Hengyi HY-0350Z Chip Shear Testing Machine

Overview

The Hengyi HY-0350Z Chip Shear Testing Machine is a precision-engineered electromechanical universal testing system designed for high-fidelity mechanical characterization of micro-scale electronic components—particularly semiconductor chips, die-attach materials, solder joints, and thin-film interconnects—under controlled shear loading conditions. Unlike conventional tensile testers optimized for bulk materials, the HY-0350Z integrates a rigid aluminum alloy frame, high-resolution displacement feedback, and sub-millisecond closed-loop motion control to deliver repeatable, traceable shear force–displacement data in accordance with ISO/IEC 17025-compliant laboratory practices. Its core actuation architecture employs a servo-motor-driven ball-screw transmission system, enabling precise strain-rate control across six orders of magnitude (0.001–500 mm/min), critical for evaluating time-dependent behaviors such as creep resistance, interfacial adhesion degradation, and viscoelastic relaxation in packaging materials.

Key Features

• Rigid anodized aluminum frame offering long-term dimensional stability, UV resistance, and corrosion immunity—eliminating thermal drift and surface degradation over extended service life.
• DSP-based real-time control platform with 12 Mbps USB 1.1 high-speed data acquisition, supporting deterministic sampling at up to 10 kHz for dynamic event capture (e.g., brittle fracture initiation).
• Modular four-layer PCB design with optimized grounding and differential signal routing, ensuring electromagnetic compatibility (EMC) in shared lab environments with sensitive instrumentation.
• Full software-defined I/O architecture: all peripheral interfaces—including load cell, extensometer, and environmental chamber triggers—are hot-pluggable USB ports with programmable electrical characteristics via HYtest V7.0 configuration engine.
• Integrated safety triad: dual-channel electronic stroke limits, hardware-level emergency stop circuitry, and software-enforced overload cutoff (<0.1 s response time) compliant with EN ISO 13850.
• Calibration traceability path: factory-certified load cell calibration against NIST-traceable deadweight standards; optional on-site recalibration kit available per ISO 7500-1 Class 0.5 requirements.

Sample Compatibility & Compliance

The HY-0350Z accommodates standardized chip shear fixtures (e.g., JEDEC JESD22-B116 compliant shear chucks) and custom tooling for wafer-level, package-level, and board-level shear tests. It supports specimens ranging from 0.2 mm × 0.2 mm die to 25 mm × 25 mm QFN packages. All test protocols are structured to satisfy regulatory audit requirements: HYtest V7.0 implements ALCOA+ principles (Attributable, Legible, Contemporaneous, Original, Accurate, Complete, Consistent, Enduring, Available) and includes full 21 CFR Part 11-compliant electronic signatures, audit trails, and role-based access control. The system meets essential performance criteria defined in IPC-9708 (Solder Joint Strength), MIL-STD-883 Method 2011.9 (Die Shear), and AEC-Q200 stress qualification sequences for automotive electronics.

Software & Data Management

HYtest V7.0 is a domain-specific test executive built on Microsoft .NET Framework with embedded SQL Server Compact database engine. It provides native support for 9 UI languages and 6 engineering unit systems (N, kN, lbf, kgf, tonf, gf), enabling seamless multi-regional deployment without localization overhead. Test method templates are stored as XML-based scripts, allowing users to define conditional logic (e.g., “terminate test if shear force drops >15% within 50 ms”) and automated pass/fail evaluation against user-defined thresholds. Raw data streams (force, displacement, time) are saved in HDF5 format with embedded metadata (operator ID, calibration date, environmental conditions), ensuring FAIR (Findable, Accessible, Interoperable, Reusable) data stewardship. Export modules generate PDF reports conforming to ISO/IEC 17025 Annex A.2 requirements, including uncertainty budgets calculated per GUM (JCGM 100:2008).

Applications

• Qualification of die-attach adhesives (epoxy, silver sinter, transient liquid phase) under temperature-cycled shear loading.
• Intermetallic compound (IMC) growth impact assessment on Cu/SnAgCu solder joint shear strength.
• Thermal interface material (TIM) bond-line integrity verification after reflow and power cycling.
• Wire bond pull/shear strength correlation studies for Al and Cu wedge bonds.
• Reliability screening of fan-out wafer-level packages (FOWLP) subjected to mechanical shock-induced shear stress.
• Material property derivation: shear modulus (G), yield shear stress (τ_y), fracture toughness (K_IC via modified beam theory), and cohesive zone model (CZM) parameters.

FAQ

What shear test standards does the HY-0350Z natively support?
The system includes preconfigured test methods for JEDEC JESD22-B116, MIL-STD-883 Method 2011.9, IPC-9708, and ASTM F1269—each validated against reference materials and documented in the system’s IQ/OQ protocol.
Can the HY-0350Z perform combined environmental shear testing?
Yes—via optional integration with climate chambers (−65°C to +200°C) and vacuum enclosures; all environmental parameters are synchronized and logged alongside mechanical data in HYtest V7.0.
Is third-party calibration certification included?
Factory calibration certificates traceable to CNAS-accredited laboratories are provided with each unit; ISO/IEC 17025 calibration reports are available upon request.
How is data integrity ensured during long-duration creep tests?
The DSP controller maintains uninterrupted data streaming even during 72+ hour tests; power-loss recovery mode automatically resumes from last valid checkpoint with timestamped continuity flag.
Does the system support GLP/GMP audit readiness?
Yes—audit trail logs record every user action (login, parameter change, report generation), with immutable digital signatures and exportable forensic archives meeting FDA and EMA inspection requirements.