical development: Residual solvent removal from sterile-filtered injectables, thermal stabilization of monoclonal antibody formulations.
- Materials science: Dehydroxylation of metal-organic frameworks (MOFs), activation of porous carbons, and controlled pyrolysis of polymer precursors.
- Environmental testing labs: Gravimetric moisture analysis of soil/sediment samples per ASTM D2216 and EPA Method 5035A.
FAQ
What vacuum level is achievable with the standard configuration?
The UVG-DS20-90 achieves ≤133 Pa using a compatible 20 m³/h rotary vane pump (e.g., DRETOP V-20 series); optional high-efficiency diaphragm pumps (VGM-16) maintain ≤5 Pa for extended hold times.
Can inert gas be introduced during drying cycles?
Yes—via optional integrated mass-flow-controlled N₂/Ar inlet (part no. IG-VALVE-UVG), supporting purge-and-fill sequences and maintaining positive pressure during venting.
Is the chamber suitable for acidic or halogenated solvent exposure?
The 304 stainless steel chamber and fluorosilicone seals resist mild organic solvents; for aggressive media (e.g., HF, Cl₂), specify optional 316L chamber lining and EPDM-free sealing components.
How is temperature uniformity validated?
DRETOP provides a factory-issued IQ/OQ protocol including 9-point thermocouple mapping (per ASTM E2203) and vacuum decay test reports—available upon request with NIST-traceable calibration certificates.
Does the system support remote monitoring and control?
Standard RS485 Modbus RTU interface enables integration into SCADA or LIMS platforms; Ethernet/WiFi add-on modules (DRETOP NET-IO-UVG) provide browser-based access and TLS 1.2-secured API endpoints.
