English Product Name

Overview

The KS-TH Series Rapid Temperature Change and Humidity Environmental Test Chamber is an engineered solution for accelerated environmental stress screening (ESS) of electronic components, automotive modules, aerospace subsystems, and medical devices. It operates on the principle of controlled thermal-hygrometric cycling—inducing repetitive expansion and contraction in materials through precisely timed transitions between extreme temperature and humidity setpoints. This mechanical stress accelerates latent defects—including intermetallic diffusion at solder joints, delamination in multilayer PCBs, moisture ingress in encapsulated semiconductors, and adhesive bond degradation—enabling early detection prior to field deployment. Unlike static chamber testing, this system executes dynamic ramp-and-soak profiles with programmable transition rates up to 25 °C/min and simultaneous humidity modulation from 20–98 %RH, replicating real-world operational transients such as engine bay thermal shock or tropical coastal storage conditions. Its architecture supports both single-chamber and multi-zone configurations, delivering deterministic stress application aligned with MIL-HDBK-344 and IEC 60068-2-14 test methodologies.

Key Features

• Full-color 7-inch TFT-LCD touchscreen controller with intuitive graphical interface, supporting English/Chinese language switching and real-time visualization of temperature/humidity curves, alarm logs, and system status.
• 96 preloaded test profiles compliant with GJB 150, GB/T 2423, and MIL-STD-810 standards; user-definable cycles (1–999), soak durations (up to 999 h 59 min), and ramp rate selection (5–25 °C/min).
• Dual-stage hermetically sealed refrigeration system using environmentally compliant R404A/R23 refrigerant blend, optimized for low-noise operation (<65 dB(A)) and stable sub-zero performance down to −70 °C.
• Stainless steel SUS#304 inner chamber with seamless welding, anti-corrosion insulation, and integrated condensate management system to ensure long-term reliability under high-humidity exposure.
• Standard 50 mm diameter access port on left side wall with silicone gasket seal, enabling external power feedthrough, sensor cabling, or real-time DUT monitoring without chamber interruption.
• Independent high-/low-temperature and combined thermal-hygrothermal operation modes; configurable for two-zone or three-zone thermal shock protocols per GJB 150.5.

Sample Compatibility & Compliance

The KS-TH series accommodates samples ranging from handheld consumer electronics to automotive ECUs and avionics enclosures, with internal volumes scalable from 225 L to 1000 L. Its chamber geometry ensures uniform airflow distribution and minimizes thermal gradients, validated per ISO/IEC 17025-accredited calibration procedures. The system meets structural and operational requirements of multiple international standards: GJB 150.3 (high-temperature), GJB 150.4 (low-temperature), GJB 150.9 (damp heat), GB/T 2423.1–3 (IEC 60068-2 equivalents), and GB/T 10586 (humidity chamber performance). All controllers support audit-trail logging and password-protected parameter locking—features essential for GLP/GMP-regulated environments and FDA 21 CFR Part 11-compliant validation packages.

Software & Data Management

The embedded controller records timestamped temperature and humidity data at user-selectable intervals (1 s to 60 min), storing up to 10,000 hours of continuous history in non-volatile memory. Export is supported via USB 2.0 to CSV or Excel-compatible formats for post-test statistical analysis (e.g., Cp/Cpk, Weibull failure modeling). Optional Ethernet connectivity enables remote supervision via TCP/IP, integration into centralized lab management systems (LIMS), and secure data backup to network-attached storage. Firmware updates are performed via SD card, maintaining traceability under change control SOPs.

Applications

• Accelerated life testing of printed circuit board assemblies (PCBAs) under thermal cycling and moisture bias conditions.
• Qualification of battery packs for electric vehicles per UN ECE R100 and ISO 16750-4.
• Reliability validation of optical sensors and MEMS devices exposed to tropical climatic zones.
• Process verification of conformal coating adhesion and rework solder joint integrity.
• Environmental stress screening (ESS) of military-grade connectors and backplane modules per MIL-STD-883 Method 1010.

FAQ

What is the maximum allowable sample weight per test cycle?

Maximum load capacity is determined by thermal mass and airflow obstruction—not fixed weight limits. For optimal uniformity, total DUT volume should not exceed 30% of chamber internal volume.

Can the chamber operate continuously at 98% RH above 85°C?

Yes—continuous operation at 98% RH and +85°C is supported via enhanced steam generator control and condensate purge sequencing.

Is third-party calibration certification included with delivery?

A NIST-traceable calibration certificate covering temperature and humidity sensors is provided; full ISO/IEC 17025 accreditation requires separate on-site verification.

How is refrigerant leakage monitored and reported?

Integrated pressure transducers and refrigerant-specific gas sensors trigger audible/visual alarms and automatically suspend operation upon detection of abnormal pressure decay or refrigerant concentration thresholds.

Does the controller support custom script-based test sequencing?

The standard firmware supports stepwise profile definition only; advanced scripting (e.g., conditional branching, logic gates) requires optional PC-based software add-on with API integration.