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OK-PCT Series High-Pressure Saturated Steam Aging Chamber

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Brand OK Instruments
Origin Imported
Manufacturer Type Authorized Distributor
Price USD 4,100 (FOB)
Model OK-PCT-35 / OK-PCT-45 / OK-PCT-55 / OK-PCT-65
Internal Dimensions (Φ × D) 30×45 cm / 40×55 cm / 50×55 cm / 60×65 cm
External Dimensions (W × H × D) 65×100×65 cm / 75×110×75 cm / 85×110×75 cm / 85×120×90 cm
Temperature Range 121 °C, 132 °C (143 °C optional)
Humidity 100 % RH (saturated steam)
Operating Pressure 0–2.0 kg/cm² (gauge), up to 3.0 kg/cm² on special order
Temp. Uniformity ≤ ±2 °C
Humidity Uniformity ≤ ±3 % RH
Circulation Natural convection of saturated steam
Safety Systems Low-water cutoff, overpressure relief valve, overtemperature cutout, automatic pressure interlock, dual-mode water replenishment (auto/manual), real-time pressure/temperature monitoring
Standard Accessories Two-tier stainless steel sample racks
Power Supply AC 220 V ±5 %, 50 Hz ±0.5 Hz

Overview

The OK-PCT Series High-Pressure Saturated Steam Aging Chamber is an engineered environmental test system designed for accelerated reliability evaluation under controlled high-temperature, high-humidity, and elevated-pressure conditions. It operates on the principle of saturated steam aging—exposing test specimens to pressurized, 100 % RH steam environments at precisely regulated temperatures (121 °C, 132 °C, or optionally 143 °C) and gauge pressures up to 2.0 kg/cm². This methodology replicates and accelerates moisture diffusion, hydrolytic degradation, interfacial delamination, and corrosion mechanisms commonly observed in long-term field operation—particularly critical for hermetic sealing validation, solder joint integrity assessment, and dielectric stability testing. Widely adopted in aerospace qualification (per MIL-STD-883 Method 1008), automotive electronics (AEC-Q200), semiconductor packaging (JEDEC JESD22-A102, JESD22-A110), and medical device sterilization compatibility studies, the chamber supports both developmental screening and compliance-driven accelerated life testing (ALT) protocols.

Key Features

  • Microprocessor-based PID temperature control with real-time saturation point compensation ensures stable thermal equilibrium within ±0.5 °C deviation during extended cycles.
  • Integrated pressure-temperature interlock system prevents door opening when internal pressure exceeds atmospheric by >0.05 kg/cm²; mechanical anti-blowback latching enhances sealing integrity as internal pressure rises.
  • Cylindrical stainless steel inner chamber (SUS304) conforms to ASME BPVC Section VIII Div. 1 design criteria for low-pressure vessels, eliminating condensate drip via radial steam flow geometry and thermal gradient management.
  • Optimized steam quality management: unsaturated vapor is continuously purged via a dedicated drain trap during ramp-up, ensuring ≥98 % dryness fraction at steady state per ISO 11140-1 Annex B guidelines.
  • Self-regulating water reservoir with optical level sensing enables uninterrupted operation for up to 200 hours without manual refill; dual-mode (auto/manual) replenishment supports GLP-compliant procedural documentation.
  • Front-panel LED digital controllers display and log setpoint, actual temperature, pressure, and elapsed time—synchronized to initiate timing only after thermal stabilization is confirmed (per IEC 60068-2-66 requirements).
  • Redundant safety architecture includes fusible plug thermal cutoff (150 °C), spring-loaded pressure relief valve (ASME-certified, set at 2.2 kg/cm²), and independent high-limit thermostat.

Sample Compatibility & Compliance

The OK-PCT chamber accommodates rigid and flexible substrates including PCBs, IC packages (QFN, BGA, WLP), MEMS sensors, polymer encapsulants, conformal coatings, and hermetically sealed optoelectronic modules. Its cylindrical geometry minimizes thermal shadowing and ensures uniform steam exposure across vertically stacked samples. The system complies with key industry standards for accelerated moisture resistance testing: JEDEC JESD22-A102 (Pressure Cooker Test), JESD22-A110 (HAST), IPC-9701 (Performance Classes for CCA Reliability), and ASTM F1876 (Standard Guide for Accelerated Aging of Medical Packaging). Optional data logging modules support 21 CFR Part 11-compliant electronic records, including audit trails for setpoint changes, alarm events, and cycle completion timestamps.

Software & Data Management

While the base configuration features standalone front-panel control, optional Ethernet-enabled data acquisition modules provide real-time telemetry to host PCs running OK-LogSuite™ software. This application supports configurable sampling intervals (1–60 sec), CSV export, trend charting with overlay capability, and automated pass/fail flagging against user-defined thresholds (e.g., max pressure deviation >±0.1 kg/cm²). All logged parameters—including chamber temperature, absolute pressure, water level status, and safety interlock states—are time-stamped with NTP-synchronized UTC clocks. Raw data files include embedded metadata (operator ID, test protocol ID, firmware version) to satisfy ISO/IEC 17025 traceability requirements for accredited laboratories.

Applications

  • Qualification of moisture-sensitive devices (MSL ratings per J-STD-020)
  • Evaluation of conformal coating adhesion and barrier performance under cyclic steam exposure
  • Validation of wafer-level packaging (WLP) and fan-out wafer-level packaging (FOWLP) moisture ingress resistance
  • Accelerated corrosion testing of solder alloys and copper traces in humid high-pressure environments
  • Stability assessment of biocompatible polymers and drug-eluting stent coatings
  • Reliability screening of automotive ADAS radar modules and EV battery management system (BMS) assemblies

FAQ

What pressure ranges are supported for standard configurations?

Standard models operate from ambient pressure up to 2.0 kg/cm² (gauge); 3.0 kg/cm² variants require factory modification and additional ASME nameplate certification.

Is the chamber suitable for testing non-hermetic plastic-encapsulated microcircuits (PEMs)?

Yes—JESD22-A110 HAST protocols are explicitly supported; however, MSL-1 through MSL-3 devices must be preconditioned per J-STD-020 prior to chamber loading.

How is steam dryness fraction verified and maintained?

Unsaturated vapor is vented via a thermostatically actuated purge line during temperature ramp; steady-state dryness is validated using calibrated steam quality probes per ISO 11140-1 methodology.

Can the system be integrated into a centralized lab monitoring network?

With the optional OK-NetLink module, Modbus TCP and OPC UA interfaces enable integration with LIMS, MES, and SCADA platforms for enterprise-wide test data aggregation.

What maintenance intervals are recommended for long-term reliability?

Quarterly inspection of pressure relief valve calibration, semiannual replacement of silicone door gasket (part #OK-GSK-70A), and annual verification of PID controller accuracy using NIST-traceable RTD reference standards.

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